AU7537074A - Header assembly - Google Patents

Header assembly

Info

Publication number
AU7537074A
AU7537074A AU75370/74A AU7537074A AU7537074A AU 7537074 A AU7537074 A AU 7537074A AU 75370/74 A AU75370/74 A AU 75370/74A AU 7537074 A AU7537074 A AU 7537074A AU 7537074 A AU7537074 A AU 7537074A
Authority
AU
Australia
Prior art keywords
header assembly
header
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU75370/74A
Other languages
English (en)
Inventor
Suel Grant Shannon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of AU7537074A publication Critical patent/AU7537074A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10333Individual female type metallic connector elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
AU75370/74A 1973-12-06 1974-11-14 Header assembly Expired AU7537074A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42248973A 1973-12-06 1973-12-06

Publications (1)

Publication Number Publication Date
AU7537074A true AU7537074A (en) 1976-05-20

Family

ID=23675116

Family Applications (1)

Application Number Title Priority Date Filing Date
AU75370/74A Expired AU7537074A (en) 1973-12-06 1974-11-14 Header assembly

Country Status (14)

Country Link
JP (1) JPS50106158A (es)
AR (1) AR202955A1 (es)
AU (1) AU7537074A (es)
BE (1) BE822814A (es)
BR (1) BR7409884A (es)
CA (1) CA1005154A (es)
CH (1) CH579339A5 (es)
DE (1) DE2457351A1 (es)
ES (1) ES207987Y (es)
FR (1) FR2254175B1 (es)
GB (1) GB1487854A (es)
IT (1) IT1025935B (es)
NL (1) NL7415389A (es)
SE (1) SE7415273L (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103985A (en) * 1977-02-22 1978-08-01 Bunker Ramo Corporation Connector adapter constructions with improved connection and connector mounting arrangement
DE102009028499A1 (de) * 2009-08-13 2011-02-17 Endress + Hauser Gmbh + Co. Kg Verfahren zur Bestückung und zum Löten von gemischt bestückbaren Leiterplatten

Also Published As

Publication number Publication date
ES207987Y (es) 1976-07-16
AR202955A1 (es) 1975-07-31
IT1025935B (it) 1978-08-30
GB1487854A (en) 1977-10-05
JPS50106158A (es) 1975-08-21
SE7415273L (es) 1975-06-09
BE822814A (fr) 1975-05-29
DE2457351A1 (de) 1975-06-12
ES207987U (es) 1976-03-16
CH579339A5 (es) 1976-08-31
FR2254175A1 (es) 1975-07-04
NL7415389A (nl) 1975-06-10
BR7409884A (pt) 1976-05-25
FR2254175B1 (es) 1978-09-15
CA1005154A (en) 1977-02-08

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AU7537074A (en) Header assembly