AU604200B2

AU604200B2 - Non slip surface preparation

Info

Publication number: AU604200B2
Application number: AU46896/89A
Authority: AU
Inventors: Kelvin Harold Arnold; Alan Faulhaber
Original assignee: Individual
Current assignee: Individual
Priority date: 1988-12-16
Filing date: 1988-12-16
Publication date: 1990-12-06
Anticipated expiration: 2009-12-18
Also published as: AU4689689A

Description

111125 11111. II .6ZAXMAOXd 01 1.25 1111' 1.4 1111.

II ilI*I*I*I*I*I-I =I-1 1 -1777 PATENTS ACT COMPLETE SPECIFICATION O R I G I NA L (FOR OFFICE USE) CIa s s Thisdocuentcontains the amnendments made under 1)caion 49 and is correct for printing I nt ClIas s Application Number; Lodged: Complete Specificat P r 1o ri ty Related Art: ion Lodged: Accep ted: Pub]lished: 17 -4 o 9

II

I 4 *41 4144 4 4 4 It 4 4 4 4 4 44 1 .4 4 t 4.4

CC

Name of App]licant K.~ELI /*jJHAROLD ARNOLD Address of App]l icant Gloucester Crescent, .Shepparton.. 3 63 0 V ictor a Actual Inventor(s) A lan. FauIhabe r.and Kel]v in. Xaro.I d. A rnoId......

Address for Service: PATENT ATTORNEY SERVICES 26 Ellingwcirth Parade, Rox Hill1, Victoria 3128 Complete specification for the invention entitled: NON SLIP SURFACE PREPARATION The followig statement is a full description of this invention, including the best method of performing i t known to us 1.

NON SLIP SURFACE PREPARATION This invention relates to treatment of surfaces, so as to reduce the slipperiness of the surfaces and is particularly applicable to floor or other walking surfaces.

In the past one known treatment of floor or ground surfaces, such as path surfaces, ts reduce the slipperiness has comprised bonding of cearse aggregate such as a gravel material to surfaces so as to provide relatively rough surfaces assisting gripping.

Another known technique has comprised laying of adhesive strips having a relatively rough upper surface onto a surface whose slipperiness is to be reduced. This technique has been used for example in shower bases to reduce the tendency of a user to slip when the floor of the shower recess is wet.

These prior techniques can produce unsightly and dangerous ground and floor treatments. The bonding to the original 0 0 0 0 0 surfaces can weaken over a period of time so that the original 0 00 o0oo suiLaces are exposed.

0 00 o0. It is an object of the present invention to provide a process and product for preparation of a surface so as to reduce the slipperiness of the surface.

It is a preferred object to provide a process of preparation of a surface which is relatively simple to carry out.

It is a further preferred object to provide a process of preparation of a surface to reduce the slipperiness and which is relatively safe to carry out.

2 According to a first aspect of the present invention there is provided a process of preparation of a siliceous surface so as to reduce the slipperiness of that surface, the process comprising the steps: I cleaning the surface area to be treated so as to remove grease and oil substances and loose particulate materials, applying an etching substance to the surface area and Sspreading the etching substance across that area, the etching substance corprising an acidic aqueous solution, the ingredients of the solution etching the surface at varying rates depending on the micro-structure of the material of the surface, and I after a period of time sufficient for the etching process to have progressed to the extent that an uneven depth of e ching So has occurred at a microscopic scale, flushing the etching O O o o"°o 0 substance and products of the etching process from the surface oo 0 to leave a roughened surface.

So0 The substance for treating the silica containing or ceramic 0.00 o surface to reduce the slipperiness comprises an acidic solution which is for the purpose of etching the surface so as to roughen the surface and increase the resistance to sliding movement Salong the surface. The solution preferably comprises an aqueous solution of hydrofluoric acid and preferably another acid such as phosphoric acid. The hydrofluoric acid attacks silica and the phosphoric acid attacks other ingredients of ceraiic materials such as calcium salts, the ingredients co-operating to etch the surface at varying rates depending on the micro-structure of the material. In particular, uneven depth of 3 etching occurs at a microscopic scale thereby increasing the surface roughness.

The hydrofluoric acid may be present in a proportion 0.3% to by weight. It has been found that proportions 1 to 10% are suitable and more particularly 2.5 to 5% are effective.

The phosphoric acid nay be present as orthophosphoric acid (H3P04). The proportion of phosphoric acid may be in the range 0.3 to 30% by weight. The ranges 1 to 10% and more particularly the 2 to 5% are preferred.

The pH of the aqueous solution is preferably less than 3 and most preferably less than 2.

