AU7174181A - Device for preventing a computer program from being copied - Google Patents
Device for preventing a computer program from being copiedInfo
- Publication number
- AU7174181A AU7174181A AU71741/81A AU7174181A AU7174181A AU 7174181 A AU7174181 A AU 7174181A AU 71741/81 A AU71741/81 A AU 71741/81A AU 7174181 A AU7174181 A AU 7174181A AU 7174181 A AU7174181 A AU 7174181A
- Authority
- AU
- Australia
- Prior art keywords
- copied
- preventing
- computer program
- program
- computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004590 computer program Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/051—Rolled
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/053—Tails
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Storage Device Security (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1981/000112 WO1982004161A1 (en) | 1981-05-21 | 1981-05-21 | Device for preventing a computer program from being copied |
Publications (1)
Publication Number | Publication Date |
---|---|
AU7174181A true AU7174181A (en) | 1982-12-07 |
Family
ID=13734242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU71741/81A Abandoned AU7174181A (en) | 1981-05-21 | 1981-05-21 | Device for preventing a computer program from being copied |
Country Status (4)
Country | Link |
---|---|
AU (1) | AU7174181A (en) |
ES (1) | ES510367A0 (en) |
IT (1) | IT8267350A0 (en) |
WO (1) | WO1982004161A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0169941B1 (en) * | 1984-07-31 | 1989-10-18 | Siemens Aktiengesellschaft | Monolithic integrated semiconductor circuit |
DE3512978A1 (en) * | 1985-04-11 | 1986-10-16 | Schaller-Automation Industrielle Automationstechnik KG, 6653 Blieskastel | METHOD AND DEVICE FOR PRODUCING ELECTRONIC DEVICES AND DEVICES PRODUCED BY THE METHOD |
JP3280394B2 (en) * | 1990-04-05 | 2002-05-13 | ロックヒード マーティン コーポレーション | Electronic equipment |
JP2721093B2 (en) * | 1992-07-21 | 1998-03-04 | 三菱電機株式会社 | Semiconductor device |
GB9224524D0 (en) * | 1992-11-24 | 1993-01-13 | Vecta Ltd | A security system and a method |
US5608359A (en) * | 1995-10-10 | 1997-03-04 | Motorola, Inc. | Function-differentiated temperature compensated crystal oscillator and method of producing the same |
DE19626126C2 (en) * | 1996-06-28 | 1998-04-16 | Fraunhofer Ges Forschung | Method for forming a spatial chip arrangement and spatial chip arrangement |
JP6304377B2 (en) * | 2014-06-23 | 2018-04-04 | 株式会社村田製作所 | Resin substrate combination structure |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4729455U (en) * | 1971-04-30 | 1972-12-04 |
-
1981
- 1981-05-21 WO PCT/JP1981/000112 patent/WO1982004161A1/en unknown
- 1981-05-21 AU AU71741/81A patent/AU7174181A/en not_active Abandoned
-
1982
- 1982-03-12 ES ES510367A patent/ES510367A0/en active Granted
- 1982-03-18 IT IT8267350A patent/IT8267350A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
ES8400207A1 (en) | 1983-02-01 |
IT8267350A0 (en) | 1982-03-18 |
WO1982004161A1 (en) | 1982-11-25 |
ES510367A0 (en) | 1983-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0064142A3 (en) | Task handling arrangement for a multiprocessor computer system | |
EP0081034A3 (en) | Control unit for a functional processor | |
DE3267523D1 (en) | Data processing apparatus for a multiprocessor system | |
GB2050013B (en) | Fail-safe system for a digital computer | |
DE3277939D1 (en) | Data processing apparatus including a peripheral processing complex | |
IL70172A (en) | Universal memory for a computer system | |
DE2963499D1 (en) | Virtual-addressing device for a computer | |
DE3379987D1 (en) | Computer system for preventing copying of program | |
GB2025144B (en) | Device for a data processing system | |
DE3267153D1 (en) | Retention unit for a copying device | |
DE3264679D1 (en) | Precollation copying apparatus | |
DE3278443D1 (en) | Apparatus for external control of computer program flow | |
DE2962653D1 (en) | Data processing apparatus having a system reset capability | |
AU7174181A (en) | Device for preventing a computer program from being copied | |
JPS57181200A (en) | Housing for computer | |
YU249282A (en) | Device for spreading a plasticizer on a fibrous material | |
GB2096371B (en) | Debugging data processing systems | |
DE3266461D1 (en) | Optical system for a copying device | |
PH19884A (en) | Illumination device for a copying machine | |
DE3274503D1 (en) | Copying machine and a control system for the same | |
GB2105492B (en) | A duplicated computer control system | |
DE3377306D1 (en) | Display for a computer | |
GB2107091B (en) | Device for data processing | |
GB2099482B (en) | Swinging device for a dredger | |
JPS57174739A (en) | Recovery device for data |