AU7746000A - Atmospheric process and system for controlled and rapid removal of polymers fromhigh depth to width aspect ratio holes - Google Patents

Atmospheric process and system for controlled and rapid removal of polymers fromhigh depth to width aspect ratio holes

Info

Publication number
AU7746000A
AU7746000A AU77460/00A AU7746000A AU7746000A AU 7746000 A AU7746000 A AU 7746000A AU 77460/00 A AU77460/00 A AU 77460/00A AU 7746000 A AU7746000 A AU 7746000A AU 7746000 A AU7746000 A AU 7746000A
Authority
AU
Australia
Prior art keywords
fromhigh
polymers
depth
controlled
aspect ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU77460/00A
Inventor
Lynn David Bollinger
Iskander Tokmouline
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jetek Inc
Original Assignee
Jetek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jetek Inc filed Critical Jetek Inc
Publication of AU7746000A publication Critical patent/AU7746000A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00—Welding or cutting by means of a plasma
    • B23K10/003—Scarfing, desurfacing or deburring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Arc Welding In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AU77460/00A 1999-09-28 2000-09-28 Atmospheric process and system for controlled and rapid removal of polymers fromhigh depth to width aspect ratio holes Abandoned AU7746000A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15640799P 1999-09-28 1999-09-28
US60156407 1999-09-28
PCT/US2000/027113 WO2001023130A1 (en) 1999-09-28 2000-09-28 Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes

Publications (1)

Publication Number Publication Date
AU7746000A true AU7746000A (en) 2001-04-30

Family

ID=22559445

Family Applications (1)

Application Number Title Priority Date Filing Date
AU77460/00A Abandoned AU7746000A (en) 1999-09-28 2000-09-28 Atmospheric process and system for controlled and rapid removal of polymers fromhigh depth to width aspect ratio holes

Country Status (4)

Country Link
EP (1) EP1246710A4 (en)
JP (2) JP2003510824A (en)
AU (1) AU7746000A (en)
WO (1) WO2001023130A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001023130A1 (en) * 1999-09-28 2001-04-05 Jetek, Inc. Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes
US6955991B2 (en) * 1999-11-01 2005-10-18 Jetek, Inc. Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes
FR2913972B1 (en) * 2007-03-21 2011-11-18 Saint Gobain METHOD FOR MANUFACTURING A MASK FOR CARRYING OUT A GRID

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6159834A (en) * 1984-08-31 1986-03-27 Hitachi Ltd Detecting method of end point of etching
US4783695A (en) * 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
US4891303A (en) * 1988-05-26 1990-01-02 Texas Instruments Incorporated Trilayer microlithographic process using a silicon-based resist as the middle layer
US5173442A (en) * 1990-07-23 1992-12-22 Microelectronics And Computer Technology Corporation Methods of forming channels and vias in insulating layers
US5314709A (en) * 1991-03-20 1994-05-24 International Business Machines Corporation Unzippable polymer mask for screening operations
CA2097388A1 (en) * 1992-07-16 1994-01-17 Susan Nord Bohlke Topographical selective patterns
JP2787646B2 (en) * 1992-11-27 1998-08-20 三菱電機株式会社 Method for manufacturing semiconductor device
US5302547A (en) * 1993-02-08 1994-04-12 General Electric Company Systems for patterning dielectrics by laser ablation
JP3147137B2 (en) * 1993-05-14 2001-03-19 セイコーエプソン株式会社 Surface treatment method and device, semiconductor device manufacturing method and device, and liquid crystal display manufacturing method
JPH09246252A (en) * 1996-03-01 1997-09-19 Sony Corp Method and device for manufacturing semiconductor
JP2000511344A (en) * 1996-05-31 2000-08-29 アイペック・プリシジョン・インコーポレーテッド Apparatus for generating and deflecting a plasma jet
KR20000016136A (en) * 1996-05-31 2000-03-25 피터 무몰라 Method for treating articles with a plasma jet
US5968283A (en) * 1996-10-25 1999-10-19 Lucent Technologies Inc. Method for heat stripping optical fibers
WO2001023130A1 (en) * 1999-09-28 2001-04-05 Jetek, Inc. Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes

Also Published As

Publication number Publication date
JP2007235138A (en) 2007-09-13
EP1246710A1 (en) 2002-10-09
EP1246710A4 (en) 2007-07-04
WO2001023130A1 (en) 2001-04-05
JP2003510824A (en) 2003-03-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase