BE1030375B1 - METHOD FOR PRODUCING METALLIC NANOWIRE PATTERNS ON A SUBSTRATE WITH MICRO-NANO-SURFACE STRUCTURE, FLEXIBLE CONDUCTIVE MATERIAL AND USE THEREOF - Google Patents

Abstract

The present invention relates to the technical field of flexible electrodes and discloses a method for forming metallic nanowire patterns on a surface microstructured substrate, an elastic material for flexible electrodes and an application thereof. The pattern forming method includes: applying a metallic nanowire dispersion to the surface of a surface microstructured substrate and forming a metallic nanowire film after drying; coating the metallic nanowire film with a photocuring resin and exposing it using a mask; removing the mask so that the tight bond in the exposed area peels off from the surface microstructured substrate to obtain a surface microstructured substrate with metallic nanowire patterns. The method can realize the formation of fine metallic nanowire patterns on surface microstructured substrates such as sandpaper, and the method is simple, etch-free, inexpensive, green and environmentally friendly. The flexible conductive material produced by the transfer printing process can be used in the field of stretchable conductors, sensors and portable electronic devices and has broad application prospects.

Description

PROCESS FOR THE PRODUCTION OF METALLIC

NANOWIRE PATTERNS ON A SUBSTRATE WITH MICRO-NANO-

SURFACE STRUCTURE, FLEXIBLE CONDUCTIVE MATERIAL AND

ITS USE

TECHNICAL AREA

The present invention relates to the technical field of flexible electrodes, in particular to a method for producing metallic nanowire patterns on a

Substrate with surface microstructure, an elastic material for flexible electrodes and its application.

STATE OF THE ART

The age of the Internet of Things is a world where everything is connected.

Portable electronic devices that are flexible, thin, lightweight and foldable and adapt to the

body will be the bridge to connect people and things. The wires and electrodes that connect devices are a

Key component of any electronic device. Conventional forms of

circuits and conductive materials are not suitable for flexible wearable applications. Several new strategies for low-dimensional nanomaterials, conductive

Polymers and conductive films (including serpentine, wave and out-of-plane

Designs) have been applied to the manufacture of flexible electronic products to

Requirements for flexible, bendable and stretchable electronic products for wearable

Electronics. Compared to other candidate materials,

Metal nanowires are promising flexible electronic components due to their excellent electrical and thermal conductivity, high mechanical strength, flexibility and biocompatibility.

The fabrication of metallic nanowire patterns is an essential process to achieve electrical layouts, such as transparent conductive patterns on touch panels and serpentine patterns to improve the stretchability of flexible electrodes.

Industry and science have developed a variety of methods to

to produce metal nanowire network patterns, including = photolithography,

Laser ablation, printing, vacuum filtration, interfacial adhesion modulation and

Wetting-dehumidifying assembly techniques.

Rough conductive films with surface microstructures are ideal for flexible wearable devices such as stretchable conductors, pressure sensors, supercapacitors, frictional electrical nanoregenerators, displays, and strain sensors.

State of the art processes for the production of metallic

However, nanowire patterns are usually performed on flat and smooth surfaces, and no studies have been conducted on a method for fabricating metallic nanowire patterns on substrate with surface microstructures under

Use of the known method for producing patterns is reported.

CONTENT OF THE PRESENT INVENTION

A first purpose of the present invention is to provide a method for producing metallic nanowire patterns on a substrate with surface microstructure for

to provide a method for the formation of fine metallic nanowire patterns on

Substrate with surface microstructures such as sandpaper, whereby the

Process is simple, etch-free, cost-effective, green and environmentally friendly.

A second purpose of the present invention is to provide a flexible conductive material with metallic nanowire patterns and an application thereof, wherein the flexible conductive material is produced by using the above

Process obtained substrates with surface microstructure with metallic

Nanowire patterns can be treated by a transfer printing process, which is conducive to realizing wearable applications of electronic skin and the fabrication of various sensors, and has broad application prospects.

