BE656095A - - Google Patents

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Publication number
BE656095A
BE656095A BE656095DA BE656095A BE 656095 A BE656095 A BE 656095A BE 656095D A BE656095D A BE 656095DA BE 656095 A BE656095 A BE 656095A
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BE
Belgium
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Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of BE656095A publication Critical patent/BE656095A/xx

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49558Insulating layers on lead frames, e.g. bridging members
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2924/097Glass-ceramics, e.g. devitrified glass
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    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Insulated Conductors (AREA)
BE656095D 1962-07-27 1964-11-23 BE656095A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB28975/62A GB1026164A (en) 1962-07-27 1962-07-27 Improvements in or relating to mountings for semi-conductor devices
GB46211/63A GB1027608A (en) 1962-07-27 1963-11-22 Crystal rectifiers and mountings therefor

Publications (1)

Publication Number Publication Date
BE656095A true BE656095A (en) 1965-05-20

Family

ID=26259671

Family Applications (2)

Application Number Title Priority Date Filing Date
BE635453D BE635453A (en) 1962-07-27
BE656095D BE656095A (en) 1962-07-27 1964-11-23

Family Applications Before (1)

Application Number Title Priority Date Filing Date
BE635453D BE635453A (en) 1962-07-27

Country Status (5)

Country Link
BE (2) BE656095A (en)
CH (1) CH418465A (en)
DE (1) DE1274737B (en)
GB (2) GB1026164A (en)
NL (2) NL6413572A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3855606A (en) * 1971-12-23 1974-12-17 Licentia Gmbh Semiconductor arrangement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE896392C (en) * 1951-11-13 1953-11-12 Licentia Gmbh Housing for an electrically asymmetrically conductive system of the crystal type
US2799814A (en) * 1953-09-01 1957-07-16 Sylvania Electric Prod Germanium photodiode
BE534031A (en) * 1953-12-12
BE589773A (en) * 1959-04-15 1900-01-01

Also Published As

Publication number Publication date
BE635453A (en) 1900-01-01
CH418465A (en) 1966-08-15
DE1274737B (en) 1968-08-08
NL295904A (en) 1900-01-01
NL6413572A (en) 1965-05-24
GB1027608A (en) 1966-04-27
GB1026164A (en) 1966-04-14

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