AU6203399A - Polyamide composition stabilized with copper complexes and organic halogen compounds - Google Patents

Polyamide composition stabilized with copper complexes and organic halogen compounds

Info

Publication number
AU6203399A
AU6203399A AU62033/99A AU6203399A AU6203399A AU 6203399 A AU6203399 A AU 6203399A AU 62033/99 A AU62033/99 A AU 62033/99A AU 6203399 A AU6203399 A AU 6203399A AU 6203399 A AU6203399 A AU 6203399A
Authority
AU
Australia
Prior art keywords
polyamide composition
organic halogen
halogen compounds
copper complexes
composition stabilized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU62033/99A
Inventor
Klaus Titzschkau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
L Brueggemann GmbH and Co KG
Original Assignee
L Brueggemann GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by L Brueggemann GmbH and Co KG filed Critical L Brueggemann GmbH and Co KG
Publication of AU6203399A publication Critical patent/AU6203399A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Stabilized polyamide composition characterized in the at least one copper complex and at least one organic halogen compound are contained as stabilizer.
AU62033/99A 1998-10-15 1999-10-15 Polyamide composition stabilized with copper complexes and organic halogen compounds Abandoned AU6203399A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19847627A DE19847627A1 (en) 1998-10-15 1998-10-15 Copper salt-based stabilizer for polyamides for electrical and electronics industries comprises complex with phosphine and/or mercaptobenzimidazole compound and at least one halogenated organic compound
DE19847627 1998-10-15
PCT/EP1999/007847 WO2000022035A1 (en) 1998-10-15 1999-10-15 Polyamide composition stabilized with copper complexes and organic halogen compounds

Publications (1)

Publication Number Publication Date
AU6203399A true AU6203399A (en) 2000-05-01

Family

ID=7884612

Family Applications (1)

Application Number Title Priority Date Filing Date
AU62033/99A Abandoned AU6203399A (en) 1998-10-15 1999-10-15 Polyamide composition stabilized with copper complexes and organic halogen compounds

Country Status (17)

