BE510386A - - Google Patents

Info

Publication number
BE510386A
BE510386A BE510386DA BE510386A BE 510386 A BE510386 A BE 510386A BE 510386D A BE510386D A BE 510386DA BE 510386 A BE510386 A BE 510386A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE510386A publication Critical patent/BE510386A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H10P95/00—
    • H10P95/50—
    • H10W20/40—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W72/073—
    • H10W72/07336—
    • H10W72/354—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BE510386D 1951-04-05 BE510386A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB308100X 1951-04-05

Publications (1)

Publication Number Publication Date
BE510386A true BE510386A (cg-RX-API-DMAC10.html) 1900-01-01

Family

ID=10313478

Family Applications (1)

Application Number Title Priority Date Filing Date
BE510386D BE510386A (cg-RX-API-DMAC10.html) 1951-04-05

Country Status (3)

Country Link
US (1) US2774747A (cg-RX-API-DMAC10.html)
BE (1) BE510386A (cg-RX-API-DMAC10.html)
CH (1) CH308100A (cg-RX-API-DMAC10.html)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018260A (en) * 1955-01-03 1962-01-23 Chem Dev Corp Room temperature curing molding and forming composition
US2956039A (en) * 1956-06-19 1960-10-11 Union Carbide Corp Method of making quick curing metal containing epoxy resin composition
US2965930A (en) * 1957-08-21 1960-12-27 Union Carbide Corp Process for preparing polyepoxide solder
US2909752A (en) * 1957-08-30 1959-10-20 Union Carbide Corp Resistance heating of plastic-metal fiber articles and articles made thereby
US2961416A (en) * 1958-06-09 1960-11-22 Du Pont Silver conductors
US3030237A (en) * 1959-09-15 1962-04-17 North American Aviation Inc Conductive coating
US3206658A (en) * 1959-12-07 1965-09-14 Sprague Electric Co Solid electrolyte capacitor with surface-contacting cathode lead
BE640425A (cg-RX-API-DMAC10.html) * 1962-12-07
US3291758A (en) * 1963-05-31 1966-12-13 Gen Electric Superconductive materials
US3346444A (en) * 1964-08-24 1967-10-10 Gen Electric Electrically conductive polymers and process of producing the same
US3359145A (en) * 1964-12-28 1967-12-19 Monsanto Res Corp Electrically conducting adhesive
US3410722A (en) * 1965-03-23 1968-11-12 Gen Dynamics Corp Welding method, composition and article
US3471310A (en) * 1965-05-24 1969-10-07 Eutectic Welding Alloys Welding process and product
US3834373A (en) * 1972-02-24 1974-09-10 T Sato Silver, silver chloride electrodes
CA1097495A (en) * 1976-05-24 1981-03-17 James H. Aumiller Electrically conductive adhesive
US4209358A (en) * 1978-12-04 1980-06-24 Western Electric Company, Incorporated Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
US4375606A (en) * 1978-12-04 1983-03-01 Western Electric Co. Microelectronic device
DE3001613C2 (de) * 1980-01-17 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Befestigung eines, eine monolithisch integrierte Halbleiterschaltung enthaltenden Halbleiterkörpers aus Silicium an einer Unterlage mit einem entsprechenden Verfahren hierzu
FR2519293A1 (fr) * 1981-12-31 1983-07-08 Thomson Csf Procede de fabrication d'un bloc en materiau macromoleculaire piezoelectrique et bloc obtenu par ledit procede
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
FR2662864B1 (fr) * 1990-06-05 1992-09-04 Aerospatiale Procede pour relier un conducteur electrique a une broche d'un connecteur, et liaison electrique obtenue par mise en óoeuvre de ce procede.
US6265471B1 (en) * 1997-03-03 2001-07-24 Diemat, Inc. High thermally conductive polymeric adhesive
US6580035B1 (en) 1998-04-24 2003-06-17 Amerasia International Technology, Inc. Flexible adhesive membrane and electronic device employing same
US6406988B1 (en) 1998-04-24 2002-06-18 Amerasia International Technology, Inc. Method of forming fine pitch interconnections employing magnetic masks
US6297564B1 (en) 1998-04-24 2001-10-02 Amerasia International Technology, Inc. Electronic devices employing adhesive interconnections including plated particles
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6136128A (en) * 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6428650B1 (en) 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
US6409859B1 (en) 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
US6399178B1 (en) 1998-07-20 2002-06-04 Amerasia International Technology, Inc. Rigid adhesive underfill preform, as for a flip-chip device
US6316289B1 (en) 1998-11-12 2001-11-13 Amerasia International Technology Inc. Method of forming fine-pitch interconnections employing a standoff mask
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
US8382524B2 (en) 2010-05-21 2013-02-26 Amphenol Corporation Electrical connector having thick film layers
CA3050243A1 (en) * 2016-12-12 2018-06-21 Neuronoff, Inc. Electrode curable and moldable to contours of a target in bodily tissue and methods of manufacturing and placement and dispensers therefor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USB469610I5 (cg-RX-API-DMAC10.html) * 1930-05-15
US1901391A (en) * 1932-03-08 1933-03-14 Forberg Christian Combination washer
NL48107C (cg-RX-API-DMAC10.html) * 1935-10-30 1900-01-01
US2280135A (en) * 1940-02-21 1942-04-21 Theodore W H Ward Conductive coating for glass and method of application
US2324961A (en) * 1940-05-24 1943-07-20 Ohio Carbon Company Resistor
GB554972A (en) * 1941-09-11 1943-07-28 Philips Nv Improvements in or relating to blocking layer rectifiers
US2470352A (en) * 1944-03-21 1949-05-17 Hartford Nat Bank & Trust Comp Electrical resistor
US2506130A (en) * 1945-08-14 1950-05-02 Western Electric Co Metalized ceramic coating composition
US2473884A (en) * 1946-05-07 1949-06-21 Westinghouse Electric Corp Contact means
US2570856A (en) * 1947-03-25 1951-10-09 Du Pont Process for obtaining pigmented films
BE487600A (cg-RX-API-DMAC10.html) * 1948-02-28

Also Published As

Publication number Publication date
CH308100A (fr) 1955-06-30
US2774747A (en) 1956-12-18

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