AU8961982A - Apparatus for removal of integrated circuits from circuit boards - Google Patents

Apparatus for removal of integrated circuits from circuit boards

Info

Publication number
AU8961982A
AU8961982A AU89619/82A AU8961982A AU8961982A AU 8961982 A AU8961982 A AU 8961982A AU 89619/82 A AU89619/82 A AU 89619/82A AU 8961982 A AU8961982 A AU 8961982A AU 8961982 A AU8961982 A AU 8961982A
Authority
AU
Australia
Prior art keywords
housing
printed circuit
circuit boards
removal
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU89619/82A
Other versions
AU560664B2 (en
Inventor
Haim Stalryd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ERSA ERNST SACHS KG AND CO GmbH
Original Assignee
Ersa Ernst Sachs KG Co GmbH
ERSA ERNST SACHS KG AND CO GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa Ernst Sachs KG Co GmbH, ERSA ERNST SACHS KG AND CO GmbH filed Critical Ersa Ernst Sachs KG Co GmbH
Publication of AU8961982A publication Critical patent/AU8961982A/en
Application granted granted Critical
Publication of AU560664B2 publication Critical patent/AU560664B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0486Replacement and removal of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components

Abstract

1. Device for the desoldering of electronic components from printed circuit boards, having a device for melting the soldered joints, having a draw-off device comprising a resilient gripper, which is at least partially enclosed by a housing and which is fitted at a pull rod which stands under spring action, and having a device for removing solder residues from the bores of the printed circuit board, characterized in that the device for removing solder residues is formed from the housing (46) of the resilient gripper (36) and a compressed air duct (50), which is attached thereto and which is connected to a compressed air source, and in that the housing (46) entirely receives the resilient gripper (36) and the electronic component (80) and rests by its lower, circulating rim (47) on the printed circuit board (80).
AU89619/82A 1981-11-11 1982-10-20 Apparatus for removal of integrated circuits from circuit boards Ceased AU560664B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL8164277A IL64277A0 (en) 1981-11-11 1981-11-11 Apparatus for removal of integrated circuits from circuit boards
IL64277 1981-11-12

Publications (2)

Publication Number Publication Date
AU8961982A true AU8961982A (en) 1983-05-19
AU560664B2 AU560664B2 (en) 1987-04-16

Family

ID=11053044

Family Applications (1)

Application Number Title Priority Date Filing Date
AU89619/82A Ceased AU560664B2 (en) 1981-11-11 1982-10-20 Apparatus for removal of integrated circuits from circuit boards

Country Status (6)

Country Link
EP (1) EP0079848B1 (en)
KR (1) KR860001106B1 (en)
AT (1) ATE29643T1 (en)
AU (1) AU560664B2 (en)
DE (1) DE3277285D1 (en)
IL (1) IL64277A0 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3786000T3 (en) * 1986-08-18 1997-08-21 Dow Chemical Co Conjugate dense stars.
DE4122615A1 (en) * 1991-07-09 1993-01-14 Manfred Bahnemann Recycling Sy METHOD FOR REMOVING PCB ASSEMBLIES
US5715592A (en) * 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
DE19510985A1 (en) * 1995-03-24 1996-09-26 Asscon Systech Elektronik Gmbh Device for unsoldering components, in particular electronic components
US10362720B2 (en) * 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3644980A (en) * 1969-06-25 1972-02-29 Pace Inc Component removal device
DE2655773A1 (en) * 1976-12-09 1978-06-15 Fortune William S Additional tool for soldering device - has heating element heating solder on contact pins, and unit designed for placing or removing components
DE2925347A1 (en) * 1979-06-22 1981-01-15 Siemens Ag Hot air blower for unsoldering faulty component - has heated suction nozzle for removing surplus solder from connection points and holes

Also Published As

Publication number Publication date
EP0079848A2 (en) 1983-05-25
KR840002803A (en) 1984-07-16
KR860001106B1 (en) 1986-08-07
ATE29643T1 (en) 1987-09-15
DE3277285D1 (en) 1987-10-15
IL64277A0 (en) 1982-02-28
AU560664B2 (en) 1987-04-16
EP0079848B1 (en) 1987-09-09
EP0079848A3 (en) 1985-05-29

Similar Documents

Publication Publication Date Title
EP0279604A3 (en) Focused convection reflow soldering method and apparatus
JPS5791874A (en) Device for removing solder
EP0233018A3 (en) Soldering device
GB2131331B (en) Method and apparatus for mounting multilead components on a circuit board
EP0649699A3 (en) Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering.
FR2546024B1 (en) APPARATUS FOR AUTOMATICALLY MOUNTING CHIP-TYPE CIRCUIT ELEMENTS ON PRINTED CIRCUIT BOARDS
CA2018496A1 (en) Method of attaching electronic components
MY117033A (en) Unit part mounting structure
CA2073008A1 (en) Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
AU560664B2 (en) Apparatus for removal of integrated circuits from circuit boards
EP0062692A3 (en) Method for the removal of solder from drill holes of non furnished printed-circuit boards clad with solder
GB2036625B (en) Apparatus for soldering components mounted on printed circuit boards
DE3573974D1 (en) Device for soldering and desoldering surface-mounted components
FI900788A0 (en) Capacitance fine tuner connected to the component
CA2054407A1 (en) Method and apparatus for solder leveling of printed circuit boards
CA2104540A1 (en) Solder Paste
MY111173A (en) Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing circuit board
DE69013676T2 (en) Device for holding a connector pin when mounting it.
DE3264873D1 (en) Soldering apparatus for printed circuit board
EP0524812A3 (en) Method and apparatus for connecting a device to a printed circuit board
KR930003300B1 (en) Apparatus for the inspection of printed circuit boards on which components have been mounted
KR940008543A (en) Printed wiring board
MY113624A (en) Soldering apparatus and a method thereof
HAUTER Surface mounted device influence on equipment reliability
JPS56115599A (en) Method of soldering electronic circuit component on printed circuit board