BE483459A - - Google Patents

Info

Publication number
BE483459A
BE483459A BE483459DA BE483459A BE 483459 A BE483459 A BE 483459A BE 483459D A BE483459D A BE 483459DA BE 483459 A BE483459 A BE 483459A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE483459A publication Critical patent/BE483459A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
BE483459D 1947-06-25 BE483459A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB284905X 1947-06-25

Publications (1)

Publication Number Publication Date
BE483459A true BE483459A (zh)

Family

ID=10276468

Family Applications (1)

Application Number Title Priority Date Filing Date
BE483459D BE483459A (zh) 1947-06-25

Country Status (4)

Country Link
US (1) US2547022A (zh)
BE (1) BE483459A (zh)
CH (1) CH284905A (zh)
FR (1) FR968196A (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2641672A (en) * 1950-05-08 1953-06-09 Northrop Aircraft Inc Electrical conductor
US2736677A (en) * 1950-12-01 1956-02-28 Technograph Printed Circuits L Metallized insulators
BE514138A (zh) * 1951-09-14
US2862992A (en) * 1954-05-03 1958-12-02 Bell Telephone Labor Inc Electrical network assembly
US2913632A (en) * 1955-08-08 1959-11-17 Austin N Stanton Micro-circuits, electric devices there-for, and methods for making same
DE1069235B (zh) * 1955-09-28 1959-11-19
US2876393A (en) * 1956-05-15 1959-03-03 Sanders Associates Inc Printed circuit baseboard
BE562405A (zh) * 1956-11-15
US2926326A (en) * 1957-03-05 1960-02-23 Engelhard Ind Inc Collector ring assembly
US2921263A (en) * 1957-11-26 1960-01-12 Polarad Electronics Corp Card-type thermistor mount
US2954540A (en) * 1957-12-12 1960-09-27 Gen Precision Inc Brush block
US3219749A (en) * 1961-04-21 1965-11-23 Litton Systems Inc Multilayer printed circuit board with solder access apertures
US3316619A (en) * 1963-12-09 1967-05-02 Rca Corp Method of making connections to stacked printed circuit boards
US3289045A (en) * 1964-03-02 1966-11-29 Intellux Inc Circuit module
DE1265256B (de) * 1965-11-04 1968-04-04 Siemens Ag Verfahren zur Herstellung einer Duennschichtbaugruppe der Elektronik
US3424854A (en) * 1967-07-20 1969-01-28 Motorola Inc Multilayer printed circuit with soldered eyelets forming the sole means joining the same
JPS5278069A (en) * 1975-12-24 1977-07-01 Fuji Kinzoku Kakou Kk Printed circuit board
NL8202285A (nl) * 1982-06-07 1984-01-02 Philips Nv Inrichting met een electrische schakeling op een printplaat.
DE102007022337A1 (de) * 2007-05-12 2008-11-20 Semikron Elektronik Gmbh & Co. Kg Gesintertes Leistungshalbleitersubstrat sowie Herstellungsverfahren hierzu
DE102012025409A1 (de) * 2012-12-20 2014-06-26 Thomas Hofmann Leiterplatte mit echtholzlagenverbundwerkstoff

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1647474A (en) * 1923-10-25 1927-11-01 Frederick W Seymour Variable pathway
US2066876A (en) * 1934-07-02 1937-01-05 Rca Corp Wiring system for electrical apparatus

Also Published As

Publication number Publication date
CH284905A (de) 1952-08-15
US2547022A (en) 1951-04-03
FR968196A (fr) 1950-11-21

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