Country Link
EP (1) EP1121388B1 (en)
JP (1) JP3455519B2 (en)
KR (1) KR100432202B1 (en)
CN (1) CN1129632C (en)
AT (1) ATE287428T1 (en)
AU (1) AU6203399A (en)
CA (1) CA2347258C (en)
CZ (1) CZ301862B6 (en)
DE (2) DE19847627A1 (en)
DK (1) DK1121388T3 (en)
ES (1) ES2237157T3 (en)
HU (1) HU223658B1 (en)
PL (1) PL196654B1 (en)
PT (1) PT1121388E (en)
RU (1) RU2220992C2 (en)
SI (1) SI1121388T1 (en)
WO (1) WO2000022035A1 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1681313A1 (en) * 2005-01-17 2006-07-19 DSM IP Assets B.V. Heat stabilized moulding composition
JP5451380B2 (en) 2006-05-15 2014-03-26 ブロマイン コンパウンズ リミテッド Flame retardant composition
US20080026246A1 (en) * 2006-07-25 2008-01-31 Yuji Saga Vibration damping material of polyamides and mercaptobenzoimidazoles
FR2928102B1 (en) * 2008-03-03 2012-10-19 Arkema France MULTILAYER STRUCTURE COMPRISING AT LEAST ONE STABILIZED LAYER
WO2012052403A2 (en) 2010-10-18 2012-04-26 Dsm Ip Assets B.V. Heat stabilized polyamide composition
DE102010051310A1 (en) 2010-11-16 2012-05-16 Thüringisches Institut für Textil- und Kunststoff-Forschung e.V. Process for the preparation of polyamide compositions having improved thermo-oxidative, antibacterial, light or energy-active properties
KR102111422B1 (en) * 2012-09-19 2020-06-08 바스프 에스이 Flame-proofed polyamides with light colouring
CN103865057A (en) * 2012-12-17 2014-06-18 东丽先端材料研究开发（中国）有限公司 Polyamide resin, preparation method thereof and polyamide resin composition
CN103756304B (en) * 2014-01-17 2016-03-16 郑州大学 Silicon carbide micro-powder modification of nylon 6/66 matrix material
EP2902444B1 (en) * 2014-01-31 2018-01-17 Ems-Patent Ag Polyamide moulding compounds with flame retardant properties and very good long-term heat ageing resistance
CN105440281B (en) * 2014-09-23 2019-02-26 东丽先端材料研究开发（中国）有限公司 A kind of polyamide, preparation method and its molded product
US9892845B2 (en) 2016-01-13 2018-02-13 Martin Weinberg Polyamide electrical insulation for use in liquid filled transformers
FR3049952B1 (en) 2016-04-08 2018-03-30 Arkema France POLYAMIDE COMPOSITION FOR PIPES CONTAINING PETROLEUM OR GAS
FR3049953B1 (en) * 2016-04-08 2020-04-24 Arkema France COPPER-BASED THERMOPLASTIC AND STABILIZING POLYMER COMPOSITION, ITS PREPARATION AND USES
KR20190076997A (en) * 2016-10-17 2019-07-02 엘. 브뤼그만 게엠베하 운트 코 카게 Process for producing polyamide materials having improved long-term use properties
WO2018075431A1 (en) * 2016-10-18 2018-04-26 Ascend Performance Materials Operations Llc Low-halogen flame retardant polyamide compositions resistant to heat aging
FR3067033B1 (en) 2017-06-02 2021-01-01 Arkema France POLYAMIDE-BASED COMPOSITION FOR COOLANT PIPES
DE102017212097A1 (en) 2017-07-14 2019-01-17 Clariant Plastics & Coatings Ltd Flame retardant gray polyamide compositions and their use
WO2019121160A1 (en) * 2017-12-19 2019-06-27 Basf Se A stabilizer composition, its use and a plastic composition comprising the same
FR3097226B1 (en) 2019-06-11 2021-11-26 Arkema France POLYAMIDE COMPOSITIONS WITH HIGH MODULE AND LOW DIELECTRIC CONSTANT AND THEIR USE
WO2021048157A1 (en) 2019-09-11 2021-03-18 Clariant International Ltd Polymer composition comprising heat stabilizer and use thereof
WO2021048156A1 (en) 2019-09-11 2021-03-18 Clariant International Ltd Polymer composition comprising heat stabilizer and use thereof
FR3108615B1 (en) 2020-03-24 2022-12-02 Arkema France MOLDING COMPOSITIONS REINFORCED WITH GLASS FIBERS HAVING IMPROVED IMPACT PROPERTIES
FR3111351B1 (en) 2020-06-10 2022-09-09 Arkema France POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND THEIR USE
FR3124516A1 (en) 2021-06-28 2022-12-30 Arkema France BLOW MOLDING COMPOSITIONS BASED ON BRANCHED POLYAMIDES AND THEIR USES
FR3124517A1 (en) 2021-06-28 2022-12-30 Arkema France BLOW MOLDING COMPOSITIONS BASED ON BRANCHED POLYAMIDES AND THEIR USES
TW202334316A (en) 2021-09-21 2023-09-01 美商阿散德性能材料營運公司 Stabilizing component for polyamide resin composition
CN115873402A (en) * 2021-09-30 2023-03-31 华峰集团有限公司 Heat-resistant master batch and heat-stable polyamide composition thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3499867A (en) * 1965-06-22 1970-03-10 Toyo Boseki Stabilized polyamide composition
DE19615484A1 (en) * 1996-04-19 1997-10-23 Basf Ag Oxidation-stabilized polyamide molding compounds

Also Published As

Publication number Publication date
ATE287428T1 (en) 2005-02-15
PL347331A1 (en) 2002-03-25
DE59911502D1 (en) 2005-02-24
ES2237157T3 (en) 2005-07-16
DK1121388T3 (en) 2005-04-04
HUP0103998A2 (en) 2002-02-28
HU223658B1 (en) 2004-11-29
SI1121388T1 (en) 2005-06-30
HUP0103998A3 (en) 2003-05-28
CN1129632C (en) 2003-12-03
EP1121388B1 (en) 2005-01-19
EP1121388A1 (en) 2001-08-08
CA2347258C (en) 2006-04-11
CA2347258A1 (en) 2000-04-20
CN1326481A (en) 2001-12-12
KR100432202B1 (en) 2004-05-22
RU2220992C2 (en) 2004-01-10
JP2002527558A (en) 2002-08-27
DE19847627A1 (en) 2000-04-20
JP3455519B2 (en) 2003-10-14
CZ301862B6 (en) 2010-07-14
KR20020002355A (en) 2002-01-09
PT1121388E (en) 2005-04-29
WO2000022035A1 (en) 2000-04-20
CZ20011354A3 (en) 2001-11-14
PL196654B1 (en) 2008-01-31

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase