Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE554984ApublicationCriticalpatent/BE554984A/xx
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K3/061—Etching masks
H05K3/064—Photoresists
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0703—Plating
H05K2203/0723—Electroplating, e.g. finish plating
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating