Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W95/00—Packaging processes not covered by the other groups of this subclass
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K11/00—Resistance welding; Severing by resistance heating
  • B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
  • B23K11/18—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded of non-ferrous metals
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
  • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
  • B23K35/3033—Ni as the principal constituent
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Pressure Welding/Diffusion-Bonding (AREA)
• Vessels And Coating Films For Discharge Lamps (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=19753290

Family Applications (1)

Country Status (7)

Families Citing this family (2)

Family Cites Families (6)

• 0
  • NL NL269393D patent/NL269393A/xx unknown
  • NL NL135879D patent/NL135879C/xx active
  • BE BE622539D patent/BE622539A/xx unknown
• 1962
  • 1962-08-31 US US220900A patent/US3140382A/en not_active Expired - Lifetime
  • 1962-09-14 GB GB35167/62A patent/GB954877A/en not_active Expired
  • 1962-09-15 DK DK403862AA patent/DK106343C/da active
  • 1962-09-15 DE DEN22097A patent/DE1220234B/de active Pending
  • 1962-09-17 CH CH1095462A patent/CH414777A/de unknown

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