AUPO473297A0 - Coating thickness control - Google Patents

Coating thickness control

Info

Publication number
AUPO473297A0
AUPO473297A0 AUPO4732A AUPO473297A AUPO473297A0 AU PO473297 A0 AUPO473297 A0 AU PO473297A0 AU PO4732 A AUPO4732 A AU PO4732A AU PO473297 A AUPO473297 A AU PO473297A AU PO473297 A0 AUPO473297 A0 AU PO473297A0
Authority
AU
Australia
Prior art keywords
coating thickness
thickness control
control
coating
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AUPO4732A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Industrial Automation Services Pty Ltd
Original Assignee
Industrial Automation Services Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Industrial Automation Services Pty Ltd filed Critical Industrial Automation Services Pty Ltd
Priority to AUPO4732A priority Critical patent/AUPO473297A0/en
Publication of AUPO473297A0 publication Critical patent/AUPO473297A0/en
Assigned to INDUSTRIAL AUTOMATION SERVICES PTY LTD reassignment INDUSTRIAL AUTOMATION SERVICES PTY LTD Assignment by Applicant under S 113 Assignors: WALLACE, GLEN
Assigned to INDUSTRIAL AUTOMATION SERVICES PTY LTD reassignment INDUSTRIAL AUTOMATION SERVICES PTY LTD Alteration of Name(s) of Applicant(s) under S113 Assignors: WALLACE, GLEN
Priority to US09/341,818 priority patent/US6199301B1/en
Priority to JP53142198A priority patent/JP4020217B2/ja
Priority to AU56476/98A priority patent/AU721545B2/en
Priority to DE19881989T priority patent/DE19881989B4/de
Priority to GB9916682A priority patent/GB2336377B/en
Priority to PCT/AU1998/000030 priority patent/WO1998032890A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/16Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
    • C23C2/18Removing excess of molten coatings from elongated material
    • C23C2/20Strips; Plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H25/00After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
    • D21H25/08Rearranging applied substances, e.g. metering, smoothing; Removing excess material
    • D21H25/16Rearranging applied substances, e.g. metering, smoothing; Removing excess material with a blast of vapour or gas, e.g. air knife

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating Apparatus (AREA)
  • Coating With Molten Metal (AREA)
AUPO4732A 1997-01-22 1997-01-22 Coating thickness control Abandoned AUPO473297A0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AUPO4732A AUPO473297A0 (en) 1997-01-22 1997-01-22 Coating thickness control
US09/341,818 US6199301B1 (en) 1997-01-22 1998-01-22 Coating thickness control
JP53142198A JP4020217B2 (ja) 1997-01-22 1998-01-22 コーティング厚さ制御
AU56476/98A AU721545B2 (en) 1997-01-22 1998-01-22 Coating thickness control
DE19881989T DE19881989B4 (de) 1997-01-22 1998-01-22 Luftmessermündungsanordnung zum Betrieb in einer Luftmesseranordnung und Luftmesseranordnung
GB9916682A GB2336377B (en) 1997-01-22 1998-01-22 Coating thickness control
PCT/AU1998/000030 WO1998032890A1 (en) 1997-01-22 1998-01-22 Coating thickness control

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AUPO4732A AUPO473297A0 (en) 1997-01-22 1997-01-22 Coating thickness control

Publications (1)

Publication Number Publication Date
AUPO473297A0 true AUPO473297A0 (en) 1997-02-20

Family

ID=3799036

Family Applications (1)

Application Number Title Priority Date Filing Date
AUPO4732A Abandoned AUPO473297A0 (en) 1997-01-22 1997-01-22 Coating thickness control

Country Status (6)

Country Link
US (1) US6199301B1 (https=)
JP (1) JP4020217B2 (https=)
AU (1) AUPO473297A0 (https=)
DE (1) DE19881989B4 (https=)
GB (1) GB2336377B (https=)
WO (1) WO1998032890A1 (https=)

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US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US6749391B2 (en) 1996-07-15 2004-06-15 Semitool, Inc. Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
TW527444B (en) * 1999-04-13 2003-04-11 Semitool Inc System for electrochemically processing a workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6623609B2 (en) 1999-07-12 2003-09-23 Semitool, Inc. Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
AU2001282879A1 (en) * 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
KR20030018175A (ko) * 2001-08-27 2003-03-06 주식회사 포스코 에어나이프 노즐과 강판사이의 간격측정장치
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6630360B2 (en) 2002-01-10 2003-10-07 Advanced Micro Devices, Inc. Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US20030159921A1 (en) * 2002-02-22 2003-08-28 Randy Harris Apparatus with processing stations for manually and automatically processing microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US20040031167A1 (en) * 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US7114903B2 (en) * 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
KR20040048263A (ko) * 2002-12-02 2004-06-07 주식회사 포스코 폭방향 에어 송풍량이 조절이 가능한 에어나이프 장치
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
KR100903180B1 (ko) * 2006-05-22 2009-06-17 주식회사 엘지화학 리튬이온 폴리머 전지용 분리막의 코팅량 조절방법
US8151728B2 (en) * 2006-06-05 2012-04-10 Posco Gas wiping apparatus
CN1928147B (zh) * 2006-09-12 2012-09-19 攀钢集团攀枝花钢铁研究院 用于控制镀锌层厚度的气刀
EP2140944A1 (en) * 2008-07-03 2010-01-06 Linde AG Adjustable baffles for gas wiping
DE102008058513B4 (de) * 2008-11-21 2011-03-10 Berger, Bernd, Dr.-Ing. Vorrichtung zum Entfernen von Flüssigkeit von der Oberfläche eines bewegten Bandes und Bandbearbeitungsanlage mit solch einer Vorrichtung
JP5602371B2 (ja) * 2009-03-06 2014-10-08 三菱日立製鉄機械株式会社 ガスワイピング装置
DE102010008989B4 (de) * 2009-03-06 2018-07-26 Primetals Technologies Japan, Ltd. Gasabstreifvorrichtung
KR101125649B1 (ko) * 2010-05-24 2012-03-27 삼성에스디아이 주식회사 활물질 코팅 장치 및 이를 이용한 코팅 방법
JP5857577B2 (ja) * 2011-09-22 2016-02-10 日本電気株式会社 塗工ダイヘッド
CN103510032B (zh) * 2012-06-20 2015-12-02 鞍钢股份有限公司 冷轧热镀锌镀层均匀度的偏差值控制方法
KR102362174B1 (ko) 2018-10-01 2022-02-10 주식회사 엘지에너지솔루션 슬롯 다이 코터의 상부 토출구와 하부 토출구 간의 거리를 조절하는 슬롯 다이 코터 조정 장치 및 이를 포함하는 전극 활물질 코팅 시스템

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US2568492A (en) 1949-04-16 1951-09-18 Gen Aniline & Film Corp Adjustable nozzle
US3272176A (en) * 1964-04-13 1966-09-13 Du Pont Air knife
BE758803A (fr) * 1969-11-12 1971-04-16 Jones & Laughlin Steel Corp Procede pour controler le revetement d'un substrat
FR2090313B1 (https=) * 1970-05-27 1974-04-26 Italsider Spa
US4041895A (en) * 1975-09-29 1977-08-16 Republic Steel Corporation Coating thickness and distribution control
US4106429A (en) * 1977-05-23 1978-08-15 Beloit Corporation Air knife with adjustable lip
US4270702A (en) 1978-04-26 1981-06-02 Albany International Corp. Adjustable orifice air knife
DD152143A1 (de) * 1980-07-22 1981-11-18 Lothar Werk Vorrichtung zur erzeugung gleichmaessig dicker metallschichten auf feuermetallisiertem bandstahl
US4359964A (en) * 1981-05-20 1982-11-23 Beloit Corporation Air knife coater with pivoted lip
US4697542A (en) * 1985-05-13 1987-10-06 The Kohler Coating Machinery Corporation Adjustable nozzle for coating equipment
ATE45390T1 (de) * 1986-06-12 1989-08-15 Duma Konstruktionsbuero Abblasvorrichtung zum kontinuierlichen beidseitigen beschichten von metallband.
DE4024229C1 (https=) 1990-07-31 1991-07-18 Heinrich 4100 Duisburg De Pannenbecker
US5221345A (en) * 1990-10-12 1993-06-22 National Galvanizing Inc. Method and apparatus for coating a strip
GB9106925D0 (en) 1991-04-03 1991-05-22 Air Controls Installations Cha Air knife
FR2690170B1 (fr) 1992-04-17 1995-03-31 Clecim Sa Dispositif à lame d'air de régulation d'un dépôt métallique.
ES2152958T3 (es) * 1994-07-14 2001-02-16 Fontaine Eng & Maschinen Gmbh Aparato y metodo para el control del peso de recubrimiento de metal usando cuchillas de gas.
FR2726288B1 (fr) * 1994-10-27 1997-01-17 Clecim Sa Dispositif a lame d'air pour le reglage de l'epaisseur d'un depot

Also Published As

Publication number Publication date
WO1998032890A1 (en) 1998-07-30
JP4020217B2 (ja) 2007-12-12
DE19881989T1 (de) 2000-02-10
JP2001508358A (ja) 2001-06-26
US6199301B1 (en) 2001-03-13
GB9916682D0 (en) 1999-09-15
GB2336377A (en) 1999-10-20
GB2336377B (en) 2001-07-25
DE19881989B4 (de) 2009-05-14

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