AU6028796A - Method and apparatus for shaping spring elements - Google Patents
Method and apparatus for shaping spring elementsInfo
- Publication number
- AU6028796A AU6028796A AU60287/96A AU6028796A AU6028796A AU 6028796 A AU6028796 A AU 6028796A AU 60287/96 A AU60287/96 A AU 60287/96A AU 6028796 A AU6028796 A AU 6028796A AU 6028796 A AU6028796 A AU 6028796A
- Authority
- AU
- Australia
- Prior art keywords
- spring elements
- shaping spring
- shaping
- elements
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title 1
- 238000007493 shaping process Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
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- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H01L2924/207—Diameter ranges
- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
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- H01L2924/3011—Impedance
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Ceramic Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US452255 | 1995-05-26 | ||
US08/452,255 US6336269B1 (en) | 1993-11-16 | 1995-05-26 | Method of fabricating an interconnection element |
US52624695A | 1995-09-21 | 1995-09-21 | |
US526246 | 1995-09-21 | ||
US08/533,584 US5772451A (en) | 1993-11-16 | 1995-10-18 | Sockets for electronic components and methods of connecting to electronic components |
US533584 | 1995-10-18 | ||
US08/554,902 US5974662A (en) | 1993-11-16 | 1995-11-09 | Method of planarizing tips of probe elements of a probe card assembly |
US554902 | 1995-11-09 | ||
WOUS9514909 | 1995-11-13 | ||
PCT/US1995/014909 WO1996017378A1 (en) | 1994-11-15 | 1995-11-13 | Electrical contact structures from flexible wire |
US558332 | 1995-11-15 | ||
US08/558,332 US5829128A (en) | 1993-11-16 | 1995-11-15 | Method of mounting resilient contact structures to semiconductor devices |
US1324796P | 1996-03-11 | 1996-03-11 | |
US013247 | 1996-03-11 | ||
PCT/US1996/008276 WO1996037334A1 (en) | 1995-05-26 | 1996-05-28 | Method and apparatus for shaping spring elements |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6028796A true AU6028796A (en) | 1996-12-11 |
Family
ID=27555753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU60287/96A Abandoned AU6028796A (en) | 1995-05-26 | 1996-05-28 | Method and apparatus for shaping spring elements |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3157005B2 (en) |
AU (1) | AU6028796A (en) |
WO (1) | WO1996037334A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6815961B2 (en) | 1999-07-28 | 2004-11-09 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7772860B2 (en) | 1999-05-27 | 2010-08-10 | Nanonexus, Inc. | Massively parallel interface for electronic circuit |
US7872482B2 (en) | 2000-05-23 | 2011-01-18 | Verigy (Singapore) Pte. Ltd | High density interconnect system having rapid fabrication cycle |
US7952373B2 (en) * | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2429222A (en) * | 1943-06-05 | 1947-10-21 | Bell Telephone Labor Inc | Method of making contact wires |
US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US4674671A (en) * | 1985-11-04 | 1987-06-23 | Olin Corporation | Thermosonic palladium lead wire bonding |
WO1993007657A1 (en) * | 1991-09-30 | 1993-04-15 | Ceridian Corporation | Plated compliant lead |
US5495667A (en) * | 1994-11-07 | 1996-03-05 | Micron Technology, Inc. | Method for forming contact pins for semiconductor dice and interconnects |
-
1996
- 1996-05-28 AU AU60287/96A patent/AU6028796A/en not_active Abandoned
- 1996-05-28 JP JP53595096A patent/JP3157005B2/en not_active Expired - Fee Related
- 1996-05-28 WO PCT/US1996/008276 patent/WO1996037334A1/en active Application Filing
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7772860B2 (en) | 1999-05-27 | 2010-08-10 | Nanonexus, Inc. | Massively parallel interface for electronic circuit |
US7884634B2 (en) | 1999-05-27 | 2011-02-08 | Verigy (Singapore) Pte, Ltd | High density interconnect system having rapid fabrication cycle |
US6815961B2 (en) | 1999-07-28 | 2004-11-09 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7872482B2 (en) | 2000-05-23 | 2011-01-18 | Verigy (Singapore) Pte. Ltd | High density interconnect system having rapid fabrication cycle |
US7952373B2 (en) * | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
Also Published As
Publication number | Publication date |
---|---|
WO1996037334A1 (en) | 1996-11-28 |
JP3157005B2 (en) | 2001-04-16 |
JP2000513499A (en) | 2000-10-10 |
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