AU8992998A - Improved stencil or mask for printing fluid material - Google Patents

Improved stencil or mask for printing fluid material

Info

Publication number
AU8992998A
AU8992998A AU89929/98A AU8992998A AU8992998A AU 8992998 A AU8992998 A AU 8992998A AU 89929/98 A AU89929/98 A AU 89929/98A AU 8992998 A AU8992998 A AU 8992998A AU 8992998 A AU8992998 A AU 8992998A
Authority
AU
Australia
Prior art keywords
mask
fluid material
printing fluid
improved stencil
stencil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU89929/98A
Inventor
David Godfrey Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micromet Ltd
Original Assignee
Micro Metallic Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9719299.1A external-priority patent/GB9719299D0/en
Priority claimed from GB9724534A external-priority patent/GB2329150A/en
Application filed by Micro Metallic Ltd filed Critical Micro Metallic Ltd
Publication of AU8992998A publication Critical patent/AU8992998A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/142—Forme preparation for stencil-printing or silk-screen printing using a galvanic or electroless metal deposition processing step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B41N1/248—Mechanical details, e.g. fixation holes, reinforcement or guiding means; Perforation lines; Ink holding means; Visually or otherwise detectable marking means; Stencil units

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
AU89929/98A 1997-09-11 1998-09-08 Improved stencil or mask for printing fluid material Abandoned AU8992998A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GBGB9719299.1A GB9719299D0 (en) 1997-09-11 1997-09-11 Improved stencil or mask for printing fluid material
GB9719299 1997-09-11
GBGB9721833.3A GB9721833D0 (en) 1997-09-11 1997-10-16 Improved stencil or mask for printing fluid material
GB9721833 1997-10-16
GB9724534 1997-11-21
GB9724534A GB2329150A (en) 1997-09-11 1997-11-21 Improved stencil or mask for printing fluid material
PCT/GB1998/002698 WO1999013695A1 (en) 1997-09-11 1998-09-08 Improved stencil or mask for printing fluid material

Publications (1)

Publication Number Publication Date
AU8992998A true AU8992998A (en) 1999-03-29

Family

ID=27269014

Family Applications (1)

Application Number Title Priority Date Filing Date
AU89929/98A Abandoned AU8992998A (en) 1997-09-11 1998-09-08 Improved stencil or mask for printing fluid material

Country Status (2)

Country Link
AU (1) AU8992998A (en)
WO (1) WO1999013695A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6189448B1 (en) 1997-11-07 2001-02-20 O'neal Dennis Dual image stencil apparatus having stencil including sections with curled edges

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147887A (en) * 1987-12-04 1989-06-09 Showa Electric Wire & Cable Co Ltd Material for connecting circuit board
GB2264460B (en) * 1992-06-03 1994-02-16 David Godfrey Williams Improved stencil or mask for applying solder to circuit boards and support frame
GB2276589B (en) * 1993-04-03 1996-07-31 David Godfrey Williams Improved stencil or mask for applying solder to circuit boards
JP3431667B2 (en) * 1993-07-17 2003-07-28 有限会社森板金製作所 Metal mask for cream solder and mounting method to frame
WO1995026123A1 (en) * 1994-03-23 1995-09-28 Dyconex Patente Ag Method of preparing foil printed circuit boards or semi-finished products for foil printed circuit boards
DE4438281C1 (en) * 1994-10-26 1996-04-18 Koenen Gmbh Printing screen
GB2303333B (en) * 1995-07-20 1998-09-23 David Godfrey Williams Improved apparatus for supporting and tensioning a stencil or mask for use in applying solder paste to circuit boards and a mounting support means therefor
GB2307446A (en) * 1995-11-25 1997-05-28 Ibm Solder paste deposition

Also Published As

Publication number Publication date
WO1999013695A1 (en) 1999-03-18

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