AU6281690A - Abrasive and water-soluble soldering flux - Google Patents

Abrasive and water-soluble soldering flux

Info

Publication number
AU6281690A
AU6281690A AU62816/90A AU6281690A AU6281690A AU 6281690 A AU6281690 A AU 6281690A AU 62816/90 A AU62816/90 A AU 62816/90A AU 6281690 A AU6281690 A AU 6281690A AU 6281690 A AU6281690 A AU 6281690A
Authority
AU
Australia
Prior art keywords
abrasive
water
soldering flux
soluble soldering
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU62816/90A
Inventor
Takehiko Kurashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nakajima All Precision Co Ltd
Original Assignee
Nakajima All Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nakajima All Precision Co Ltd filed Critical Nakajima All Precision Co Ltd
Publication of AU6281690A publication Critical patent/AU6281690A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Detergent Compositions (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU62816/90A 1989-09-05 1990-09-03 Abrasive and water-soluble soldering flux Abandoned AU6281690A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-229687 1989-09-05
JP22968789A JPH0394995A (en) 1989-09-05 1989-09-05 Abrasive material and water soluble solder flux

Publications (1)

Publication Number Publication Date
AU6281690A true AU6281690A (en) 1991-04-08

Family

ID=16896125

Family Applications (1)

Application Number Title Priority Date Filing Date
AU62816/90A Abandoned AU6281690A (en) 1989-09-05 1990-09-03 Abrasive and water-soluble soldering flux

Country Status (3)

Country Link
JP (1) JPH0394995A (en)
AU (1) AU6281690A (en)
WO (1) WO1991003355A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100254927B1 (en) * 1994-12-07 2000-05-01 오까베 히로시 Flux for soldering, soldering paste and soldering method
JP3104606B2 (en) 1995-03-24 2000-10-30 株式会社デンソー Method of connecting substrate to connected material, connection structure thereof, and auxiliary material for connection
JP3785435B2 (en) 1998-08-27 2006-06-14 株式会社デンソー Solder paste and surface mount electronic device
JP3649087B2 (en) 1999-07-28 2005-05-18 株式会社デンソー Adhesive method and adhesive structure for thermoplastic resin material
CN101352789B (en) * 2008-09-12 2011-01-12 上海华实纳米材料有限公司 Non-halogen scaling powder for leadless solder

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3796610A (en) * 1972-09-28 1974-03-12 Ibm Glycerol soldering fluxes
JPS62248596A (en) * 1986-04-22 1987-10-29 Electroplating Eng Of Japan Co Water soluble solder flux and soldering method using said flux

Also Published As

Publication number Publication date
WO1991003355A1 (en) 1991-03-21
JPH0394995A (en) 1991-04-19

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