In addition to the hydrofluoric and phosphoric acid the aqueous solution preferably includes ammonium present in a proportion 0.1 to For example, the ammonium may be present o°-5 in a proportion of about to The ammonium may have a 000o oa contributory synergistic effect. For example, the ammonium may 00 6 o 0 o ,0 form complexes with ingredients of ceramic materials to form 0 a o. soluble products assisting in removing products of the acid etching proctss from the material surface where the acid etching reaction is taking place thereby assisting the efficiency of the process. Also the ammonium will increase the pH to make thn2 substance safer to handle and use. The ammonium may be added as ammonium hydroxide. Other alkaline materials may be used additionally to ammonium hydroxide, e.g. calcium or potassium hydroxide. It is thought possible that the ammonium may act to slow or retard the etching action of the hydrofluoric and phosphoric acids so that the process can be closely controlled and particularly the required degree of etching action.

4 j; P1 According to a further aspect of the present invention there is provided an etching substance for treating a siliceous surface to reduce the slipperiness of that surface, the etching substance comprising an acidic a aqueous solution for application to the surface so as to etch and roughen the surface, the solution including hydrofluroic acid and another acid, the ingrediant co-operating to etch the surface at varying rates depending on the micro-structure of the material of the surface.

The following example gives possible proportions for a substance according to the present invention.

EXAMPLE

pH of solution: less than 2 Fluoride 3.2% as HF S00o 15 Phosphorus 2.74% 8.67% as H3P04 .o (orthophosphoric acid) 00 Q 0 00 o° o Ammonium Nitrogen 0.28% (0.34% as NH3) O o Aluminium 0.05% 0000 ao.0 Calcium 0.01% Magnesium Slight trace Potassium Slight trace Sodium 0.09% The etching substance is used in the process of preparation of a surface according to the present invention so as to reduce the slipperiness of that surface. The surface may be a ceramic surface, concrete surface or other silica containing surface.

Before applying the etching substance to the surface, the surface is preferably thoroughly cleared by applying a degreasing agent and thoroughly working that agent across the surface and then removing the agent. If the grease and oil substances and loos particulate materials which may interfere with the effective etching action are not substantially completely removed, the etching process can be ineffective at least in local contaminated areas.

The step of applying the substance to the surface area preferably comprises spraading the substance across the area to be treated and periodically working the substance by spreading the substance in differing directions. After a period of time sufficient for the etching process to have progressed to the desired extent, flushing the etching substance and products of G ±9 the etching process from the surface leaves a roughened surface.

S o The period of time that the substance may be worked over the 00 O o surface before flushing may be in the range of 5 to 15 minutes o0 a oa. depending for example on the nature of the surface, the 404 concentration of the substance, temperature conditions and the like, The time should not be so short that it is difficult to control the extent of etching particularly if large areas are to oilbe treated by sequentially treating smaller sections.

The working of the substance across the surface may be carried out by means of a spreader which may be made of a plastics material so as not to be attacked by the substance.

The method according to the invention may, if desired, include the further step of shielding parts of the surface to be treated so as to separate the etching substance from the surface ranr~ I. in pre-determined areas when the substance is applied to the j surface. For example, the process may include the step of masking pre-determined areas of the surface which are not to be treated. The masked areas may define for example a pattern for providing aesthetic effects or providing information or advertising. The process may comprise applying the substance through a mask temporaly fixed to the surface or through a stencil or screen so as to localise the areas subject to the etching process as desired.

According to a further aspect of the present invention there is provided a process of preparation of a siliceous surface so cj as to reduce the slipperiness of that surface, the process comprising the steps.

The flushing of the substance and etching process products from the surface comprises flushing with water to dilute the o.o substance and products and pre.erably further includes vacuuming 0 0o o 0 the diluted liquid from the surface. The process may be carried o out by a flushing apparatus having a liquid outlet and vacuum oo intake adjacent each other in a single head so that surplus liquid is not created and spread across the surfaue.

The methods and substances according to the preferred embodiments of the present invention as described above enable i siliceous surfaces such as ceramic tiled surfaces. bath and shower bases, concrete surfaces and other silica containing or ceramic surfaces to be treated to etch the surface and reduce the slipperiness. This is particularly suitable for areas where people need to walk or stand. The substance therefore may be used in public places and well as within commercial or 7 I_ i I.

residential buildings thereby assisting the reduction of injuries due to people slipping and falling on such surfaces.