The present invention is realized by the following technical solution: a method for producing metallic nanowire patterns on a substrate with

Surface microstructure, comprising:

Applying a metal nanowire dispersion to the surface of a substrate with

Surface microstructure and formation of a metal nanowire film after drying;

Coating the metal nanowire film with a photocuring resin and exposing it using a mask, wherein the photocuring resin located in the exposed area forms a tight bond with the metal nanowires;

Remove the mask so that the tight connection in the exposed area is separated from the

Substrate with surface microstructure is removed to form a substrate with

Surface microstructure with metallic nanowire patterns.

In a preferred embodiment of the present invention, the above mask is a flexible plastic substrate, wherein the mask has a hydrophobic surface or a hydrophilic surface.

In a preferred embodiment of the present invention, when the above

Mask has a hydrophobic surface, the method for removing the tight

Connection of the substrate with surface microstructure after removal of the

Mask: Soaking the substrate with surface microstructure in an ethanol solution for 5-10 min.

Furthermore, in a preferred embodiment of the present invention, when the above mask has a hydrophilic surface, the tight connection during

Process of removing the mask for detachment from the substrate with

surface microstructure.

Furthermore, in a preferred embodiment of the present invention, the

After removing the mask, the method further comprises a step of washing the light-curing resin in the unexposed area with an ethanol solution.

Furthermore, in a preferred embodiment of the present invention, the above light-curing resin comprises a modified resin of an acrylate system and a modified

Resin of an epoxy resin system.

Furthermore, in a preferred embodiment of the present invention, the above exposure process comprises: curing by irradiation with UV light for 2-5 s, wherein the wavelength of the UV light is 340-380 nm and the power is 39-45 Mw/cm?.

Furthermore, in a preferred embodiment of the present invention, the

Drying temperature during the formation of the metal nanowire film 100-130°C.

A flexible conductive material with metallic nanowire patterns obtained by applying an elastic material to the surface of the substrate with surface microstructure with metallic nanowire patterns and performing a transfer printing process, wherein the substrate with surface microstructure with metallic

Nanowire patterns using the above pattern fabrication method.

An application of the above flexible conductive material in the field of stretchable conductors,

sensors and portable electronic devices.

Compared to the prior art, the present invention has at least the following technical effects:

The process for producing metallic nanowire patterns on a substrate with

Surface microstructure provided by the present application uses a substrate having surface microstructure, such as sandpaper, leaves, etc., on which a metal nanowire film is formed, since the light-curing resin at a short

Exposure time cannot achieve good adhesion to the substrate with surface microstructure, it is easy to bond the substrate with surface microstructure with the help of some

Methods such as soaking in ethanol, tearing off the hydrophilic mask, etc., and the metal nanowires deposited on the substrate with

surface microstructure forming a tight bond with the light-curing resin, while a remaining part of the metal nanowires continues to adhere to the substrate with surface microstructure to form a SS. The formed

Metal nanowire pattern can be transferred to other materials using a transfer printing process to obtain a flexible conductive material with metallic nanowire patterns for further applications in the field of stretchable conductors, sensors and wearable electronic devices.

The method for producing patterns provided in the present application avoids the use of conventional methods such as photolithography and laser etching, which are often characterized by expensive equipment, complex processes and high costs and are not environmentally friendly. The present application enables for the first time the

Fabrication of metallic nanowire patterns on substrate with

surface microstructures, which will facilitate the further commercialization of electronic devices with rough metallic nanowire patterns. Such flexible electrodes or electronic interconnects with metallic nanowire patterns facilitate their 5 stress dispersion in large strain states. The patterned

Metal nanowires can be transferred to other wearable substrates using elastic resins, on which a patterned conductive thin film often cannot be formed under the conditions of conventional methods.

