BE634737A - - Google Patents

Info

Publication number
BE634737A
BE634737A BE634737DA BE634737A BE 634737 A BE634737 A BE 634737A BE 634737D A BE634737D A BE 634737DA BE 634737 A BE634737 A BE 634737A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE634737A publication Critical patent/BE634737A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00—Thyristors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
BE634737D 1962-07-27 BE634737A (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US212974A US3274460A (en) 1962-07-27 1962-07-27 Controlled rectifier comprising a resistive plating interconnecting adjacent n and p layers

Publications (1)

Publication Number Publication Date
BE634737A true BE634737A (en:Method) 1900-01-01

Family

ID=22793196

Family Applications (1)

Application Number Title Priority Date Filing Date
BE634737D BE634737A (en:Method) 1962-07-27

Country Status (5)

Country Link
US (1) US3274460A (en:Method)
BE (1) BE634737A (en:Method)
ES (1) ES289957A1 (en:Method)
GB (1) GB981270A (en:Method)
NL (1) NL294340A (en:Method)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3297921A (en) * 1965-04-15 1967-01-10 Int Rectifier Corp Controlled rectifier having shunted emitter formed by a nickel layer underneath an aluminum layer
SE311701B (en:Method) * 1966-07-07 1969-06-23 Asea Ab
GB1144917A (en) * 1966-12-02 1969-03-12 Ass Elect Ind Improvements in pressure contact semi-conductor devices
BE759754A (fr) * 1969-12-02 1971-05-17 Licentia Gmbh Thyristor avec emetteur court-circuite a l'une des faces principales aumoins du disque de thyristor et procede de production du thyristor
US3979767A (en) * 1971-06-24 1976-09-07 Mitsubishi Denki Kabushiki Kaisha Multilayer P-N junction semiconductor switching device having a low resistance path across said P-N junction
US20130075891A1 (en) * 2011-09-23 2013-03-28 Formosa Microsemi Co., Ltd. Flip chip type full wave rectification semiconductor device and its manufacturing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting
NL217849A (en:Method) * 1956-06-12
US3109983A (en) * 1957-05-02 1963-11-05 Glenn F Cooper Circuits with distributed characteristics
DE1057694B (de) * 1957-08-01 1959-05-21 Siemens Ag Gekapseltes Halbleitergeraet mit einem oder mehreren p-n-UEbergaengen
US2971139A (en) * 1959-06-16 1961-02-07 Fairchild Semiconductor Semiconductor switching device
NL129185C (en:Method) * 1960-06-10
US3090873A (en) * 1960-06-21 1963-05-21 Bell Telephone Labor Inc Integrated semiconductor switching device

Also Published As

Publication number Publication date
NL294340A (en:Method) 1900-01-01
US3274460A (en) 1966-09-20
GB981270A (en) 1965-01-20
ES289957A1 (es) 1963-12-01

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