BE663890A - - Google Patents

Info

Publication number
BE663890A
BE663890A BE663890DA BE663890A BE 663890 A BE663890 A BE 663890A BE 663890D A BE663890D A BE 663890DA BE 663890 A BE663890 A BE 663890A
Authority
BE
Belgium
Prior art keywords
diodes
rectifier
bridge rectifier
support
diode
Prior art date
Application number
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE663890A publication Critical patent/BE663890A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
BE663890D 1964-05-15 BE663890A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36770464A 1964-05-15 1964-05-15

Publications (1)

Publication Number Publication Date
BE663890A true BE663890A (enrdf_load_stackoverflow)

Family

ID=23448262

Family Applications (1)

Application Number Title Priority Date Filing Date
BE663890D BE663890A (enrdf_load_stackoverflow) 1964-05-15

Country Status (1)

Country Link
BE (1) BE663890A (enrdf_load_stackoverflow)

Similar Documents

Publication Publication Date Title
CA2290801C (fr) Dispositif electronique de puissance
FR2700416A1 (fr) Dispositif à semiconducteurs comportant un élément semiconducteur sur un élément de montage.
FR2710190A1 (fr) Module pour dispositif à semi-conducteur à haute puissance avec une résistance thermique faible et une fabrication simplifiée.
FR2659177A1 (fr) Capteur de courant pour un declencheur electronique d'un disjoncteur electrique.
EP2643921A1 (fr) Architecture de modules electroniques de puissance interconnectes pour une machine electrique tournante et machine electrique tournante comprenant une telle architecture
FR2535898A3 (fr) Module de transistor de puissance
FR2824180A1 (fr) Module de condensateur et dispositif semi-conducteur utilisant le module de condensateur
FR2826544A1 (fr) Cadre en matiere plastique destine au montage d'un appareil de commande electronique a courant fort
EP2643919A1 (fr) Procede d'interconnexion de modules electroniques de puissance d'une machine electrique tournante et assemblage de modules de puissance interconnectes obtenu par ce procede
FR3098078A1 (fr) Circuit imprimé et procédé pour la mesure de la température dans un connecteur électrique de puissance
EP0037301A2 (fr) Boîtier d'encapsulation pour module de puissance en circuit hybride
EP1586122A2 (fr) Module photovoltaique comportant des bornes de connexion avec l exterieur
FR2541824A1 (fr) Dispositif de puissance a semi-conducteur constitue par une multiplicite d'elements semblables montes en parallele
FR3038144A1 (fr) Module de stockage d'energie electrique
FR2503526A1 (fr) Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.
FR2732509A1 (fr) Boitier de montage d'une puce de circuit integre
FR2616595A1 (fr) Cosse de connexion
BE663890A (enrdf_load_stackoverflow)
EP0179714B1 (fr) Procédé de montage de deux composants semiconducteurs dans un boîtier commun, et dispositif obtenu par ce procédé
FR2516311A1 (fr) Socle pour le montage d'une pastille semi-conductrice sur l'embase d'un boitier d'encapsulation, et procede de realisation de ce socle
EP0446125A1 (fr) Composant semi-conducteur de puissance
FR2618944A1 (fr) Dispositif a semi-conducteur encapsule dans un boitier comprenant un support metallique et un corps en resine synthetique
WO2021228767A1 (fr) Module electrique avec surmoulage et systemes comprenant un tel module electrique
FR2653594A1 (fr) Boitier a traversees pour courant eleve et son procede de fabrication.
BE898061A (fr) Montage formant radiateur de chaleur pour dispositifs semiconducteurs.