BE757781A - Procede perfectionne d'electroformage et dispositif pour sa mise en pratique - Google Patents

Procede perfectionne d'electroformage et dispositif pour sa mise en pratique

Info

Publication number
BE757781A
BE757781A BE757781DA BE757781A BE 757781 A BE757781 A BE 757781A BE 757781D A BE757781D A BE 757781DA BE 757781 A BE757781 A BE 757781A
Authority
BE
Belgium
Prior art keywords
perfected
implementation
electroforming process
electroforming
perfected electroforming
Prior art date
Application number
Other languages
English (en)
Inventor
H M Bond
C E Ring
Original Assignee
Minnesota Mining & Mfg
Buckbee Maers Cy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE757781A publication Critical patent/BE757781A/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/08Perforated or foraminous objects, e.g. sieves
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117Pattern shaped electrode used for patterning, e.g. plating or etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0726Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00Chemistry: electrical and wave energy
    • Y10S204/07Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
BE757781D 1969-10-22 Procede perfectionne d'electroformage et dispositif pour sa mise en pratique BE757781A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86839069A 1969-10-22 1969-10-22
US00193528A US3809642A (en) 1969-10-22 1971-10-28 Electroforming apparatus including an anode housing with a perforate area for directing ion flow towards the cathode

Publications (1)

Publication Number Publication Date
BE757781A true BE757781A (fr) 1971-04-01

Family

ID=26889098

Family Applications (1)

Application Number Title Priority Date Filing Date
BE757781D BE757781A (fr) 1969-10-22 Procede perfectionne d'electroformage et dispositif pour sa mise en pratique

Country Status (6)

Country Link
US (1) US3809642A (fr)
BE (1) BE757781A (fr)
DE (1) DE2051578A1 (fr)
FR (1) FR2065467B1 (fr)
GB (1) GB1322560A (fr)
NL (1) NL7015303A (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963588A (en) * 1975-04-21 1976-06-15 United States Steel Corporation Coalescent-jet apparatus and method for high current density preferential electroplating
US4183799A (en) * 1978-08-31 1980-01-15 Production Machinery Corporation Apparatus for plating a layer onto a metal strip
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US4359375A (en) * 1981-12-09 1982-11-16 Rca Corporation Anode assembly for electroforming record matrixes
US4478769A (en) * 1982-09-30 1984-10-23 Amerace Corporation Method for forming an embossing tool with an optically precise pattern
US4534832A (en) * 1984-08-27 1985-08-13 Emtek, Inc. Arrangement and method for current density control in electroplating
US4678545A (en) * 1986-06-12 1987-07-07 Galik George M Printed circuit board fine line plating
US4933049A (en) * 1989-04-03 1990-06-12 Unisys Corporation Cradle for supporting printed circuit board between plating manifolds
US5281325A (en) * 1992-07-02 1994-01-25 Berg N Edward Uniform electroplating of printed circuit boards
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer
US6106687A (en) * 1998-04-28 2000-08-22 International Business Machines Corporation Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate
US6251251B1 (en) 1998-11-16 2001-06-26 International Business Machines Corporation Anode design for semiconductor deposition
US6113759A (en) * 1998-12-18 2000-09-05 International Business Machines Corporation Anode design for semiconductor deposition having novel electrical contact assembly
US6261426B1 (en) 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
WO2005092043A2 (fr) * 2004-03-22 2005-10-06 Epic Research Company, Inc. Procede de fabrication de cartes de circuit imprime
US9157160B2 (en) 2013-08-22 2015-10-13 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts

Also Published As

Publication number Publication date
NL7015303A (fr) 1971-04-26
FR2065467A1 (fr) 1971-07-30
GB1322560A (en) 1973-07-04
FR2065467B1 (fr) 1974-10-11
DE2051578A1 (de) 1971-05-06
US3809642A (en) 1974-05-07

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