The method for producing patterns provided in the present application has the technical advantages of simplicity, low energy consumption,

Time efficiency, lack of etching and few steps. The advantages of the simple

Technology and the few steps help to reduce the error rate in multi-stage

processes, improve product yield and reduce costs;

Advantages of low energy consumption and the absence of etching processes avoid the

flammability and explosion and the dangers of toxic substances caused by the chemical etching step in conventional photolithography processes, and achieve the goals of economic efficiency, environmental protection and low

carbon emissions.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 shows a flow chart in a first embodiment.

Figure 2 shows a metal nanowire pattern produced on a sandpaper in a second embodiment.

Figure 3 shows a flow diagram of a flexible conductive material with metallic

Nanowire patterns provided in a fifth embodiment.

Figure 4 shows a schematic diagram of a metal nanowire pattern after

Transferduck provided in a fifth embodiment.

DETAILED DESCRIPTION

The embodiments of the present invention are described below in

In connection with the embodiments, however, the person skilled in the art can understand that the following embodiments are only for

serve to illustrate the present invention and not as a limitation of the

scope of the present invention, which are set out in the

specific conditions not indicated in the embodiments are carried out according to conventional conditions or those recommended by the manufacturer, and the reagents or equipment used for which the manufacturer is not indicated are conventional products that are commercially available.

The present invention uses the following technical solution: a method for producing metallic nanowire patterns on a substrate with

Surface microstructure comprising the following steps:

Step S1: Applying a metal nanowire dispersion to the surface of a substrate with surface microstructure and forming a metal nanowire film after drying.

In the present embodiment, the substrate having surface microstructure may be a man-made product such as sandpaper, etc.; it may also be an object having a rough surface in nature such as plant leaves, salt particles, etc. The

Microstructure of the human epidermis resembles that of sandpaper. As the largest organ of the human body, the skin plays an important role in protecting the

body tissue and in the recording of information about external stimuli, and wearable electronics are developing towards an electronic skin that has a similar

function as human skin. Therefore, this process contributes to the formation of

Metallic nanowire patterns on the sandpaper contributed to the development of wearable electronic skins.

In addition, the drying temperature during the formation of the

metal nanowire film 100-130°C, preferably 105-125°C, more preferably 110-120°C. The

Inventors have discovered that at a drying temperature of 100-130°C the

Metal nanowires are better connected to each other and adhere to the substrate to prevent the metal nanowires in the unexposed areas from detaching from the substrate in the subsequent process; below this temperature range, the metal nanowires are not ideally patterned and above this temperature range, the metal nanowires tend to melt and oxidize.

Furthermore, the above coating process includes drop coating, which

Slot coating, Mayer rod coating, spin coating and

Inkjet coating. Drop coating is preferred.

Step S2: Coating the metal nanowire film with a light-curing resin and

Exposing the same using a mask, wherein the light-curing resin located in the exposed area forms a tight bond with the metal nanowires.

The light-curing resin in the present application, which is also known as a light-sensitive

Resin is an oligomer that undergoes rapid physical and chemical changes in a relatively short time when exposed to light and can therefore crosslink and harden. A light-curing resin is a light-sensitive resin with a low molecular weight and has reactive groups that can be light-cured, such as unsaturated double bonds or epoxy groups. The light-curing resin preferably comprises a modified resin of an acrylate system and a modified resin of an epoxy resin system. The modified resin of the acrylate system has the combined advantages of a variety of resins.

The process of using a mask cover for exposure includes:

Cover the light-curing resin with the mask and squeeze out the excess liquid light-curing resin so that the mask fits tightly to the substrate with

surface microstructure.

Furthermore, the mask is a flexible plastic substrate, whereby the mask has a hydrophobic

surface or a hydrophilic surface. Preferably, the mask is a

Plastic light shade with a hydrophobic surface and a plastic film with a hydrophilic surface.

