AU717619B2 - Device for reducing near-end crosstalk - Google Patents
Device for reducing near-end crosstalk Download PDFInfo
- Publication number
- AU717619B2 AU717619B2 AU24920/97A AU2492097A AU717619B2 AU 717619 B2 AU717619 B2 AU 717619B2 AU 24920/97 A AU24920/97 A AU 24920/97A AU 2492097 A AU2492097 A AU 2492097A AU 717619 B2 AU717619 B2 AU 717619B2
- Authority
- AU
- Australia
- Prior art keywords
- paths
- connector
- crosstalk
- pairs
- vertically aligned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
- H01R13/7195—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with planar filters with openings for contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
S F Ref: 380318
AUSTRALIA
PATENTS ACT 1990 COMPLETE SPECIFICATION FOR A STANDARD PATENT
ORIGINAL
I I Name and Address of Applicant: Lucent Technologies Inc 600 Mountain Avenue Murray Hill New Jersey 07974-0636 UNITED STATES OF AMERICA Golam Mabud Choudhury, Theodore Alan Conorich, Michael Gregory German, Amid Ihsan Hashim, Ronald William Kohl, Julian Robert Pharney Actual Inventor(s): Address for Service: Invention Title: Spruson Ferguson, Patent Attorneys Level 33 St Martins Tower, 31 Market Street Sydney, New South Wales, 2000, Australia Device for Reducing Near-End Crosstalk The following statement is a full description of this invention, including the best method of performing It known to me/us:- 5845 DEVICE FOR REDUCING NEAR-END CROSSTALK Field of the Invention This invention relates to electrical connectors., and in particular to a device for reducing crosstalk in connectors.
Background of the Invention Standards for crosstalk in connectors has become increasingly stringent.
For example, in category 5 of ANSI/TIA/EIA-568A Standard, it is required that a pair ribbon cable connector exhibit pair to pair near-end crosstalk loss which is better than 40dB at 100 MHz. Since the 25 pair miniature ribbon connector is designed to carry the signals for a multitude of work stations, this requirement has to be met on a power sum basis. This is a more stringent requirement since for each pair, crosstalk couplings from all the other pairs must be considered.
Recently, it has been proposed to produce a category 5 connector by inclusion of conductors in a side-by-side relation to provide crosstalk of a polarity opposite to that of the mating section of the connector. (See U.S. Patent Application Serial No. 08/263,111 filed June 21, 1994.) It has also been proposed to reduce crosstalk, for example in modular jacks, by crossing over certain conductors. (See U.S. Patent No. 5,186,647 issued to Denkmann et al.).
It has also been suggested that certain conductors in a modular jack could be mounted above certain other conductors to provide capacitive coupling and thereby induce opposite polarity crosstalk. The conductors could be formed as lead fr-ames or printed on a printed circuit board. (See British Patent No. 2,271,678 issued to Pinney et al.) It has also been suggested that a printed wiring board connector could compensate for crosstalk in its mating section by including capacitive coupling unbalance between conductor pairs which produced crosstalk of an opposite polarity.
(See, U.S. Patent Application of Conorich et al, case 5-8-1, filed on an even date herewith.) Since most multi-pair printed circuit board connectors, however, are not capable of category 5 performance, it is desirable to provide a device which can economically convert such connectors to category 5 by reducing the crosstalk exhibited by the connectors.
-2- Summary of the Invention The invention is a device for compensating for near-end crosstalk of a first polarity exhibited by an electrical connector including contacts. The device comprises an insulating board including a phurality of layers. At least selected layers include on a surface thereof a plurality of pairs of essentially parallel conductive paths. Each path is vertically aligned with corresponding paths in other layers of the device to form an array which comprises a capacitor plate so that a plurality of capacitor plates is formed. The capacitor plates are arranged to provide capacitive coupling unbalance between adjacent pairs when a voltage is supplied thereto to produce near-end crosstalk of a second plurality which is opposite to the first polarity. The device further includes means for electrically connecting the connector contacts to the paths.
Brief Description of the Fizure These and other features of the invention are delineated in detail in the :15 following description. In the drawing: FIG. 1 is a frontal exploded view of an assembly in accordance with an embodiment of the invention; FIG. 2 is a partly schematic plan view of a device in accordance with the same embodiment; FIG. 3 is a cross sectional view taken along line 3-3 of FIG. 2; FIG. 4 is a cross sectional view ta ken along line 4-4 of FIG. 2; and FIG. 5 is an enlarged, schematic view of a portion of the device.
will be appreciated that, for purposes of illustration, these figures are not necessarily drawn to scale.
Detailed Description Referring now to the drawings, in which like reference numerals identify similar or identical elements, FIG. I illustrates an assembly which will result in reduced crosstalk in accordance with an embodiment of the invention. A standard connector, 10, includes an insulating housing, 11, which encloses a plurality of contacts. The contacts at one end, 12, form a mating section for receiving a standard cable connector (not shown), for example, a 25 pair cable connector. The other ends of the contacts are formed into pins or eyelets, 13. Device 15 and printed circuit board 14 provide means of attachment and electrical connection to each pin or eyelet, 13. It is known that the connector, 10, will produce a certain amount of crosstalk in the form of induced voltage of a certain polarity in the mating -3section, 12. Unless some means are provided within the connector, 10, for reducing crosstalk, the connector will usually not provide category 5 performance. However, by providing a device, 15,,to be described, between the connector, 10, and circuit board, 14, a category 3 or 4 connector, for example, which exhibits 28-32 dB power sum near end crosstalk at 100 MIHz, can be used in combination with the device, to produce category 5 performance exhibiting better than 40 dB power sum near-end crosstalk loss at 100 NIHz.
An example of the device, 15, is shown in more detail in the views of FIGS. 2-5. The device comprises an insulating substrate, 16, which in this example is a printed circuit board material such as FR-4. The substrate, 16, is made up of several dielectric layers, 17 and 18, separated by epoxy layers, 19 in a manner known in the art.
On at least selected dielectric layers, and in this example on each dielectric layer, are formed a plurality of pairs of conductor paths, 20 and 21, 22 and 23, and 30 and 31, which can be deposited on each major surface of each dielectric layer and patterned by standard techniques such as photolithography.
While eight layers of conductor paths are shown in this example, it will be appreciated that any number can be employed. Each path, 20, is essentially parallel to the other path, 21, in the pair, and typically is made of copper with a length, 1, of 0.01143 meters, a width, a, of 0.0002 meters and a thickness, h, of 0.00004 meters. Each path, 20, is also vertically aligned with corresponding paths, 30, in all the layers of the device, as best seen in FIG. 3. The thicknesses of the layers, 17-19, are chosen to provide a separation, t, between aligned paths in the vertical direction. This separation is typically .025-25 mm. On at least one end of each of the paths, and in this example on both ends, is a via hole, 24, 25, 26, and 27. The via holes permit a common electrical connection between each path, 20 and 30, which is vertically aligned in the several layers. Each path has approximately the same length, but in this embodiment, for reasons discussed later, the paths of adjacent pairs on each layer are shifted in the horizontal direction by an amount, u, as illustrated in FIG. 2.
Between each path in a conductor pair is a pair of plated through holes, T I and R 1 Each hole is labelled with a or an and a subscript to indicate that the hole will receive a pin, 13 of FIG. 1, from the connector which corresponds to a Tip M or Ring contact. Consequently, the holes T 1 T 5 and R I R 5 are aligned in corresponding rows to match the footprint of the connector, Conductive traces, 28 and 29, are provided between each plated through hole, T I and R 1 respectively, and its corresponding path, 20 and 21, respectively, -4on at least one layer to permit electrical connection between the pins of the connector, 10, and their appropriate path when the pins are inserted into the plated through holes.
In accordance with a primary feature of the invention, when the connector pins are inserted through the plated through holes, T I T 5 and R I R 5 and a voltage is supplied thereto, each array of vertically aligned paths, 21, 3 1, and 41, in the several layers will electrically act as a single solid capacitor plate.
