AU5964096A - Ribbon-like core interconnection elements - Google Patents
Ribbon-like core interconnection elementsInfo
- Publication number
- AU5964096A AU5964096A AU59640/96A AU5964096A AU5964096A AU 5964096 A AU5964096 A AU 5964096A AU 59640/96 A AU59640/96 A AU 59640/96A AU 5964096 A AU5964096 A AU 5964096A AU 5964096 A AU5964096 A AU 5964096A
- Authority
- AU
- Australia
- Prior art keywords
- ribbon
- interconnection elements
- core interconnection
- core
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K1/00—Printed circuits
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- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/452,255 US6336269B1 (en) | 1993-11-16 | 1995-05-26 | Method of fabricating an interconnection element |
US452255 | 1995-05-26 | ||
US52624695A | 1995-09-21 | 1995-09-21 | |
US526246 | 1995-09-21 | ||
US08/533,584 US5772451A (en) | 1993-11-16 | 1995-10-18 | Sockets for electronic components and methods of connecting to electronic components |
US533584 | 1995-10-18 | ||
US554902 | 1995-11-09 | ||
US08/554,902 US5974662A (en) | 1993-11-16 | 1995-11-09 | Method of planarizing tips of probe elements of a probe card assembly |
PCT/US1995/014909 WO1996017378A1 (en) | 1994-11-15 | 1995-11-13 | Electrical contact structures from flexible wire |
WOUS9514909 | 1995-11-13 | ||
US08/558,332 US5829128A (en) | 1993-11-16 | 1995-11-15 | Method of mounting resilient contact structures to semiconductor devices |
US558332 | 1995-11-15 | ||
US1287896P | 1996-03-05 | 1996-03-05 | |
US012878 | 1996-03-05 | ||
PCT/US1996/008274 WO1996037333A1 (en) | 1995-05-26 | 1996-05-28 | Ribbon-like core interconnection elements |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5964096A true AU5964096A (en) | 1996-12-11 |
Family
ID=27555743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU59640/96A Abandoned AU5964096A (en) | 1995-05-26 | 1996-05-28 | Ribbon-like core interconnection elements |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0828582A4 (en) |
JP (1) | JP2002509640A (en) |
CN (1) | CN1191500A (en) |
AU (1) | AU5964096A (en) |
WO (1) | WO1996037333A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6442831B1 (en) | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
US6836962B2 (en) | 1993-11-16 | 2005-01-04 | Formfactor, Inc. | Method and apparatus for shaping spring elements |
CA2266158C (en) | 1999-03-18 | 2003-05-20 | Ibm Canada Limited-Ibm Canada Limitee | Connecting devices and method for interconnecting circuit components |
US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US6799976B1 (en) | 1999-07-28 | 2004-10-05 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US6777265B2 (en) * | 2002-04-29 | 2004-08-17 | Advanced Interconnect Technologies Limited | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
US6854637B2 (en) * | 2003-02-20 | 2005-02-15 | Freescale Semiconductor, Inc. | Wirebonding insulated wire |
JP2006010426A (en) * | 2004-06-24 | 2006-01-12 | Denso Corp | Sensor device and its manufacturing method |
CN103367297B (en) * | 2012-03-31 | 2016-12-14 | 南亚科技股份有限公司 | There is the encapsulating structure of ribbon wire |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2429222A (en) * | 1943-06-05 | 1947-10-21 | Bell Telephone Labor Inc | Method of making contact wires |
US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US4674671A (en) * | 1985-11-04 | 1987-06-23 | Olin Corporation | Thermosonic palladium lead wire bonding |
DE4022664A1 (en) * | 1990-07-17 | 1992-01-23 | Standard Elektrik Lorenz Ag | Bonding tool for connecting electrical leads to contact surfaces - acts as electro-resistance welder and/or thermal bonding unit independently or simultaneously |
DE69222957D1 (en) * | 1991-09-30 | 1997-12-04 | Ceridian Corp | PLATED FLEXIBLE LADDER |
US5228862A (en) * | 1992-08-31 | 1993-07-20 | International Business Machines Corporation | Fluid pressure actuated connector |
-
1996
- 1996-05-28 CN CN96195738A patent/CN1191500A/en active Pending
- 1996-05-28 AU AU59640/96A patent/AU5964096A/en not_active Abandoned
- 1996-05-28 WO PCT/US1996/008274 patent/WO1996037333A1/en not_active Application Discontinuation
- 1996-05-28 EP EP96916923A patent/EP0828582A4/en not_active Withdrawn
- 1996-05-28 JP JP53594896A patent/JP2002509640A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0828582A4 (en) | 1999-02-03 |
JP2002509640A (en) | 2002-03-26 |
EP0828582A1 (en) | 1998-03-18 |
CN1191500A (en) | 1998-08-26 |
WO1996037333A1 (en) | 1996-11-28 |
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