BE577149R - Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung) - Google Patents

Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung)

Info

Publication number
BE577149R
BE577149R BE577149A BE577149A BE577149R BE 577149 R BE577149 R BE 577149R BE 577149 A BE577149 A BE 577149A BE 577149 A BE577149 A BE 577149A BE 577149 R BE577149 R BE 577149R
Authority
BE
Belgium
Prior art keywords
halfgeleiderinrichting
electrische
halbleitervorrichtung
elektrische
elektrische halbleitervorrichtung
Prior art date
Application number
BE577149A
Other languages
French (fr)
Original Assignee
Bell Telephone Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell Telephone Mfg filed Critical Bell Telephone Mfg
Application granted granted Critical
Publication of BE577149R publication Critical patent/BE577149R/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/46Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
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    • H01ELECTRIC ELEMENTS
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
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    • H01L2224/05001Internal layers
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    • H01L2924/2076Diameter ranges equal to or larger than 100 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
BE577149A 1958-03-29 1959-03-27 Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung) BE577149R (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEST13591A DE1190580B (en) 1958-03-29 1958-03-29 High-performance rectifier built into a housing

Publications (1)

Publication Number Publication Date
BE577149R true BE577149R (en) 1959-09-28

Family

ID=7456090

Family Applications (1)

Application Number Title Priority Date Filing Date
BE577149A BE577149R (en) 1958-03-29 1959-03-27 Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung)

Country Status (3)

Country Link
BE (1) BE577149R (en)
DE (1) DE1190580B (en)
GB (1) GB903476A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19722507B4 (en) * 1997-05-30 2007-06-14 Robert Bosch Gmbh Method for producing an electrically conductively connected to an integrated circuit strand integrated circuit with a connection and speed sensor
US6790757B1 (en) * 1999-12-20 2004-09-14 Agere Systems Inc. Wire bonding method for copper interconnects in semiconductor devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices

Also Published As

Publication number Publication date
GB903476A (en) 1962-08-15
DE1190580B (en) 1965-04-08

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