BE682111A - - Google Patents
Info
- Publication number
- BE682111A BE682111A BE682111DA BE682111A BE 682111 A BE682111 A BE 682111A BE 682111D A BE682111D A BE 682111DA BE 682111 A BE682111 A BE 682111A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES98233A DE1230916B (de) | 1965-07-16 | 1965-07-16 | Vorrichtung zum metallischen Warmverbinden von Halbleiterkoerpern mit metallischen Traegern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE682111A true BE682111A (en:Method) | 1966-11-14 |
Family
ID=7521326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE682111D BE682111A (en:Method) | 1965-07-16 | 1966-06-06 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3439855A (en:Method) |
| BE (1) | BE682111A (en:Method) |
| DE (1) | DE1230916B (en:Method) |
| GB (1) | GB1119115A (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4696101A (en) * | 1985-06-07 | 1987-09-29 | Vanzetti Systems, Inc. | Method and apparatus for placing and electrically connecting components on a printed circuit board |
| US5715989A (en) * | 1996-06-04 | 1998-02-10 | Texas Instruments Incorporated | Microelectronic wire bonding using friction welding process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3197608A (en) * | 1962-01-23 | 1965-07-27 | Sylvania Electric Prod | Method of manufacture of semiconductor devices |
| US3256465A (en) * | 1962-06-08 | 1966-06-14 | Signetics Corp | Semiconductor device assembly with true metallurgical bonds |
-
1965
- 1965-07-16 DE DES98233A patent/DE1230916B/de active Pending
-
1966
- 1966-06-06 BE BE682111D patent/BE682111A/xx unknown
- 1966-07-13 US US564910A patent/US3439855A/en not_active Expired - Lifetime
- 1966-07-18 GB GB32262/66A patent/GB1119115A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1119115A (en) | 1968-07-10 |
| DE1230916B (de) | 1966-12-22 |
| US3439855A (en) | 1969-04-22 |