Furthermore, the above exposure process includes: curing by irradiation with UV

Light for 2-5 s (preferably 3 or 4 s), the wavelength of the UV light being 340-380 nm and the power 39-45 Mw/cm®. Preferably the wavelength of the UV light is 360-370 nm and the power 40-45 Mw/cm?. The inventors have found that the light-curing resin does not adhere well to the substrate with a short exposure time.

surface microstructure, which is conducive to subsequent stripping by soaking in ethanol to form patterned metal nanowires on the substrate with

With an irradiation time of more than 5 s, the light-curing resin adheres well to the substrate with surface microstructure and is less likely to peel off, while with an irradiation time of less than 2 s, the resin is difficult to cure. Controlling the wavelength and power of the UV light helps to reproduce the pattern defined by the mask with high accuracy.

Step S3: Remove the mask so that the tight connection is visible in the exposed

area from the substrate with surface microstructure to form a substrate with

Surface microstructure with metallic nanowire patterns.

Furthermore, the detachment of the tight connection in the exposed area from the

Substrate with surface microstructure the following two implementations:

Implementation 1: if the mask is a thin film with a hydrophobic surface (e.g. a film mask), the thin film does not adhere to the photocuring resin during the exposure process. The methods for detaching the tight bond from the substrate with

Surface microstructure after removing the mask is that the substrate with surface microstructure is soaked in an ethanol solution for 5-10 min, because the light-curing resin does not adhere well to the substrate with a short exposure time.

surface microstructure, it will swell during the dipping process in ethanol and detach from the substrate with surface microstructure and the

Metal nanowires on the substrate with surface microstructure, which form a tight bond with the light-curing resin, while the remaining part of the

Metal nanowires continue to adhere to the substrate with surface microstructure, by designing the pattern of the glare protection section on the mask, a

Metal nanowire pattern with a corresponding pattern on the substrate with

surface microstructure can be formed.

Implementation 2: if the mask is a thin film with a hydrophilic surface, during the exposure process, the film adheres to the photocuring resin cured in the exposed area, and during removal of the mask, the mask drives the photocuring resin cured in the exposed area and the

Metal nanowires together from the sandpaper, while the remaining part of the

Metal nanowires continue to adhere to the substrate with surface microstructure to

to form metal nanowire patterns.

Preferably, washing the light-curing resin in the unexposed area comprises

Washing the excess light-curing resin by rinsing the substrate with

surface microstructure as a whole is placed in ethanol, eliminating the impact on the metal nanowire pattern in subsequent applications.

In the substrate having surface microstructure with metal nanowire patterns obtained by the above method of the present application, the formed

Metal nanowire patterns can be transferred to other materials using a transfer printing process to obtain a flexible conductive material with metallic nanowire patterns. In particular, the surface of the patterned substrate is coated with

Surface microstructure is then coated with another elastic material, and after curing and removal of the elastic material, the patterned

Metal nanowires on the bottom surface of the elastic material to obtain a flexible conductive material with metallic nanowire patterns. The elastic

Material can be a light-curing resin, a polydimethylsiloxane, polyurethane or

Epoxy resin.

This flexible conductive material with metallic nanowire patterns will continue to be used in

Area of flexible wearable devices such as stretchable conductors, pressure sensors,

Supercapacitors, electrical nanoregenerators through friction, sensors and

strain sensors, etc. and has excellent performance.

In the following, the detailed embodiments of the present invention are explained in more detail. It is to be understood that the detailed embodiments described here

Embodiments are intended to illustrate the present invention only, rather than to limit the present invention.

Example 1

The present embodiment represents a method for producing metallic

Nanowire patterns on a substrate with surface microstructure, the

Flowchart as shown in Figure 1, and in particular the following

Steps include:

(1) Applying a metal nanowire dispersion to the surface of a sandpaper and

Heating and drying at 100°C to form a metal nanowire film. (2) Coating the metal nanowire film with a light-curing resin (acrylate system),

Covering with a film mask with a hydrophobic surface, squeezing out the excess liquid resin, then curing by irradiation with LED

UV light for 3 s after the film mask was placed tightly against the sandpaper, whereby the

