AU6097796A - Electrodepositable photoimageable compositions with improved edge coverage - Google Patents
Electrodepositable photoimageable compositions with improved edge coverageInfo
- Publication number
- AU6097796A AU6097796A AU60977/96A AU6097796A AU6097796A AU 6097796 A AU6097796 A AU 6097796A AU 60977/96 A AU60977/96 A AU 60977/96A AU 6097796 A AU6097796 A AU 6097796A AU 6097796 A AU6097796 A AU 6097796A
- Authority
- AU
- Australia
- Prior art keywords
- electrodepositable
- improved edge
- edge coverage
- photoimageable compositions
- photoimageable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49773395A | 1995-07-03 | 1995-07-03 | |
US497733 | 1995-07-03 | ||
PCT/US1996/009367 WO1997002511A1 (en) | 1995-07-03 | 1996-06-07 | Electrodepositable photoimageable compositions with improved edge coverage |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6097796A true AU6097796A (en) | 1997-02-05 |
Family
ID=23978088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU60977/96A Abandoned AU6097796A (en) | 1995-07-03 | 1996-06-07 | Electrodepositable photoimageable compositions with improved edge coverage |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU6097796A (en) |
WO (1) | WO1997002511A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI350944B (en) * | 2007-08-03 | 2011-10-21 | Univ Yuan Ze | Photoresist and a pattern-forming process using the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1981000310A1 (en) * | 1979-07-16 | 1981-02-05 | Minnesota Mining & Mfg | Plating resist with improved resistance to extraneous plating |
BR8107605A (en) * | 1981-11-23 | 1983-07-05 | Oce Nederland Bv | DIAZOTYPE MATERIAL |
US4686171A (en) * | 1986-02-14 | 1987-08-11 | Hercules Incorporated | Photopolymerizable films containing plasticizer silica combinations |
EP0286594A2 (en) * | 1987-04-06 | 1988-10-12 | Ciba-Geigy Ag | Process for the production of photographically structurable coatings |
GB8920540D0 (en) * | 1989-09-11 | 1989-10-25 | Coates Brothers Plc | Resists |
DE4142735A1 (en) * | 1991-12-21 | 1993-06-24 | Hoechst Ag | POLYMERIZABLE MIXTURE BY RADIATION AND METHOD FOR PRODUCING A SOLDER STOP MASK |
DE4336901A1 (en) * | 1993-10-28 | 1995-05-04 | Du Pont Deutschland | Photopolymerizable mixture and method for producing solder mask |
-
1996
- 1996-06-07 WO PCT/US1996/009367 patent/WO1997002511A1/en active Application Filing
- 1996-06-07 AU AU60977/96A patent/AU6097796A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1997002511A1 (en) | 1997-01-23 |
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