BE541624A - - Google Patents
Info
- Publication number
- BE541624A BE541624A BE541624DA BE541624A BE 541624 A BE541624 A BE 541624A BE 541624D A BE541624D A BE 541624DA BE 541624 A BE541624 A BE 541624A
- Authority
- BE
- Belgium
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
- H01J5/22—Vacuum-tight joints between parts of vessel
- H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/32—Seals for leading-in conductors
- H01J5/40—End-disc seals, e.g. flat header
- H01J5/42—End-disc seals, e.g. flat header using intermediate part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0034—Lamp bases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0037—Solid sealing members other than lamp bases
- H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/904—Wire bonding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Thermistors And Varistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB24500/54A GB775191A (en) | 1954-08-23 | 1954-08-23 | Improvements in or relating to the manufacture of semi-conductor devices |
| GB24495/54A GB775121A (en) | 1954-08-23 | 1954-08-23 | Improvements in or relating to the manufacture of semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE541624A true BE541624A (fr) | 1900-01-01 |
Family
ID=26257146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE541624D BE541624A (fr) | 1954-08-23 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US2898668A (fr) |
| BE (1) | BE541624A (fr) |
| CH (2) | CH334813A (fr) |
| DE (2) | DE1063277B (fr) |
| FR (2) | FR1129882A (fr) |
| GB (2) | GB775191A (fr) |
| NL (1) | NL199836A (fr) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1053672B (de) * | 1957-01-30 | 1959-03-26 | Siemens Ag | Gasdicht gekapselte elektrische Halbleiteranordnung |
| NL229943A (fr) * | 1957-08-01 | |||
| GB831295A (en) * | 1957-08-08 | 1960-03-30 | Pye Ltd | Improvements in or relating to semiconductor devices |
| DE1246884B (de) * | 1957-10-22 | 1967-08-10 | Philips Nv | Halbleitendes Elektrodensystem |
| NL238557A (fr) * | 1958-04-24 | |||
| DE1086811B (de) * | 1958-04-24 | 1960-08-11 | Intermetall | Verfahren zur Kontaktierung und zum Zusammenbau von mittels eines Aluminiumdrahtes legierten Silizium-Gleichrichtern |
| US3054174A (en) * | 1958-05-13 | 1962-09-18 | Rca Corp | Method for making semiconductor devices |
| GB859025A (en) * | 1958-08-13 | 1961-01-18 | Gen Electric Co Ltd | Improvements in or relating to electrical devices having hermetically sealed envelopes |
| USRE25853E (en) * | 1959-03-11 | 1965-09-07 | Transistor heat sink | |
| NL249576A (fr) * | 1959-03-18 | |||
| US3015760A (en) * | 1959-06-10 | 1962-01-02 | Philips Corp | Semi-conductor devices |
| DE1123406B (de) * | 1960-09-27 | 1962-02-08 | Telefunken Patent | Verfahren zur Herstellung von legierten Halbleiteranordnungen |
| US3125709A (en) * | 1960-10-17 | 1964-03-17 | Housing assembly | |
| NL260810A (fr) * | 1961-02-03 | |||
| DE1250005B (fr) * | 1961-02-06 | 1967-09-14 | ||
| US3242555A (en) * | 1961-06-08 | 1966-03-29 | Gen Motors Corp | Method of making a semiconductor package |
| US3244947A (en) * | 1962-06-15 | 1966-04-05 | Slater Electric Inc | Semi-conductor diode and manufacture thereof |
| US3249982A (en) * | 1963-01-07 | 1966-05-10 | Hughes Aircraft Co | Semiconductor diode and method of making same |
| US4047292A (en) * | 1976-11-19 | 1977-09-13 | Gte Sylvania Incorporated | Process for forming an electrically insulating seal between a metal lead and a metal cover |
| US5243743A (en) * | 1992-07-22 | 1993-09-14 | Peterson Manfred J | Apparatus for making cups |
| US6101731A (en) * | 1998-05-12 | 2000-08-15 | Mesa; Antonio | Guide clips for cutting drywalls access holes |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE320435C (de) * | 1918-08-24 | 1920-04-22 | Johannes Nienhold | Beruehrungsdetektor |
| DE902053C (de) * | 1939-08-22 | 1954-01-18 | Siemens Ag | Verfahren zum vakuumdichten Abschluss von Vakuumgefaessen, insbesondere Elektronenroehren mit metallischem Pumpstengel |
| US2427597A (en) * | 1941-11-01 | 1947-09-16 | Rca Corp | Method of exhausting and cold weld sealing |
| US2360279A (en) * | 1942-04-22 | 1944-10-10 | Gen Motors Corp | Method of making spark plugs |
| US2608887A (en) * | 1949-03-28 | 1952-09-02 | Gen Electric Co Ltd | Means for cold pressure welding |
| USB134657I5 (fr) * | 1949-12-23 | |||
| NL90092C (fr) * | 1950-09-14 | 1900-01-01 | ||
| BE506110A (fr) * | 1950-09-29 | |||
| US2733390A (en) * | 1952-06-25 | 1956-01-31 | scanlon | |
| US2745045A (en) * | 1952-07-19 | 1956-05-08 | Sylvania Electric Prod | Semiconductor devices and methods of fabrication |
| NL180221B (nl) * | 1952-07-29 | Charbonnages Ste Chimique | Werkwijze ter bereiding van een polyaminoamidehardingsmiddel voor epoxyharsen; werkwijze ter bereiding van een in water verdeeld hardingsmiddel; werkwijze ter bereiding van een epoxyharssamenstelling die een dergelijk hardingsmiddel bevat alsmede voorwerp voorzien van een bekledingslaag verkregen uit een dergelijke epoxyharssamenstelling. | |
| US2735919A (en) * | 1953-05-20 | 1956-02-21 | shower |
-
0
- BE BE541624D patent/BE541624A/xx unknown
- NL NL199836D patent/NL199836A/xx unknown
-
1954
- 1954-08-23 GB GB24500/54A patent/GB775191A/en not_active Expired
- 1954-08-23 FR FR1129882D patent/FR1129882A/fr not_active Expired
- 1954-08-23 GB GB24495/54A patent/GB775121A/en not_active Expired
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1955
- 1955-08-15 DE DEG17775A patent/DE1063277B/de active Pending
- 1955-08-16 CH CH334813D patent/CH334813A/de unknown
- 1955-08-17 US US528963A patent/US2898668A/en not_active Expired - Lifetime
- 1955-08-17 US US528895A patent/US2939204A/en not_active Expired - Lifetime
- 1955-08-17 DE DEG17797A patent/DE1138869B/de active Pending
- 1955-08-18 CH CH336904D patent/CH336904A/de unknown
- 1955-08-22 FR FR1130175D patent/FR1130175A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL199836A (fr) | 1900-01-01 |
| CH336904A (de) | 1959-03-15 |
| FR1129882A (fr) | 1957-01-28 |
| GB775121A (en) | 1957-05-22 |
| CH334813A (de) | 1958-12-15 |
| FR1130175A (fr) | 1957-01-31 |
| US2939204A (en) | 1960-06-07 |
| GB775191A (en) | 1957-05-22 |
| DE1063277B (de) | 1959-08-13 |
| US2898668A (en) | 1959-08-11 |
| DE1138869B (de) | 1962-10-31 |