Wavelength of the LED UV light is 365 nm and the power is 42 Mw/cm?. After the

After exposure, the light-curing resin in the exposed area forms a close bond with the metal nanowire film, while the light-curing resin in the unexposed area remains in a liquid state on the sandpaper surface. (3) Removing the mask and placing the sandpaper as a whole in ethanol to clean the uncured light-curing resin, leaving the surface of the metal nanowire film on the sandpaper that has not formed a close bond with the light-curing resin clean. (4) Soaking the sandpaper as a whole in an ethanol solution for 8 min, keeping the close bond

Compound in the exposed area detaches from the substrate with surface microstructure, i.e. after soaking in ethanol for 8 min, the cured resin absorbs the ethanol and swells and detaches from the substrate, while the metal nanowires on the

sandpaper with which it is firmly bonded. After soaking and cleaning with water, the metal nanowire pattern is displayed on the sandpaper as shown in Figure 2.

Example 2

The present embodiment represents a method for producing metallic

Nanowire patterns on a substrate with surface microstructure, comprising in particular the following steps: (1) applying a metal nanowire dispersion to the surface of a sandpaper and

Heating and drying at 130°C to form a metal nanowire film. (2) Coating the metal nanowire film with a light-curing resin (epoxy resin system), covering with a film mask with a hydrophobic surface,

Pressing out the excess liquid resin, subsequent hardening by the

Irradiation with LED UV light for 5 s after the film mask is closely attached to the sandpaper, the wavelength of the LED UV light being 340 nm and the power 45 Mw/cm?. After exposure, the light-curing resin forms a tight

connection with the metal nanowire film, while the light-curing resin in the unexposed

area remains in a liquid state on the sandpaper surface. (3) Removing the mask and placing the sandpaper as a whole in ethanol to clean the uncured light-curing resin, leaving the surface of the metal nanowire film on the sandpaper that has not formed a tight bond with the light-curing resin clean. (4) Soaking the sandpaper as a whole in an ethanol solution for 5 min, leaving the tight

Compound in the exposed area detaches from the substrate with surface microstructure, i.e. after soaking in ethanol for 5 min, the cured resin absorbs the ethanol and swells and detaches from the substrate, while the metal nanowires on the

Sandpaper with which it is firmly bonded. After soaking and cleaning with water, the metal nanowire pattern is displayed on the sandpaper.

Example 3

The present embodiment represents a method for producing metallic

Nanowire patterns on a substrate with surface microstructure, comprising in particular the following steps: (1) applying a metal nanowire dispersion to the surface of a sandpaper and

Heating and drying at 110°C to form a metal nanowire film. (2) Coating the metal nanowire film with a light-curing resin (epoxy resin system), covering with a film mask with a hydrophobic surface,

Pressing out the excess liquid resin, subsequent hardening by the

Irradiation with LED UV light for 5 s after the film mask is closely attached to the sandpaper, the wavelength of the LED UV light being 340 nm and the power 45 Mw/em?. After exposure, the light-curing resin forms a tight

connection with the metal nanowire film, while the light-curing resin in the unexposed

area remains in a liquid state on the sandpaper surface. (3) Removing the mask and placing the sandpaper as a whole in ethanol to clean the uncured photocuring resin, leaving the surface of the metal nanowire film on the sandpaper that has not formed a tight bond with the photocuring resin clean. (4) Soaking the sandpaper as a whole in an ethanol solution for 10 min, the tight bond in the exposed area peels off from the substrate with surface microstructure, i.e., after soaking in ethanol for 10 min, the cured resin absorbs the ethanol and swells and peels off from the substrate, while the metal nanowires on the

Sandpaper with which it is firmly bonded. After soaking and cleaning with water, the metal nanowire pattern is displayed on the sandpaper.