Each capacitor plate coupled to a connector pin of one type, Ring, will provide capacitive coupling to an adjacent plate, 22, 32, and 42, which is coupled to a pin of another type, Tip to produce capacitive coupling unbalance between the pairs. This phenomenon is made possible by the overlapping of the electric fields associated with each path as illustrated schematically in FIG. 5. As shown, even though each path, 21 and 31', is a physically separate element, the vertical separation, t, of the paths is sufficiently small so that the electric fields (illustrated by arrows) between the adjacent paths, 21 and 22, and 31 and 32, will overlap sufficiently in the vertical direction so that each vertically aligned array of paths acts like a single plate. It is known from Walker, Capacitance, Inductance and Crosstalk Analysis (Artech House 1990) at page 51 that the capacitive coupling, C 1 between adjacent inner layer paths, 31 and 32, is, given by: 1= R re I n h~ 11(1 where e 0 is the dielectric constant of free space, e, is the dielectric constant of the layers 17-19, 1 is the length of the paths, and d is the horizontal spacing of the paths. The capacitive coupling, C 2 which would occur between, e.g., 31 and 32, paths if the vertical paths, 21 and 31, and 22 and 32, were single plates, is given by: C=eoer(h+t) e
C
2 d (2) Equations 1 and 2 can be solved for by setting C 1 equal to C 2 to give the appropriate maximum separation for the vertically aligned paths to electrically act as single solid plates. In one examnple, the spacing, d, was 203 microns, the width, a, of each path was 152 microns, and the thickness, h, of the paths was 35.6 microns giving a maximum separation of 394.9 microns.
This capacitive coupling between unlike paths, R and T 2 produces crosstalk which is opposite in polarity to the crosstalk produced in the mating section, 12, of the connector, 10, since the mating section produces crosstalk between adjacent tip conductors or adjacent ring conductors. Thus, an appropriate choice of the size of the paths and distance, d, between the paths will produce sufficient crosstalk in the element, 15, to essentially cancel out the crosstalk produced in the connector, 10. The primary objective is to cancel out enough crosstalk from the mating region to produce power sum near-end crosstalk loss performance of better than 40 dB at 100 MHz.
It should be appreciated that there will also be coupling between each vertically aligned array of paths, 21, 31, and 41, and the vertically aligned unlike paths, 62,72, and 82, in the next adjacent pair. The coupling will not be as 15 great as that between adjacent pairs since the distance, d 1 between the paths will be much greater. Therefore, to increase the coupling between non-adjacent paths, the conductor pairs are staggered by an amount, u, as shown in FIG. 2. The area of *capacitive coupling between adjacent unlike paths, 21 and 22, is illustrated by the cross hatched region, 60, and the area of coupling between unlike paths in the next adjacent pair, 21 and 62, is illustrated by the speckled region, 61. As shown, the staggering of the positions of adjacent pairs offers a wider area for coupling between non adjacent pairs to at least partially overcome the larger separation.
Once the appropriate layer thickness is chosen so that each vertical array of paths can be treated as a single capacitor plate, the parameters for producing the 25 desired power sum performance can be determined according to the analysis described in U.S. Patent Application of Conorich et al, case 5-8-1, filed on an even date herewith and incorporated by reference herein.
Various modifications are possible. For example, the via holes, e.g., 24-27, can be eliminated and electrical connection between the connector, 10, and the paths on each layer provided by including trace conductors such as 28 and 29 from the plated through holes, T 1 and R 1 to the appropriate paths on each layer. Further, each path on a layer can be aligned rather than offset as shown in FIG. 2 if desired. In addition, the device 15 could be integrated into a portion of the printed circuit board, 14, to which the connector, 11, is mounted.
Claims (6)
1. A device for compensating for near-end crosstalk of a first polarity and first magnitude exhibited by an electrical connector (10) including contacts, said device CHARACTERIZED BY: an insulating board (16) including a plurality of layers 17, 18,19); a plurality of pairs of essentially parallel conductive paths 20, and 21, 22 and 23, and 30,3 1) formed on a surface of at least selected layers, each path being vertically aligned with corresponding paths in other layers to form an array which comprises a capacitor plate so that a plurality of capacitor plates are formed in the device, the capacitor plates being arranged to provide capacitive coupling unbalance between adjacent pairs when a voltage is supplied thereto to produce near-end crosstalk of a second polarity which is opposite to the first polarity; and I; 1 cotact tomeans 24,25,26 and 27) for electrically connecting the connector poart 2. T1he device according to claim 1 wherein the crosstalk of a second poart has a second magnitude which is essentially equal to the first magnitude.
