BE891335A - Enlevement de matieres organiques pour la fabrication de circuits imprimes - Google Patents

Enlevement de matieres organiques pour la fabrication de circuits imprimes

Info

Publication number
BE891335A
BE891335A BE0/206725A BE206725A BE891335A BE 891335 A BE891335 A BE 891335A BE 0/206725 A BE0/206725 A BE 0/206725A BE 206725 A BE206725 A BE 206725A BE 891335 A BE891335 A BE 891335A
Authority
BE
Belgium
Prior art keywords
removal
manufacture
organic materials
printed circuits
printed
Prior art date
Application number
BE0/206725A
Other languages
English (en)
Inventor
F Vratny
E Kinsbron
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of BE891335A publication Critical patent/BE891335A/fr

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
BE0/206725A 1980-12-08 1981-12-03 Enlevement de matieres organiques pour la fabrication de circuits imprimes BE891335A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/214,171 US4346125A (en) 1980-12-08 1980-12-08 Removing hardened organic materials during fabrication of integrated circuits using anhydrous hydrazine solvent

Publications (1)

Publication Number Publication Date
BE891335A true BE891335A (fr) 1982-03-31

Family

ID=22798048

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/206725A BE891335A (fr) 1980-12-08 1981-12-03 Enlevement de matieres organiques pour la fabrication de circuits imprimes

Country Status (9)

Country Link
US (1) US4346125A (fr)
EP (1) EP0065977A4 (fr)
JP (1) JPS57501906A (fr)
BE (1) BE891335A (fr)
CA (1) CA1159577A (fr)
GB (1) GB2089125B (fr)
IE (1) IE52978B1 (fr)
IT (1) IT1139928B (fr)
WO (1) WO1982002116A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514893A (en) * 1983-04-29 1985-05-07 At&T Bell Laboratories Fabrication of FETs
US4606931A (en) * 1983-06-27 1986-08-19 International Business Machines Corporation Lift-off masking method
US4639290A (en) * 1985-12-09 1987-01-27 Hughes Aircraft Company Methods for selectively removing adhesives from polyimide substrates
DE69219998T2 (de) * 1991-10-31 1997-12-18 Sgs Thomson Microelectronics Verfahren zur Entfernung von Polymeren aus Sacklöchern in Halbleitervorrichtungen
US6326130B1 (en) 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
US5597983A (en) * 1994-02-03 1997-01-28 Sgs-Thomson Microelectronics, Inc. Process of removing polymers in semiconductor vias
US5472539A (en) * 1994-06-06 1995-12-05 General Electric Company Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components
US6103680A (en) * 1998-12-31 2000-08-15 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition and method for removing photoresist and/or plasma etching residues
US9056965B2 (en) * 2011-09-30 2015-06-16 Dow Global Technologies Llc Process for mixing polyvinyl chloride with a bio-based plasticizer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE627626A (fr) * 1962-01-26 1900-01-01
FR2072172A5 (fr) * 1969-12-23 1971-09-24 Ibm
US3873361A (en) * 1973-11-29 1975-03-25 Ibm Method of depositing thin film utilizing a lift-off mask
US4218283A (en) * 1974-08-23 1980-08-19 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
US4171240A (en) * 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same

Also Published As

Publication number Publication date
IE52978B1 (en) 1988-04-27
GB2089125A (en) 1982-06-16
GB2089125B (en) 1984-11-28
EP0065977A1 (fr) 1982-12-08
US4346125A (en) 1982-08-24
IE812868L (en) 1982-06-08
EP0065977A4 (fr) 1986-02-13
IT1139928B (it) 1986-09-24
IT8125474A0 (it) 1981-12-04
CA1159577A (fr) 1983-12-27
WO1982002116A1 (fr) 1982-06-24
JPS57501906A (fr) 1982-10-21

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: WESTERN ELECTRIC CY INC.

Effective date: 19991231