BE562405A - - Google Patents
Info
- Publication number
- BE562405A BE562405A BE562405DA BE562405A BE 562405 A BE562405 A BE 562405A BE 562405D A BE562405D A BE 562405DA BE 562405 A BE562405 A BE 562405A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US622342A US3040213A (en) | 1956-11-15 | 1956-11-15 | Composite glaceramic articles and method of making |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE562405A true BE562405A (US08088918-20120103-C00254.png) |
Family
ID=24493826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE562405D BE562405A (US08088918-20120103-C00254.png) | 1956-11-15 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3040213A (US08088918-20120103-C00254.png) |
| BE (1) | BE562405A (US08088918-20120103-C00254.png) |
| DE (1) | DE1081619B (US08088918-20120103-C00254.png) |
| FR (1) | FR1190583A (US08088918-20120103-C00254.png) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3243872A (en) * | 1958-09-15 | 1966-04-05 | Printed Motors Inc | Electrical rotating machines |
| GB968277A (en) * | 1960-05-02 | 1964-09-02 | English Electric Co Ltd | Improvements in or relating to bonding agents and processes and bonded assemblies produced therewith |
| US3189801A (en) * | 1960-11-04 | 1965-06-15 | Microwave Ass | Point contact semiconductor devices |
| US3187606A (en) * | 1961-06-05 | 1965-06-08 | Burroughs Corp | Fabricating tool and technique |
| US3177576A (en) * | 1961-08-15 | 1965-04-13 | Rca Corp | Method of photocell manufacture by simultaneously sintering the photosensitive material and sealing the cell |
| BE622350A (US08088918-20120103-C00254.png) * | 1961-09-12 | |||
| DE1416437B2 (de) * | 1961-09-21 | 1970-06-11 | Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm | Trägerplatte für mikrominiaturisierte Schaltelemente und Verfahren zu ihrer Herstellung |
| US3189512A (en) * | 1962-01-08 | 1965-06-15 | Cording Glass Works | Ceramic cements, laminates and methods |
| BE631489A (US08088918-20120103-C00254.png) * | 1962-04-27 | |||
| US3217089A (en) * | 1962-06-01 | 1965-11-09 | Control Data Corp | Embedded printed circuit |
| US3271625A (en) * | 1962-08-01 | 1966-09-06 | Signetics Corp | Electronic package assembly |
| US3389458A (en) * | 1964-05-21 | 1968-06-25 | Anaconda Wire & Cable Co | Crystallized glass ceramic coatings |
| US3329790A (en) * | 1964-07-02 | 1967-07-04 | Indak Mfg Corp | Contact construction for switches or the like |
| US3334205A (en) * | 1966-06-23 | 1967-08-01 | Quantic Ind Inc | Micro-circuit bridge and method |
| US3423517A (en) * | 1966-07-27 | 1969-01-21 | Dielectric Systems Inc | Monolithic ceramic electrical interconnecting structure |
| US3488429A (en) * | 1969-02-24 | 1970-01-06 | Gerald Boucher | Multilayer printed circuits |
| US3634600A (en) * | 1969-07-22 | 1972-01-11 | Ceramic Metal Systems Inc | Ceramic package |
| US3710196A (en) * | 1970-04-27 | 1973-01-09 | T Fifield | Circuit board and method of making circuit connections |
| US3770529A (en) * | 1970-08-25 | 1973-11-06 | Ibm | Method of fabricating multilayer circuits |
| US3893230A (en) * | 1971-11-15 | 1975-07-08 | Ford Motor Co | Method of manufacture of an exhaust gas sensor for an air-fuel ratio sensing system |
| US4301580A (en) * | 1977-04-16 | 1981-11-24 | Wallace Clarence L | Manufacture of multi-layered electrical assemblies |
| US4183074A (en) * | 1977-04-16 | 1980-01-08 | Wallace Clarence L | Manufacture of multi-layered electrical assemblies |
| US4221047A (en) * | 1979-03-23 | 1980-09-09 | International Business Machines Corporation | Multilayered glass-ceramic substrate for mounting of semiconductor device |
| US4417393A (en) * | 1981-04-01 | 1983-11-29 | General Electric Company | Method of fabricating high density electronic circuits having very narrow conductors |
| US4487993A (en) * | 1981-04-01 | 1984-12-11 | General Electric Company | High density electronic circuits having very narrow conductors |
| DE3213378C2 (de) * | 1982-04-10 | 1984-10-11 | Pacific Wietz Gmbh + Co Kg, 4600 Dortmund | Mehrschichtiger Gleitkörper und Verfahren zu seiner Herstellung |
| US4645552A (en) * | 1984-11-19 | 1987-02-24 | Hughes Aircraft Company | Process for fabricating dimensionally stable interconnect boards |
| AT402135B (de) * | 1994-03-30 | 1997-02-25 | Electrovac | Schaltungsträger |
| US6131410A (en) * | 1998-03-16 | 2000-10-17 | The Regents Of The University Of California | Vacuum fusion bonding of glass plates |
| WO2013082347A1 (en) * | 2011-11-30 | 2013-06-06 | Corning Incorporated | Fluidic module permanent stack assemblies and methods |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US761204A (en) * | 1902-11-20 | 1904-05-31 | Cutler Hammer Mfg Co | Method of making electrical heating apparatus. |
| US1718993A (en) * | 1927-09-09 | 1929-07-02 | Belden Mfg Co | Wiring panel for electrical apparatus |
| BE478624A (US08088918-20120103-C00254.png) * | 1943-12-08 | |||
| US2504504A (en) * | 1945-05-14 | 1950-04-18 | Radio Electr Soc Fr | Manufacture of the envelopes of electron discharge and other evacuated devices |
| US2620598A (en) * | 1947-04-22 | 1952-12-09 | James A Jobling And Company Lt | Method of fabricating multi-component glass articles |
| BE483459A (US08088918-20120103-C00254.png) * | 1947-06-25 | |||
| GB688461A (en) * | 1947-09-23 | 1953-03-11 | Erie Resistor Corp | Improvements in or relating to the manufacture of electric circuits |
| FR953590A (fr) * | 1947-09-29 | 1949-12-08 | Méthode d'obtention de réseaux électriques et produits obtenus | |
| US2677920A (en) * | 1951-01-17 | 1954-05-11 | Csf | Tight enclosures manufacturing |
| US2749668A (en) * | 1952-08-30 | 1956-06-12 | Csf | Method of sealing vacuum-tight envelopes |
| BE526937A (US08088918-20120103-C00254.png) * | 1953-03-05 | 1954-09-03 | ||
| US2825634A (en) * | 1953-05-18 | 1958-03-04 | Pittsburgh Plate Glass Co | Glass articles, compositions and methods of producing same |
| US2913632A (en) * | 1955-08-08 | 1959-11-17 | Austin N Stanton | Micro-circuits, electric devices there-for, and methods for making same |
-
0
- BE BE562405D patent/BE562405A/xx unknown
-
1956
- 1956-11-15 US US622342A patent/US3040213A/en not_active Expired - Lifetime
-
1957
- 1957-11-14 FR FR1190583D patent/FR1190583A/fr not_active Expired
- 1957-11-15 DE DEC15793A patent/DE1081619B/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3040213A (en) | 1962-06-19 |
| FR1190583A (fr) | 1959-10-14 |
| DE1081619B (de) | 1960-05-12 |