3. The device according to claim 1 wherein the vertical separation (t) between the paths is such that any electrical fields between adjacent paths overlap sufficiently in the vertical direction to provide the electrical equivalent of a solid plate from the vertically aligned paths. The device according to claim 3 wherein the vertical separation is within the range .025 to 25 mm. The device according to claim 1 wherein the means for connecting the connector contacts comprises a plurality of plated through holes (TR) extending through the board arranged to receive the contacts from the connector, and conductive traces 28,29) extending from each hole to a corresponding path on at least one surface of the board.
6. The device according to claim 5 wherein the means for coupling further comprises a plurality of plated via holes 24,25,26 and 27), each via hole electrically connecting the paths in a corresponding vertically aligned array.
7. The device according to claim 1 wherein at least some of the arrays of -7- vertically aligned paths are also positioned to provide additional capacitive coupling unbalance between next adjacent pairs.
8. The device according to claim 7 wherein the conductive pairs are horizontally offset in position relative to adjacent conductive pairs.
9. The device according to claim 1 further comprising the connector and a printed circuit board to which the connector and device are mounted. A device for compensating for near-end crosstalk in an electrical connector substantially as described herein with reference to the drawings. DATED this THIRTIETH day of MAY 1997 Lucent Technologies Inc. SPatent Attorneys for the Applicant SPRUSON FERGUSON 00* 0 •00 o VSG:1021F
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66855396A | 1996-06-21 | 1996-06-21 | |
US08/668553 | 1996-06-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2492097A AU2492097A (en) | 1998-01-08 |
AU717619B2 true AU717619B2 (en) | 2000-03-30 |
Family
ID=24682793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU24920/97A Ceased AU717619B2 (en) | 1996-06-21 | 1997-06-16 | Device for reducing near-end crosstalk |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU717619B2 (en) |
GB (1) | GB2314466B (en) |
NZ (1) | NZ328143A (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6107578A (en) * | 1997-01-16 | 2000-08-22 | Lucent Technologies Inc. | Printed circuit board having overlapping conductors for crosstalk compensation |
US6334792B1 (en) | 1999-01-15 | 2002-01-01 | Adc Telecommunications, Inc. | Connector including reduced crosstalk spring insert |
CA2360363A1 (en) | 1999-01-15 | 2000-07-20 | Adc Telecommunications Inc. | Telecommunications jack assembly |
US6165018A (en) * | 1999-04-27 | 2000-12-26 | Lucent Technologies Inc. | Connector having internal crosstalk compensation |
US6250968B1 (en) * | 1999-07-14 | 2001-06-26 | Berg Technology, Inc. | Electrical connector system with cross-talk compensation |
US6089923A (en) * | 1999-08-20 | 2000-07-18 | Adc Telecommunications, Inc. | Jack including crosstalk compensation for printed circuit board |
US6520806B2 (en) | 1999-08-20 | 2003-02-18 | Adc Telecommunications, Inc. | Telecommunications connector for high frequency transmissions |
US6520807B2 (en) | 1999-11-12 | 2003-02-18 | Fci Americas Technology, Inc. | Electrical connector system with low cross-talk |
US6511344B2 (en) | 2001-07-02 | 2003-01-28 | Fci Americas Technology, Inc. | Double-deck electrical connector with cross-talk compensation |
US6814624B2 (en) | 2002-11-22 | 2004-11-09 | Adc Telecommunications, Inc. | Telecommunications jack assembly |
US7402085B2 (en) * | 2006-04-11 | 2008-07-22 | Adc Gmbh | Telecommunications jack with crosstalk compensation provided on a multi-layer circuit board |
WO2008048467A2 (en) | 2006-10-13 | 2008-04-24 | Adc Gmbh | Connecting hardware with multi-stage inductive and capacitive crosstalk compensation |
US8393689B2 (en) | 2006-12-22 | 2013-03-12 | The Boeing Company | Autobraking interlock for an aircraft electric brake system |
AU2007201107B2 (en) | 2007-03-14 | 2011-06-23 | Tyco Electronics Services Gmbh | Electrical Connector |
AU2007201105B2 (en) | 2007-03-14 | 2011-08-04 | Tyco Electronics Services Gmbh | Electrical Connector |
