AUPQ756000A0 - Circuit board arrangement and funds transaction device - Google Patents

Circuit board arrangement and funds transaction device

Info

Publication number
AUPQ756000A0
AUPQ756000A0 AUPQ7560A AUPQ756000A AUPQ756000A0 AU PQ756000 A0 AUPQ756000 A0 AU PQ756000A0 AU PQ7560 A AUPQ7560 A AU PQ7560A AU PQ756000 A AUPQ756000 A AU PQ756000A AU PQ756000 A0 AUPQ756000 A0 AU PQ756000A0
Authority
AU
Australia
Prior art keywords
circuit board
transaction device
board arrangement
funds transaction
funds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AUPQ7560A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MCOM Solutions Inc
Original Assignee
MCOM Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MCOM Solutions Inc filed Critical MCOM Solutions Inc
Priority to AUPQ7560A priority Critical patent/AUPQ756000A0/en
Publication of AUPQ756000A0 publication Critical patent/AUPQ756000A0/en
Priority to PCT/AU2001/000292 priority patent/WO2001089278A1/en
Priority to AU2001240370A priority patent/AU2001240370A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
AUPQ7560A 2000-05-17 2000-05-17 Circuit board arrangement and funds transaction device Abandoned AUPQ756000A0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AUPQ7560A AUPQ756000A0 (en) 2000-05-17 2000-05-17 Circuit board arrangement and funds transaction device
PCT/AU2001/000292 WO2001089278A1 (en) 2000-05-17 2001-03-15 Circuit board arrangement and funds transaction device
AU2001240370A AU2001240370A1 (en) 2000-05-17 2001-03-15 Circuit board arrangement and funds transaction device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AUPQ7560A AUPQ756000A0 (en) 2000-05-17 2000-05-17 Circuit board arrangement and funds transaction device

Publications (1)

Publication Number Publication Date
AUPQ756000A0 true AUPQ756000A0 (en) 2000-06-08

Family

ID=3821638

Family Applications (1)

Application Number Title Priority Date Filing Date
AUPQ7560A Abandoned AUPQ756000A0 (en) 2000-05-17 2000-05-17 Circuit board arrangement and funds transaction device

Country Status (2)

Country Link
AU (1) AUPQ756000A0 (en)
WO (1) WO2001089278A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW199235B (en) * 1991-05-27 1993-02-01 Hitachi Seisakusyo Kk Method to enclose semiconductor devices in resin and semiconductor apparatuses
JP2765278B2 (en) * 1991-05-31 1998-06-11 株式会社デンソー Electronic device manufacturing method
GB2279907B (en) * 1993-07-02 1996-11-06 Gec Avery Ltd An integrated circuit card
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5847650A (en) * 1996-10-04 1998-12-08 Knogo North America Inc. Theft resistant circuit assembly

Also Published As

Publication number Publication date
WO2001089278A1 (en) 2001-11-22

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