AU6938098A - Apparatus and method for cooling an electronic heat source - Google Patents

Apparatus and method for cooling an electronic heat source

Info

Publication number
AU6938098A
AU6938098A AU69380/98A AU6938098A AU6938098A AU 6938098 A AU6938098 A AU 6938098A AU 69380/98 A AU69380/98 A AU 69380/98A AU 6938098 A AU6938098 A AU 6938098A AU 6938098 A AU6938098 A AU 6938098A
Authority
AU
Australia
Prior art keywords
cooling
heat source
electronic heat
electronic
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU69380/98A
Inventor
Garron K. Morris
Detlef W. Schmidt
John M. Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU6938098A publication Critical patent/AU6938098A/en
Abandoned legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU69380/98A 1997-03-31 1998-02-25 Apparatus and method for cooling an electronic heat source Abandoned AU6938098A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US82956597A 1997-03-31 1997-03-31
US08829565 1997-03-31
PCT/US1998/003648 WO1998044307A1 (en) 1997-03-31 1998-02-25 Apparatus and method for cooling an electronic heat source

Publications (1)

Publication Number Publication Date
AU6938098A true AU6938098A (en) 1998-10-22

Family

ID=25254875

Family Applications (1)

Application Number Title Priority Date Filing Date
AU69380/98A Abandoned AU6938098A (en) 1997-03-31 1998-02-25 Apparatus and method for cooling an electronic heat source

Country Status (5)

Country Link
EP (1) EP0972166A1 (en)
JP (1) JP2000514252A (en)
KR (1) KR20010005801A (en)
AU (1) AU6938098A (en)
WO (1) WO1998044307A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6141219A (en) * 1998-12-23 2000-10-31 Sundstrand Corporation Modular power electronics die having integrated cooling apparatus
DE50213919D1 (en) * 2002-01-26 2009-11-26 Danfoss Silicon Power Gmbh cooler
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US9460985B2 (en) 2013-01-04 2016-10-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses having a jet orifice surface with alternating vapor guide channels
US9484283B2 (en) 2013-01-04 2016-11-01 Toyota Motor Engineering & Manufacturing North America Inc. Modular jet impingement cooling apparatuses with exchangeable jet plates
US8981556B2 (en) 2013-03-19 2015-03-17 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having non-uniform jet orifice sizes
US9247679B2 (en) 2013-05-24 2016-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement coolers and power electronics modules comprising the same
US9257365B2 (en) 2013-07-05 2016-02-09 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies and power electronics modules having multiple-porosity structures
US9803938B2 (en) 2013-07-05 2017-10-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies having porous three dimensional surfaces
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
DE102018211520A1 (en) 2018-07-11 2020-01-16 Mahle International Gmbh Power electronics unit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5263536A (en) * 1991-07-19 1993-11-23 Thermo Electron Technologies Corp. Miniature heat exchanger
JPH05136305A (en) * 1991-11-08 1993-06-01 Hitachi Ltd Cooling device for heating element
DE69321501T2 (en) * 1992-02-10 1999-03-04 Nec Corp., Tokio/Tokyo Cooling device for components with electronic circuits
US5316075A (en) * 1992-12-22 1994-05-31 Hughes Aircraft Company Liquid jet cold plate for impingement cooling

Also Published As

Publication number Publication date
JP2000514252A (en) 2000-10-24
WO1998044307A1 (en) 1998-10-08
KR20010005801A (en) 2001-01-15
EP0972166A1 (en) 2000-01-19

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