BE668887A - - Google Patents
Info
- Publication number
- BE668887A BE668887A BE668887A BE668887A BE668887A BE 668887 A BE668887 A BE 668887A BE 668887 A BE668887 A BE 668887A BE 668887 A BE668887 A BE 668887A BE 668887 A BE668887 A BE 668887A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/06—Riveted connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1078—Leads having locally deformed portion, e.g. for retention
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Resistance Heating (AREA)
- Manufacture Of Motors, Generators (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US392393A US3281923A (en) | 1964-08-27 | 1964-08-27 | Method of attaching leads to thin films |
Publications (1)
Publication Number | Publication Date |
---|---|
BE668887A true BE668887A (xx) | 1966-02-28 |
Family
ID=23550401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE668887A BE668887A (xx) | 1964-08-27 | 1965-08-27 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3281923A (xx) |
AT (1) | AT259669B (xx) |
BE (1) | BE668887A (xx) |
DE (1) | DE1515574A1 (xx) |
ES (1) | ES316831A1 (xx) |
GB (1) | GB1094699A (xx) |
NL (1) | NL6510551A (xx) |
SE (1) | SE302991B (xx) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3387365A (en) * | 1965-09-28 | 1968-06-11 | John P. Stelmak | Method of making electrical connections to a miniature electronic component |
US3489877A (en) * | 1966-09-23 | 1970-01-13 | Texas Instruments Inc | Method for forming brazed connections within a multilayer printed circuit board |
US3446908A (en) * | 1966-11-01 | 1969-05-27 | Sanders Associates Inc | Printed circuit terminations and methods of making the same |
US3489879A (en) * | 1967-02-09 | 1970-01-13 | Microtek Electronics Inc | Thermoswaging method for fixing pins to ceramic wafers |
US3574924A (en) * | 1968-10-28 | 1971-04-13 | North American Rockwell | Solid state repair method and means |
US3640556A (en) * | 1969-08-22 | 1972-02-08 | Moreland P Bennett | Tab welded joint and method of making |
US3753214A (en) * | 1971-06-01 | 1973-08-14 | Essex International Inc | Electrical conductors |
US4110904A (en) * | 1977-05-19 | 1978-09-05 | Allen-Bradley Company | Substrate with terminal connections and method of making the same |
US4548589A (en) * | 1982-06-28 | 1985-10-22 | Stewart-Warner Corporation | Arc tube and plastic reflector assembly method |
US4644643A (en) * | 1984-02-22 | 1987-02-24 | Kangyo Denkikiki Kabushiki Kaisha | Method of electrically interconnecting a laminated printed circuit by use of a compressed, solder-plated connector pin |
US4861944A (en) * | 1987-12-09 | 1989-08-29 | Cabot Electronics Ceramics, Inc. | Low cost, hermetic pin grid array package |
JP2748768B2 (ja) * | 1992-03-19 | 1998-05-13 | 株式会社日立製作所 | 薄膜多層配線基板およびその製造方法 |
US5548486A (en) * | 1994-01-21 | 1996-08-20 | International Business Machines Corporation | Pinned module |
US5878483A (en) * | 1995-06-01 | 1999-03-09 | International Business Machines Corporation | Hammer for forming bulges in an array of compliant pin blanks |
GB2306805A (en) * | 1995-10-30 | 1997-05-07 | Whitaker Corp | Conductive rivet electrical termination |
US5960540A (en) * | 1996-11-08 | 1999-10-05 | The Whitaker Corporation | Insulated wire with integral terminals |
JP3261098B2 (ja) * | 1998-06-16 | 2002-02-25 | 株式会社アルテクス | 端子と帯導体とより成る接続体、及び、端子と帯導体との接続方法 |
US7159289B1 (en) * | 2004-05-20 | 2007-01-09 | Ankara Industries, Inc. | Fastener forming apparatus and method for making a fastener of metal |
DE102004058691A1 (de) * | 2004-12-06 | 2006-06-14 | Robert Bosch Gmbh | Anordung einer elektrischen Verbindung und Verfahren zur Herstellung derselben |
DE102013220284A1 (de) * | 2013-10-08 | 2015-04-09 | Engeser Gmbh Innovative Verbindungstechnik | Verfahren zur Herstellung einer elektrischen Verbindung sowie Batteriezellkontakt |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2599710A (en) * | 1946-08-07 | 1952-06-10 | Albert M Hathaway | Method of making electrical wiring |
US2586854A (en) * | 1947-04-19 | 1952-02-26 | Farnsworth Res Corp | Printed circuit construction |
US2694249A (en) * | 1948-04-16 | 1954-11-16 | Kapp Robert | Manufacturing method for complex electrical and wireless apparatus |
US2610248A (en) * | 1949-01-03 | 1952-09-09 | Avco Mfg Corp | Radio frequency coupling circuit |
GB737998A (en) * | 1952-03-10 | 1955-10-05 | Elliott Brothers London Ltd | Improvements in the anchoring of pillars or wires of ductile metal in sheets or plates |
US2909833A (en) * | 1955-05-02 | 1959-10-27 | Indium Corp America | Printed circuits and method of soldering the same |
US3098287A (en) * | 1958-07-22 | 1963-07-23 | Hazeltine Research Inc | Method of assembling components on printed wiring boards |
US3098951A (en) * | 1959-10-29 | 1963-07-23 | Sippican Corp | Weldable circuit cards |
US3221386A (en) * | 1960-07-07 | 1965-12-07 | Ohmega Lab | Method of making an electrical device comprising a glass capsule and a wire lead fused therein |
US3076165A (en) * | 1960-09-06 | 1963-01-29 | Amerline Corp | Bobbin and terminal lug construction for use with printed circuits |
US3213325A (en) * | 1962-10-05 | 1965-10-19 | Litton Prec Products Inc | Weldable terminal |
-
1964
- 1964-08-27 US US392393A patent/US3281923A/en not_active Expired - Lifetime
-
1965
- 1965-07-23 AT AT680065A patent/AT259669B/de active
- 1965-08-12 NL NL6510551A patent/NL6510551A/xx unknown
- 1965-08-19 DE DE19651515574 patent/DE1515574A1/de active Pending
- 1965-08-25 GB GB36551/65A patent/GB1094699A/en not_active Expired
- 1965-08-26 ES ES0316831A patent/ES316831A1/es not_active Expired
- 1965-08-27 SE SE11238/65A patent/SE302991B/xx unknown
- 1965-08-27 BE BE668887A patent/BE668887A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
NL6510551A (xx) | 1966-02-28 |
DE1515574A1 (de) | 1969-09-18 |
AT259669B (de) | 1968-01-25 |
SE302991B (xx) | 1968-08-12 |
ES316831A1 (es) | 1965-12-16 |
GB1094699A (en) | 1967-12-13 |
US3281923A (en) | 1966-11-01 |