AU2007201113B2 (en) | 2007-03-14 | 2011-09-08 | Tyco Electronics Services Gmbh | Electrical Connector |
AU2007201114B2 (en) | 2007-03-14 | 2011-04-07 | Tyco Electronics Services Gmbh | Electrical Connector |
AU2007201102B2 (en) | 2007-03-14 | 2010-11-04 | Tyco Electronics Services Gmbh | Electrical Connector |
AU2007201108B2 (en) | 2007-03-14 | 2012-02-09 | Tyco Electronics Services Gmbh | Electrical Connector |
AU2007201109B2 (en) | 2007-03-14 | 2010-11-04 | Tyco Electronics Services Gmbh | Electrical Connector |
AU2007201106B9 (en) | 2007-03-14 | 2011-06-02 | Tyco Electronics Services Gmbh | Electrical Connector |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5268810A (en) * | 1993-01-08 | 1993-12-07 | Honeywell Inc. | Electrical connector incorporating EMI filter |
US5326284A (en) * | 1992-06-25 | 1994-07-05 | Northern Telecom Limited | Circuit assemblies of printed circuit boards and telecommunications connectors |
US5547405A (en) * | 1993-12-03 | 1996-08-20 | Itt Industries Limited | Crosstalk suppressing connector |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5497129A (en) * | 1994-06-27 | 1996-03-05 | General Motors Corporation | Filter elements having ferroelectric-ferromagnetic composite materials |
-
1997
- 1997-06-09 GB GB9711853A patent/GB2314466B/en not_active Expired - Fee Related
- 1997-06-16 AU AU24920/97A patent/AU717619B2/en not_active Ceased
- 1997-06-20 NZ NZ328143A patent/NZ328143A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5326284A (en) * | 1992-06-25 | 1994-07-05 | Northern Telecom Limited | Circuit assemblies of printed circuit boards and telecommunications connectors |
US5268810A (en) * | 1993-01-08 | 1993-12-07 | Honeywell Inc. | Electrical connector incorporating EMI filter |
US5547405A (en) * | 1993-12-03 | 1996-08-20 | Itt Industries Limited | Crosstalk suppressing connector |
Also Published As
Publication number | Publication date |
---|---|
GB2314466B (en) | 1998-05-27 |
NZ328143A (en) | 1998-09-24 |
GB9711853D0 (en) | 1997-08-06 |
AU2492097A (en) | 1998-01-08 |
GB2314466A (en) | 1997-12-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU717619B2 (en) | Device for reducing near-end crosstalk | |
AU720162B2 (en) | Electrical connector with crosstalk compensation | |
AU724167B2 (en) | Printed circuit board including crosstalk compensation | |
KR100778215B1 (en) | Electrical Connector System with Cross-Talk Compensation Circuit Substrate for Creating Compensating Cross-Talk and Method of Reducing Unwanted Cross-Talk | |
US5940959A (en) | Communication connector with capacitor label | |
CN104956776B (en) | Printed circuit board with orthogonal signal channel | |
EP1435679B1 (en) | Electronic connector and method of performing electronic connection | |
US4494172A (en) | High-speed wire wrap board | |
US7252554B2 (en) | Methods and apparatus for reducing crosstalk in electrical connectors | |
US6520807B2 (en) | Electrical connector system with low cross-talk | |
JP3521130B2 (en) | Electrical connector | |
US20020185302A1 (en) | Method for manufacturing a multi-layer printed circuit board | |
US20040023557A1 (en) | Paddle-card termination for shielded cable | |
NZ571958A (en) | Telecommunications jack with multi-zone crosstalk compensation and method for designing | |
JPH08330036A (en) | Connector module with test and jumper access | |
KR100341094B1 (en) | Multiprobe unit and measuring apparatus having the same | |
US5245135A (en) | Stackable high density interconnection mechanism (SHIM) | |
US6441318B1 (en) | Compensation adjustable printed circuit board | |
EP0555934B1 (en) | Adapter unit with flexible carrier | |
US6758698B1 (en) | Communication connector with capacitor label | |
US6511344B2 (en) | Double-deck electrical connector with cross-talk compensation | |
EP0643448B1 (en) | Coaxial connector for connection to a printed circuit board | |
EP0995238B1 (en) | Connector for reducing signal coupling and cable including such a connector | |
EP1881570B1 (en) | Electronic connector and method of performing electronic connection | |
JP2595787Y2 (en) | Multi-pole connector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FGA | Letters patent sealed or granted (standard patent) |