It is to be understood that various alterations, modifications and/or additions may be made to the features of the possible and preferred embodiment(s) of the invention as herein described without departing from the spirit and scope of the invention as defined in the appended claims.

ii j 4

Claims

1. A process of preparation of a siliceous surZace so as to reduce the slipperiness of that surface, the process comprising the steps: cleaning the surface area to be treated so as to remove grease and oil substances and loose particulate materials, applying an etching substance to the surface area and spreading the etching substance across that area, the substance comprising an acidic aqueoi;s solution, the ingredients of the solution etching the surface at varying rates depending on the micro-structure of the material of the surface, and after a period of time sufficient for the etching process to have progressed to the extent that an uneven depth of etching has occurred at a microscopic scale, flushing the etching o 15 substance and products of the etching process from the surface S"o to leave a roughened surface. o, O

2. A process as claimed in Claim 1 wherein the acidic aqueous 0 0 o 00' solution includes hydrofluoric acid. 's

3. A process as claimed in Claim 2 wherein the hydrofluoric acid is present in a proportion of 1 to 10% by weight.

4. A process as claimed in Claim 3 wherein the hydrofluoric acid is present in a proportion of 2.5 to 5% by weight.

A process as claimed in any one of the preceding claims wherein the acidic aqueous solution includes orthophosphoric acid.

6. A process as claimed in Claim 5 wherein the orthophosphoric acid is present in the range 0.3 to 30% by weight.

7. A process as claimed in Claim 7 wherein the orthophosphoric acid is present in the range 1 to 10% by weight.

8. A process as claimed in any one of the preceding claims and further includingIammonium.

9. A process as c3aimed in Claim 8 wherein the ammonium is present in a proportion of 0.1 to 1% by weight.

A process as claimed in Cl-im 9 wherein the ammonium is present in a proportion of 0.2 to 0.5% by weight.

11. A process as claimed in any one of the preceding cxaims wherein the aqueous solution includes an alkaline material.

12. A process as claimed in Claim 11 wherein the alkaline material comprises ammonium hydroxide.

13. A process as claimed in any one of the preceding claims wherein the step of cleaning the surface comprises applying a S15 degreasing substance to the surface area to be treated and 0 0 0 o o working the degreasing substance across the surface so as to thoroughly clean the surface followed by flushing of the So o degreasing substance from the surface preparatory to applying Sooo the etching substance.

14. A process as claimed in any one of the preceding claims wherein the step of applying the etching substance comprises S spreading the etching substance across the surface area to be treated and periodically working the etching substance by spreading that substance in differing directions.

15. A process as claimed in Claim 14 wherein the etching substance is spread over the surface for a period in the range of 5 to 15 minutes, the period of time being sufficiently long to enable relatively close control of the extent of etching of the surface. I 1- _Y 1 ii

16. A process as claimed in any one of the preceding claims wherein the step of flushing the etching substance and products of the etching process from the surface comprises firstly flushing with water to dilute the etching substance and the i 5 products of 2 tching process and subsequently by vacuuming i the diluted liquid from the surface. i

17. A process as claimed in Claim 16 wherein the vacuuming of |i liquid from the surface occurs closely adjacent to the area I where the flushing water is applied so that surplus liquid is not created and is not spread across the surface.

18. A process as claimed in any one of the preceding claims and further including the step of shielding parts of the surface \i area to be treated so as to avoid contacting the shielded parts of the surface with the etching substance during the step of

19. A process as claimed in Claim 18 wherein the step of S. shielding parts of the surface area comprises masking predetermined areas of the surface which are not to be treated Swith the etching substance, the masked area defining a predetermined pattern.

A process of preparation of a siliceous surface so as to iI reduce the sllpperiness of that surface, the process comprising the steps: applying an etching substance to the surface area to be U 215 treated and spreading the etching substance across that area, the etching substance comprising an acidic aqueous solution, the ingredients of the solution etching the surface at varying rates depending on the micro-st-.cture of the material of the surface, and 11 I i i i- 1 after a period of time sufficient for the etching process to have progressed to the extent that an uneven depth of etching has occurred at a microscopic scale, flushing with water the etching substance and products of the etching process so as to dilute the substance and the products of the etching process and removing the diluted liquid from the surface to leave a roughened surface.

21. A process as claimed in Claim 20 wherein the step of removing the diluted liquid from the surface comprises vacuuming the diluted liquid from the surface.

22. A process as claimed in Claim 21 wherein the vacuuming of diluted liquid from the surface is carried out closely adjacent to the area where the flushing water is applied so that surplus liquid is not created and is not spread across the surface.

23. An etching substance for treating a siliceous surface to reduce the slipperiness of that surface, the etching substance comprising an acidic aqueous solution for application to the surface so as to etch and roughten the surface, the solution S including hydrofluoric acid and another acid, the ingredients co-operating to etch the surface at varying rates depending r n the micro-structure of the material of the surface.

24. An etching substance as claimed in Claim 23 wherein the other acid comprises orthophosphoric acid. An etching substance as claimed in Claim 23 or 24 and further including ammonium. Dated this 6th day of December, 1989 RA PATENT ATTORNEY SERVICES IL Att rneys for i -9 O KELVIN HAROLD ARNOLD 12