BE569023A - - Google Patents
Info
- Publication number
- BE569023A BE569023A BE569023DA BE569023A BE 569023 A BE569023 A BE 569023A BE 569023D A BE569023D A BE 569023DA BE 569023 A BE569023 A BE 569023A
- Authority
- BE
- Belgium
Links
Classifications
-
- H10W72/00—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H10P95/00—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H10W72/5524—
-
- H10W72/5525—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL218594 | 1957-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE569023A true BE569023A (index.php) |
Family
ID=19750920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE569023D BE569023A (index.php) | 1957-07-01 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3015761A (index.php) |
| BE (1) | BE569023A (index.php) |
| CH (1) | CH362752A (index.php) |
| DE (1) | DE1068385B (index.php) |
| FR (1) | FR1197494A (index.php) |
| GB (1) | GB894672A (index.php) |
| NL (2) | NL98359C (index.php) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB928110A (en) | 1960-01-06 | 1963-06-06 | Pacific Semiconductors Inc | Semiconductor devices and methods for assembling them |
| DE1178520B (de) * | 1961-08-24 | 1964-09-24 | Philips Patentverwaltung | Legierungsverfahren zur Herstellung von Halbleiteranordnungen |
| US4036485A (en) * | 1969-08-11 | 1977-07-19 | Licentia Patent-Verwaltungs-G.M.B.H. | Jig |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE533564A (index.php) * | ||||
| NL91691C (index.php) * | 1952-02-07 | |||
| NL91363C (index.php) * | 1954-05-18 | |||
| US2840770A (en) * | 1955-03-14 | 1958-06-24 | Texas Instruments Inc | Semiconductor device and method of manufacture |
| US2906932A (en) * | 1955-06-13 | 1959-09-29 | Sprague Electric Co | Silicon junction diode |
-
0
- NL NL218594D patent/NL218594A/xx unknown
- DE DENDAT1068385D patent/DE1068385B/de active Pending
- NL NL98359D patent/NL98359C/xx active
- BE BE569023D patent/BE569023A/xx unknown
-
1958
- 1958-06-27 US US745032A patent/US3015761A/en not_active Expired - Lifetime
- 1958-06-27 GB GB20704/58A patent/GB894672A/en not_active Expired
- 1958-06-28 CH CH6116758A patent/CH362752A/de unknown
- 1958-06-30 FR FR1197494D patent/FR1197494A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL98359C (index.php) | |
| NL218594A (index.php) | |
| CH362752A (de) | 1962-06-30 |
| FR1197494A (fr) | 1959-12-01 |
| GB894672A (en) | 1962-04-26 |
| DE1068385B (index.php) | 1959-11-05 |
| US3015761A (en) | 1962-01-02 |