BE694305A - - Google Patents
Info
- Publication number
- BE694305A BE694305A BE694305DA BE694305A BE 694305 A BE694305 A BE 694305A BE 694305D A BE694305D A BE 694305DA BE 694305 A BE694305 A BE 694305A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Products (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53877066A | 1966-03-30 | 1966-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE694305A true BE694305A (US06724976-20040420-M00002.png) | 1967-07-31 |
Family
ID=24148353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE694305D BE694305A (US06724976-20040420-M00002.png) | 1966-03-30 | 1967-02-20 |
Country Status (8)
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL169260C (nl) * | 1971-04-16 | 1982-06-16 | Tam Ceramics Inc | Werkwijze om gesinterde keramische voorwerpen te vervaardigen, welke geleiders bevatten. |
DE2306236C2 (de) * | 1973-02-08 | 1982-11-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Schichtschaltungen mit leitenden Schichten auf beiden Seiten eines Keramiksubstrates |
US3999004A (en) * | 1974-09-27 | 1976-12-21 | International Business Machines Corporation | Multilayer ceramic substrate structure |
GB2103422B (en) * | 1981-07-30 | 1985-02-27 | Standard Telephones Cables Ltd | Ceramic capacitors |
EP0089550A3 (de) * | 1982-03-19 | 1984-09-26 | DRALORIC Electronic GmbH | Monolithischer Kondensator und Verfahren zu seiner Herstellung |
US4584629A (en) * | 1984-07-23 | 1986-04-22 | Avx Corporation | Method of making ceramic capacitor and resulting article |
JP2579937B2 (ja) * | 1987-04-15 | 1997-02-12 | 株式会社東芝 | 電子回路装置およびその製造方法 |
KR920006856B1 (ko) * | 1990-04-07 | 1992-08-20 | 한국과학기술연구원 | 주입전극법에 의한 다층세라믹 축전기의 제조방법 |
KR20080023303A (ko) * | 2005-05-18 | 2008-03-13 | 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 | 마이크로유체 그물구조 내 전도성 경로, 마이크로회로 및마이크로구조물의 제작 |
WO2013120908A1 (en) * | 2012-02-17 | 2013-08-22 | Sony Dadc Austria Ag | Microstructured polymer devices |
CN109511218A (zh) * | 2018-12-16 | 2019-03-22 | 天津荣事顺发电子有限公司 | 一种多层陶瓷电路板制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE631489A (US06724976-20040420-M00002.png) * | 1962-04-27 |
-
1967
- 1967-02-17 DE DEJ33027A patent/DE1301378B/de active Pending
- 1967-02-20 BE BE694305D patent/BE694305A/xx not_active IP Right Cessation
- 1967-02-22 FR FR8376A patent/FR1512995A/fr not_active Expired
- 1967-03-07 GB GB00554/67A patent/GB1178745A/en not_active Expired
- 1967-03-15 CH CH379667A patent/CH452016A/de unknown
- 1967-03-28 ES ES338549A patent/ES338549A1/es not_active Expired
- 1967-03-30 NL NL676704510A patent/NL144473B/xx not_active IP Right Cessation
- 1967-03-30 SE SE04423/67A patent/SE337856B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
ES338549A1 (es) | 1968-04-01 |
NL144473B (nl) | 1974-12-16 |
SE337856B (US06724976-20040420-M00002.png) | 1971-08-23 |
CH452016A (de) | 1968-05-15 |
FR1512995A (fr) | 1968-02-09 |
DE1301378B (de) | 1969-08-21 |
GB1178745A (en) | 1970-01-21 |
NL6704510A (US06724976-20040420-M00002.png) | 1967-10-02 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE | Patent lapsed |
Owner name: INTERNATIONAL BUSINESS MACHINES CORP. Effective date: 19840220 |