Example 4

The present embodiment represents a method for producing metallic

Nanowire patterns on a substrate with surface microstructure, comprising the following steps: (1) applying a metal nanowire dispersion to the surface of a sandpaper and

Heating and drying at 120°C to form a metal nanowire film. (2) Coating the metal nanowire film with a light-curing resin (acrylate system),

Covering with a plastic mask with a hydrophilic surface, squeezing out the excess liquid resin, then curing by irradiation with LED

UV light for 2 s after the film mask was placed tightly against the sandpaper, whereby the

Wavelength of the LED UV light is 380 nm and the power is 39 Mw/cm?. After the

After exposure, the light-curing resin in the exposed area forms a close bond with the metal nanowires and the plastic mask, while the light-curing resin in the unexposed area mostly adheres to the bottom surface of the plastic mask and remains in a liquid state. (3) Removing the plastic mask, the cured part of the resin is removed from the sandpaper together with the metal nanowires, and the metal nanowire pattern is then directly displayed on the sandpaper.

Example 5

The present embodiment provides a flexible conductive material with metallic

Nanowire patterns, comprising in particular the following steps:

(1) Applying a metal nanowire dispersion to the surface of a sandpaper and

Heating and drying at 70°C to form a metal nanowire film. (2) Coating the metal nanowire film with a light-curing resin (acrylate system),

Covering with a film mask with a hydrophobic surface, squeezing out the excess liquid resin, then curing by irradiation with LED

UV light for 4 s after the film mask was placed tightly against the sandpaper, whereby the

Wavelength of the LED UV light is 360 nm and the power is 41 Mw/cm?. After the

After exposure, the light-curing resin in the exposed area forms a tight bond with the metal nanowires and the plastic mask, while the light-curing resin in the unexposed area remains in a liquid state on the sandpaper surface. (3) Removing the mask and placing the sandpaper as a whole in ethanol to clean the uncured light-curing resin, leaving the surface of the metal nanowire film on the sandpaper that has not formed a tight bond with the light-curing resin clean. (4) Soaking the sandpaper as a whole in an ethanol solution for 10 min, the tight bond in the exposed area detaches from the substrate with surface microstructure, i.e., after soaking in ethanol for 10 min, the cured resin absorbs the ethanol and swells and detaches from the substrate, while the metal nanowires on the

sandpaper with which it is firmly bonded. After soaking and cleaning with water, the metal nanowire pattern is displayed on the sandpaper. (5) Coating the patterned metal nanowire film on the sandpaper with

Polydimethylsiloxane and peeling off after curing to a film so that the

Metal nanowire pattern is transferred from the sandpaper to the polydimethylsiloxane film to obtain a flexible conductive material with metallic nanowire patterns.

Example 6

The present embodiment provides a flexible conductive material with metallic

Nanowire patterns, the flow chart of which is as shown in Figure 3, comprising in particular the following steps: (1) applying a metal nanowire dispersion to the surface of a sandpaper and

Heating and drying at 70°C to form a metal nanowire film.

(2) Coating the metal nanowire film with a light-curing resin (acrylate system),

Covering with a film mask with a hydrophobic surface, squeezing out the excess liquid resin, then curing by irradiation with LED

UV light for 4 s after the film mask was placed tightly against the sandpaper, whereby the

Wavelength of the LED UV light is 360 nm and the power is 41 Mw/cm?. After the

After exposure, the light-curing resin in the exposed area forms a close bond with the metal nanowires and the plastic mask, while the light-curing resin in the unexposed area remains in a liquid state on the sandpaper surface. (3) Removing the plastic mask, the cured part of the resin is removed from the sandpaper together with the metal nanowires, and the metal nanowire pattern is then directly displayed on the sandpaper. (4) Reapplying the light-curing resin to the patterned metal nanofilm on the sandpaper and curing it by irradiating with LED UV light for 4 s, whereby the

The wavelength of the LED UV light is 365 nm and the power is 41 Mw/cm?. Peel off the layer of light-curing resin after curing to form a film so that the

Metal nanowire pattern is transferred from the sandpaper to the light-curing resin substrate, as shown in Figure 4, to form a flexible conductive material with metallic

to obtain nanowire patterns.

