BE690534A - - Google Patents

Info

Publication number
BE690534A
BE690534A BE690534DA BE690534A BE 690534 A BE690534 A BE 690534A BE 690534D A BE690534D A BE 690534DA BE 690534 A BE690534 A BE 690534A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE690534A publication Critical patent/BE690534A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12036PN diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • Die Bonding (AREA)
  • Bipolar Transistors (AREA)
BE690534D 1965-12-07 1966-12-01 BE690534A (US20100268047A1-20101021-C00003.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US512045A US3388048A (en) 1965-12-07 1965-12-07 Fabrication of beam lead semiconductor devices

Publications (1)

Publication Number Publication Date
BE690534A true BE690534A (US20100268047A1-20101021-C00003.png) 1967-05-16

Family

ID=24037447

Family Applications (1)

Application Number Title Priority Date Filing Date
BE690534D BE690534A (US20100268047A1-20101021-C00003.png) 1965-12-07 1966-12-01

Country Status (11)

Country Link
US (1) US3388048A (US20100268047A1-20101021-C00003.png)
AT (1) AT266219B (US20100268047A1-20101021-C00003.png)
BE (1) BE690534A (US20100268047A1-20101021-C00003.png)
CH (1) CH455945A (US20100268047A1-20101021-C00003.png)
DE (1) DE1589076C3 (US20100268047A1-20101021-C00003.png)
ES (1) ES334684A1 (US20100268047A1-20101021-C00003.png)
FR (1) FR1504176A (US20100268047A1-20101021-C00003.png)
GB (1) GB1166659A (US20100268047A1-20101021-C00003.png)
IL (1) IL26908A (US20100268047A1-20101021-C00003.png)
NL (1) NL6617128A (US20100268047A1-20101021-C00003.png)
SE (1) SE325336B (US20100268047A1-20101021-C00003.png)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3506887A (en) * 1966-02-23 1970-04-14 Motorola Inc Semiconductor device and method of making same
GB1175667A (en) * 1966-04-07 1969-12-23 Associated Semiconductor Mft Improvements in the Electrodeposition of Metals using a Composite Mask
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3507756A (en) * 1967-08-04 1970-04-21 Bell Telephone Labor Inc Method of fabricating semiconductor device contact
US3658489A (en) * 1968-08-09 1972-04-25 Nippon Electric Co Laminated electrode for a semiconductor device
US3620932A (en) * 1969-05-05 1971-11-16 Trw Semiconductors Inc Beam leads and method of fabrication
US3708403A (en) * 1971-09-01 1973-01-02 L Terry Self-aligning electroplating mask
US3926747A (en) * 1974-02-19 1975-12-16 Bell Telephone Labor Inc Selective electrodeposition of gold on electronic devices
US4011144A (en) * 1975-12-22 1977-03-08 Western Electric Company Methods of forming metallization patterns on beam lead semiconductor devices
US4988412A (en) * 1988-12-27 1991-01-29 General Electric Company Selective electrolytic desposition on conductive and non-conductive substrates
WO1991014288A1 (en) * 1990-03-07 1991-09-19 Santa Barbara Research Center Magnetoresistor structure and operating method
CN111945128A (zh) * 2020-08-18 2020-11-17 江苏能华微电子科技发展有限公司 一种提高铂与衬底黏附性的方法及其产品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3287612A (en) * 1963-12-17 1966-11-22 Bell Telephone Labor Inc Semiconductor contacts and protective coatings for planar devices
US3325379A (en) * 1962-05-22 1967-06-13 Hazeltine Research Inc Method of making metallic patterns having continuous interconnections
NL134170C (US20100268047A1-20101021-C00003.png) * 1963-12-17 1900-01-01
US3274670A (en) * 1965-03-18 1966-09-27 Bell Telephone Labor Inc Semiconductor contact

Also Published As

Publication number Publication date
SE325336B (US20100268047A1-20101021-C00003.png) 1970-06-29
DE1589076C3 (de) 1980-11-06
NL6617128A (US20100268047A1-20101021-C00003.png) 1967-06-08
GB1166659A (en) 1969-10-08
DE1589076B2 (de) 1975-05-22
CH455945A (de) 1968-05-15
FR1504176A (fr) 1967-12-01
IL26908A (en) 1970-11-30
US3388048A (en) 1968-06-11
AT266219B (de) 1968-11-11
DE1589076A1 (de) 1970-03-19
ES334684A1 (es) 1967-11-01

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: WESTERN ELECTRIC CY INC.

Effective date: 19841201