AU676356B2 - Manufacturing process for structured metal plating on surfaces - Google Patents

Manufacturing process for structured metal plating on surfaces

Info

Publication number
AU676356B2
AU676356B2 AU72823/94A AU7282394A AU676356B2 AU 676356 B2 AU676356 B2 AU 676356B2 AU 72823/94 A AU72823/94 A AU 72823/94A AU 7282394 A AU7282394 A AU 7282394A AU 676356 B2 AU676356 B2 AU 676356B2
Authority
AU
Australia
Prior art keywords
substrate
coating
support
metal
manufacturing process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
AU72823/94A
Other versions
AU7282394A (en
Inventor
Detlef Krabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADC GmbH
Original Assignee
Krone GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Krone GmbH filed Critical Krone GmbH
Publication of AU7282394A publication Critical patent/AU7282394A/en
Application granted granted Critical
Publication of AU676356B2 publication Critical patent/AU676356B2/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Abstract

A structured metallised coating is produced on a substrate by providing a transparent support (2) with thin homogenous coating of metal. The coated support is brought into close contact with the substrate (3) and the support pulsed with a laser beam (5). This causes the metal in a certain area of the support to be evaporated and condensed onto the substrate. The selectively coated area of the substrate then acts as a nucleation site for a chemically reducing coating bath. The substrate may be a ceramic or a polymer and the homogeneous metal coating is made of an adhesive agent and/or catalytically effective substances. The substrate when selectively coated with nucleation site is sprayed with deionised water prior to metal coating in a solution.
AU72823/94A 1993-09-09 1994-09-09 Manufacturing process for structured metal plating on surfaces Withdrawn - After Issue AU676356B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4330961A DE4330961C1 (en) 1993-09-09 1993-09-09 Producing structured metallised coatings on substrates
DE4330961 1993-09-09

Publications (2)

Publication Number Publication Date
AU7282394A AU7282394A (en) 1995-03-23
AU676356B2 true AU676356B2 (en) 1997-03-06

Family

ID=6497543

Family Applications (1)

Application Number Title Priority Date Filing Date
AU72823/94A Withdrawn - After Issue AU676356B2 (en) 1993-09-09 1994-09-09 Manufacturing process for structured metal plating on surfaces

Country Status (9)

Country Link
EP (1) EP0643153B1 (en)
KR (1) KR950008721A (en)
CN (1) CN1106073A (en)
AT (1) ATE139581T1 (en)
AU (1) AU676356B2 (en)
DE (2) DE4330961C1 (en)
DK (1) DK0643153T3 (en)
ES (1) ES2088691T3 (en)
GR (1) GR3020551T3 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009012026A2 (en) 2007-07-17 2009-01-22 3M Innovative Properties Company Method of patterning a substrate
WO2009055517A1 (en) 2007-10-23 2009-04-30 E. I. Du Pont De Nemours And Company Negative imaging method for providing a patterned metal layer having high conductivity
US10889909B2 (en) 2015-09-03 2021-01-12 Gerhardi Kunststofftechnik Gmbh Galvanically decorated component and method for producing a galvanically decorated component

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19517625A1 (en) * 1995-05-13 1996-11-14 Budenheim Rud A Oetker Chemie Laser printing esp. on glass or plastic substrate
DE19841900A1 (en) * 1998-09-11 2000-03-30 Schott Glas Process for applying metallic conductor tracks as electrodes on a channel plate for large flat screens
DE19946182C2 (en) * 1999-09-21 2003-07-03 Forschungsverbund Berlin Ev Process for the production of carbon nanotubes
DE10011455B4 (en) * 2000-03-10 2005-12-08 Schott Ag Method for applying metallic conductor tracks as electrodes to a channel plate made of glass for large-surface flat screens
GB2385863A (en) * 2001-10-29 2003-09-03 Qinetiq Ltd High resolution patterning method
ES2305428T3 (en) * 2003-07-21 2008-11-01 Abb Research Ltd. METALIZED ELECTROCERAMICS IRRADIATED BY LASER.
DE10347035B4 (en) * 2003-10-09 2013-05-23 Giesecke & Devrient Gmbh Method and device for producing electrically conductive structures on a substrate for an electronic data carrier
CN101601334A (en) * 2007-01-05 2009-12-09 巴斯夫欧洲公司 Produce the method for conductive surface
DE102009020774B4 (en) * 2009-05-05 2011-01-05 Universität Stuttgart Method for contacting a semiconductor substrate
DE102012003866B4 (en) 2012-02-23 2013-07-25 Universität Stuttgart Method for contacting a semiconductor substrate, in particular for contacting solar cells, and solar cells
EP2731126A1 (en) 2012-11-09 2014-05-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method for bonding bare chip dies
DE102019201348A1 (en) * 2019-02-01 2020-08-06 Lpkf Laser & Electronics Ag Metallized microstructures in glass substrates
CN112917016B (en) * 2021-05-12 2021-07-23 常州仁千电气科技股份有限公司 Laser etching device and method for 5G antenna oscillator
DE102022116221A1 (en) * 2022-06-29 2024-01-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Method for producing a catalyst element for use in a chemical reactor, catalyst element and chemical reactor
CN116689951B (en) * 2023-08-08 2023-10-27 常州厚德再生资源科技有限公司 Underwater pulse laser waste battery structure disassembling device and control method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0483782A2 (en) * 1990-11-02 1992-05-06 Heraeus Noblelight GmbH Metallising process
EP0534576A1 (en) * 1991-08-03 1993-03-31 Lpkf Cad/Cam Systeme Gmbh Process for the deposition of patterned metal layers on glass substrates
WO1996012051A1 (en) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Process for separating metal coatings

