BE564212A - - Google Patents

Info

Publication number
BE564212A
BE564212A BE564212DA BE564212A BE 564212 A BE564212 A BE 564212A BE 564212D A BE564212D A BE 564212DA BE 564212 A BE564212 A BE 564212A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE564212A publication Critical patent/BE564212A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49888—Subsequently coating
BE564212D 1957-01-25 BE564212A (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEST12161A DE1181823B (de) 1957-01-25 1957-01-25 In ein Gehaeuse eingebauter Hochleistungsgleichrichter

Publications (1)

Publication Number Publication Date
BE564212A true BE564212A (en:Method)

Family

ID=7455638

Family Applications (1)

Application Number Title Priority Date Filing Date
BE564212D BE564212A (en:Method) 1957-01-25

Country Status (4)

Country Link
US (1) US2989578A (en:Method)
BE (1) BE564212A (en:Method)
DE (1) DE1181823B (en:Method)
GB (1) GB838167A (en:Method)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3104992A (en) * 1960-08-03 1963-09-24 Raytheon Co Methods of making rectifying and ohmic junctions
US3211594A (en) * 1961-12-19 1965-10-12 Hughes Aircraft Co Semiconductor device manufacture
NL303035A (en:Method) * 1963-02-06 1900-01-01
US3307246A (en) * 1963-12-23 1967-03-07 Ibm Method for providing multiple contact terminations on an insulator
US3451122A (en) * 1964-06-11 1969-06-24 Western Electric Co Methods of making soldered connections
US3331997A (en) * 1964-12-31 1967-07-18 Wagner Electric Corp Silicon diode with solder composition attaching ohmic contacts
US3446912A (en) * 1967-08-16 1969-05-27 Trw Inc Terminal for electrical component
US3731368A (en) * 1969-08-08 1973-05-08 Erie Technological Prod Inc Method of making lead and solder preform assembly
US3753214A (en) * 1971-06-01 1973-08-14 Essex International Inc Electrical conductors
US4038743A (en) * 1972-05-18 1977-08-02 Essex International, Inc. Terminating and splicing electrical conductors
US3826000A (en) * 1972-05-18 1974-07-30 Essex International Inc Terminating of electrical conductors
USB398479I5 (en:Method) * 1973-07-20
US5960540A (en) * 1996-11-08 1999-10-05 The Whitaker Corporation Insulated wire with integral terminals
US5670418A (en) * 1996-12-17 1997-09-23 International Business Machines Corporation Method of joining an electrical contact element to a substrate
US6362429B1 (en) * 1999-08-18 2002-03-26 Micron Technology, Inc. Stress relieving tape bonding interconnect
DE102005011028A1 (de) * 2005-03-08 2006-09-14 W.C. Heraeus Gmbh Kupferbonddraht mit verbesserten Bond- und Korrosionseigenschaften
JP2011517734A (ja) * 2008-04-14 2011-06-16 ヘムロック・セミコンダクター・コーポレーション 材料を蒸着するための製造装置及び当該装置において使用される電極
JP5702937B2 (ja) * 2010-03-12 2015-04-15 株式会社日立製作所 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2531660A (en) * 1949-08-27 1950-11-28 Bell Telephone Labor Inc Fabrication of piezoelectric crystal units
US2697047A (en) * 1950-09-14 1954-12-14 Bell Telephone Labor Inc Method of providing a spot of silver on a piezoelectric crystal
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
US2934685A (en) * 1957-01-09 1960-04-26 Texas Instruments Inc Transistors and method of fabricating same

Also Published As

Publication number Publication date
DE1181823B (de) 1964-11-19
US2989578A (en) 1961-06-20
GB838167A (en) 1960-06-22

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