Classifications

• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
  • H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
  • H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
  • H02M7/12—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
  • H02M7/21—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
  • H02M7/217—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
  • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
  • F16L19/00—Joints in which sealing surfaces are pressed together by means of a member, e.g. a swivel nut, screwed on or into one of the joint parts
  • F16L19/04—Joints in which sealing surfaces are pressed together by means of a member, e.g. a swivel nut, screwed on or into one of the joint parts using additional rigid rings, sealing directly on at least one pipe end, which is flared either before or during the making of the connection
  • F16L19/043—Joints in which sealing surfaces are pressed together by means of a member, e.g. a swivel nut, screwed on or into one of the joint parts using additional rigid rings, sealing directly on at least one pipe end, which is flared either before or during the making of the connection with additional sealing means
  • F16L19/046—Joints in which sealing surfaces are pressed together by means of a member, e.g. a swivel nut, screwed on or into one of the joint parts using additional rigid rings, sealing directly on at least one pipe end, which is flared either before or during the making of the connection with additional sealing means consisting of a soft ring
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
  • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
  • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
  • H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
  • H01L27/0744—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common without components of the field effect type
  • H01L27/075—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. lateral bipolar transistor, and vertical bipolar transistor and resistor
  • H01L27/0755—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
  • H01L27/0761—Vertical bipolar transistor in combination with diodes only
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

Landscapes

• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• General Engineering & Computer Science (AREA)
• Ceramic Engineering (AREA)
• Mechanical Engineering (AREA)
• Joints With Pressure Members (AREA)
• Rectifiers (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=32396001

Family Applications (1)

Country Status (4)

Families Citing this family (13)

Family Cites Families (5)

• 0
  • BE BE542519D patent/BE542519A/xx unknown
• 1940
  • 1940-12-03 GB GB17197/40A patent/GB542519A/en not_active Expired
• 1955
  • 1955-09-13 US US534118A patent/US2928036A/en not_active Expired - Lifetime
  • 1955-09-19 FR FR1139863D patent/FR1139863A/fr not_active Expired

Also Published As

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