The performance parameters of the embodiments 1 to 6 of the present

The metal nanopatterns on sandpaper produced in the application are as follows:

The line width is determined by optical calibration; the electrical conductivity is determined by a multimeter or a source meter; the bending radius is determined by placing the sample on a bending surface with a certain radius of curvature and simultaneously measuring the resistance value; the strain characteristics are determined by fixing two ends of the sample on a stretchable fixture, adjusting the position of the two ends of the fixture to stretch the sample, and simultaneously measuring the resistance of the stretched sample.

The results are as follows:

Table 1: Performance parameters of the components produced in Examples 1 to 6

Metal nanopatterns Example Conductivity (%) (Q) Example 1 Example 2 Example 3 Example 4 Example 5 Example 6

From Table 1 it can be seen that in the process for producing metallic

Nanowire patterns on a substrate with surface microstructure the minimum

Line width of the pattern is 20 um and the resistance of the patterned conductive thin film is 2-100 Ohm, where the exact value of the resistance depends on the selected material, the

thickness of the deposited material and the design of the structure. The conductive thin film in the stretched state with twice the initial length (i.e. 50%

stretching property) a 500% change in resistance compared to the original

resistance value and can be used in strain sensors, etc.

It should be noted that the above content is only preferred

embodiments of the present invention and is not intended to

The scope of the present invention is not limited. All ideas and

Changes made to the principles of the present invention, equivalent

Substitutions and improvements should be considered as being within the scope of the present invention.

Claims (10)

Expectations 1. A method for producing metallic nanowire patterns on a surface microstructured substrate, characterized in that it comprises: applying a metallic nanowire dispersion to the surface of a surface microstructured substrate and forming a metallic nanowire film after drying; coating the metallic nanowire film with a photocuring resin and exposing it using a mask, wherein the photocuring resin located in the exposed area forms an intimate bond with the metallic nanowires; removing the mask so that the intimate bond in the exposed area detaches from the surface microstructured substrate to obtain a surface microstructured substrate with metallic nanowire patterns. 2. A method for producing metallic nanowire patterns on a substrate with surface microstructure according to claim 1, characterized in that the mask is a flexible plastic substrate, the mask having a hydrophobic surface or a hydrophilic surface. 3. A method for producing metallic nanowire patterns on a surface microstructured substrate according to claim 2, characterized in that, when the mask has a hydrophobic surface, the method for releasing the tight bond from the surface microstructured substrate after removing the mask comprises: soaking the surface microstructured substrate in an ethanol solution for 5-10 min. 4. A method for producing metallic nanowire patterns on a surface microstructured substrate according to claim 2, characterized in that when the mask has a hydrophilic surface, the intimate bond is caused to detach from the surface microstructured substrate during the process of removing the mask. 5. A method for producing metallic nanowire patterns on a substrate having a surface microstructure according to claim 1, characterized in that the method, after removing the mask, further comprises a step of washing the photocuring resin in the unexposed area with an ethanol solution. 6. A method for producing metallic nanowire patterns on a substrate with surface microstructure according to claim 1, characterized in that the light-curing resin comprises a modified resin of an acrylate system and a modified resin of an epoxy resin system. 7. A method for producing metallic nanowire patterns on a substrate with surface microstructure according to claim 1, characterized in that the exposure process comprises: curing by irradiation with UV light for 2-5 s, wherein the wavelength of the UV light is 340-380 nm and the power is 39-45 Mw/cm?. 8. A method for producing metallic nanowire patterns on a substrate having a surface microstructure according to claim 1, characterized in that the drying temperature during the formation of the metallic nanowire film is 100-130°C. 9. A flexible conductive material with metallic nanowire patterns, characterized in that it is obtained by applying an elastic material to the surface of the substrate with surface microstructure with metallic nanowire patterns and performing a transfer printing process, wherein the substrate with surface microstructure with metallic nanowire patterns is manufactured using a method for producing patterns according to any one of claims 1 to 8. 10. Application of a flexible conductive material according to claim 9 in the field of stretchable conductors, sensors and portable electronic devices.