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2523982C3 (en) * 1975-05-30 1979-05-17 Ibm Deutschland Gmbh, 7000 Stuttgart Process and device for maskless vapor deposition, as well as use of the process
CA1105093A (en) * 1977-12-21 1981-07-14 Roland F. Drew Laser deposition of metal upon transparent materials
US4895735A (en) * 1988-03-01 1990-01-23 Texas Instruments Incorporated Radiation induced pattern deposition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0483782A2 (en) * 1990-11-02 1992-05-06 Heraeus Noblelight GmbH Metallising process
EP0534576A1 (en) * 1991-08-03 1993-03-31 Lpkf Cad/Cam Systeme Gmbh Process for the deposition of patterned metal layers on glass substrates
WO1996012051A1 (en) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Process for separating metal coatings

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009012026A2 (en) 2007-07-17 2009-01-22 3M Innovative Properties Company Method of patterning a substrate
EP2176407A4 (en) * 2007-07-17 2016-04-27 Samsung Display Co Ltd Method of patterning a substrate
WO2009055517A1 (en) 2007-10-23 2009-04-30 E. I. Du Pont De Nemours And Company Negative imaging method for providing a patterned metal layer having high conductivity
US7666567B2 (en) 2007-10-23 2010-02-23 E. I. Du Pont De Nemours And Company Negative imaging method for providing a patterned metal layer having high conductivity
US10889909B2 (en) 2015-09-03 2021-01-12 Gerhardi Kunststofftechnik Gmbh Galvanically decorated component and method for producing a galvanically decorated component

Also Published As

Publication number Publication date
EP0643153A1 (en) 1995-03-15
ATE139581T1 (en) 1996-07-15
DE59400367D1 (en) 1996-07-25
EP0643153B1 (en) 1996-06-19
CN1106073A (en) 1995-08-02
KR950008721A (en) 1995-04-19
GR3020551T3 (en) 1996-10-31
ES2088691T3 (en) 1996-08-16
DE4330961C1 (en) 1994-07-28
DK0643153T3 (en) 1996-07-15
AU7282394A (en) 1995-03-23

Similar Documents

Publication Publication Date Title
AU676356B2 (en) Manufacturing process for structured metal plating on surfaces
BR9307793A (en) Aqueous composition of coating coated substrates and substrate coating process
SE9103198D0 (en) MANUFACTURE OF REFLECTIVE ARTICLES
DK1332238T3 (en) Metallized film, method of manufacture thereof and use thereof
GEP20012526B (en) Anti-Microbial Multilayer Coatings, Method for Its Production and Wound Multilayer Dressing
PL328655A1 (en) Composition for and method of treating phosphate coated metal surfaces
EP1054081A3 (en) Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating
DK7193A (en) PROCEDURE FOR PREPARING A HYDROPHILIC COATING ON A SURFACE AND MEDICAL ARTICLE PREPARED BY THE PROCEDURE
EP0350161A3 (en) Method for rendering a substrate surface antithrombogenic
CA2142683A1 (en) Process for catalyzation in electroless plating using chitosan or a chitosan derivative
EP0372405A3 (en) Corrosion inhibitive pretreatment for "copper-free" mirrors
AU2309500A (en) Method of treating metals using vinyl silanes and multi-silyl-functional silanesin admixture
ATE154648T1 (en) METHOD FOR PRODUCING A THIN POLYMER COATING USING PULSED LASER EVAPORATION
EP0802219A3 (en) Coated aliphatic polyester film
ES2079222T3 (en) PROCEDURE FOR THE IMPROVEMENT OF THE ADHERENCE OF PRECIPITATED METAL LAYERS WITHOUT CURRENT.
BR9003710A (en) METAL SUBSTRATE AND PRE-RECOVERED METAL SUBSTRATE AND TO PRODUCE A PRE-RECOVERED CONFORMED METAL SUBSTRATE
CA2407281A1 (en) Polymeric materials to metal surfaces adhesion process
ES2045616T3 (en) IMPROVED SURFACE TREATMENT FOR ZINCIFER SURFACES.
ATE154834T1 (en) SUBSTRATE WITH IMPROVED SURFACE MORPHOLOGY USING MELTED SPRAYING
ATE67989T1 (en) TIN OXIDE COATING, COATING METHOD AND SO COATED SUBSTRATE.
EP0329417A3 (en) Process for improving the adhesion to polyacetal articles
WO2003102267A8 (en) Method for electroless metalisation of polymer substrate
EP0272420A3 (en) Photopatterned aromatic polymeric substrates, method for making same and use
KR900006251A (en) Prime treatment of polycarbonate substrate surface
ES8205268A1 (en) Process for the electroless deposition of metals.