AU7645300A - Encapsulation for a three-dimensional microsystem - Google Patents

Encapsulation for a three-dimensional microsystem

Info

Publication number
AU7645300A
AU7645300A AU76453/00A AU7645300A AU7645300A AU 7645300 A AU7645300 A AU 7645300A AU 76453/00 A AU76453/00 A AU 76453/00A AU 7645300 A AU7645300 A AU 7645300A AU 7645300 A AU7645300 A AU 7645300A
Authority
AU
Australia
Prior art keywords
encapsulation
dimensional microsystem
microsystem
dimensional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU76453/00A
Inventor
Jens Anders Branebjerg
Jacob Janting
Pirmin Rombach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DELTA DANISH ELECTRONICS LIGHT AND ACOUSTICS
Original Assignee
DELTA DANISH ELECTRONICS LIGHT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DELTA DANISH ELECTRONICS LIGHT filed Critical DELTA DANISH ELECTRONICS LIGHT
Publication of AU7645300A publication Critical patent/AU7645300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/069—Protection against electromagnetic or electrostatic interferences
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
AU76453/00A 1999-10-05 2000-10-05 Encapsulation for a three-dimensional microsystem Abandoned AU7645300A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DKPA199901428 1999-10-05
DKPA199901428 1999-10-05
PCT/DK2000/000559 WO2001026136A2 (en) 1999-10-05 2000-10-05 Encapsulation for a three-dimensional microsystem

Publications (1)

Publication Number Publication Date
AU7645300A true AU7645300A (en) 2001-05-10

Family

ID=8104737

Family Applications (1)

Application Number Title Priority Date Filing Date
AU76453/00A Abandoned AU7645300A (en) 1999-10-05 2000-10-05 Encapsulation for a three-dimensional microsystem

Country Status (2)

Country Link
AU (1) AU7645300A (en)
WO (1) WO2001026136A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
DE10238523B4 (en) 2002-08-22 2014-10-02 Epcos Ag Encapsulated electronic component and method of manufacture
EP1716400A1 (en) * 2004-02-09 2006-11-02 Robert Bosch Gmbh Corrosion protection for pressure sensors
DE102004020204A1 (en) 2004-04-22 2005-11-10 Epcos Ag Encapsulated electrical component and method of manufacture
US8325047B2 (en) 2009-04-08 2012-12-04 Sabic Innovative Plastics Ip B.V. Encapsulated RFID tags and methods of making same
CN109950237A (en) * 2017-12-21 2019-06-28 北京万应科技有限公司 Sensor microsystems packaging method and sensor microsystems
WO2023196645A1 (en) * 2022-04-07 2023-10-12 Aculon, Inc. Electronic circuit packages with reduced mold flash adhesion methods for reducing mold flash adhesion to metal leadframes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
JPS60140739A (en) * 1983-12-28 1985-07-25 Hitachi Ltd Plastic ic package having passivation structure
JPS61125022A (en) * 1984-11-21 1986-06-12 Nec Corp Manufacture of hybrid integrated circuit
DE4040822A1 (en) * 1990-12-20 1992-07-02 Bosch Gmbh Robert Depositing protective layers on mounted chips - sets chip eccentrically on turntable and partly centrifuges protective layer for uniform distribution
JPH0735628A (en) * 1993-07-16 1995-02-07 Kyowa Electron Instr Co Ltd Structure and method for covering strain gate affixed part
US5889211A (en) * 1995-04-03 1999-03-30 Motorola, Inc. Media compatible microsensor structure and methods of manufacturing and using the same
FR2764113B1 (en) * 1997-05-28 2000-08-04 Motorola Semiconducteurs SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

Also Published As

Publication number Publication date
WO2001026136A3 (en) 2001-12-13
WO2001026136A2 (en) 2001-04-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase