AU5879599A - Electronic measuring and/or control instruments for refrigeration, heating and air conditioning comprising semi-conductor components achieved with high integration technologies - Google Patents

Electronic measuring and/or control instruments for refrigeration, heating and air conditioning comprising semi-conductor components achieved with high integration technologies

Info

Publication number
AU5879599A
AU5879599A AU58795/99A AU5879599A AU5879599A AU 5879599 A AU5879599 A AU 5879599A AU 58795/99 A AU58795/99 A AU 58795/99A AU 5879599 A AU5879599 A AU 5879599A AU 5879599 A AU5879599 A AU 5879599A
Authority
AU
Australia
Prior art keywords
refrigeration
semi
heating
air conditioning
high integration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU58795/99A
Inventor
Frank Monaco
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robertshaw SRL
Original Assignee
Invensys Climate Controls SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Invensys Climate Controls SpA filed Critical Invensys Climate Controls SpA
Publication of AU5879599A publication Critical patent/AU5879599A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU58795/99A 1998-10-08 1999-10-06 Electronic measuring and/or control instruments for refrigeration, heating and air conditioning comprising semi-conductor components achieved with high integration technologies Abandoned AU5879599A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITUD98A0173 1998-10-08
IT1998UD000173A IT1302781B1 (en) 1998-10-08 1998-10-08 INTEGRATED CIRCUITS FOR ELECTRONIC MEASUREMENT AND / OR CONTROL INSTRUMENTS FOR REFRIGERATION, HEATING AND
PCT/IB1999/001636 WO2000021136A1 (en) 1998-10-08 1999-10-06 Electronic measuring and/or control instruments for refrigeration, heating and air conditioning comprising semi-conductor components achieved with high integration technologies

Publications (1)

Publication Number Publication Date
AU5879599A true AU5879599A (en) 2000-04-26

Family

ID=11422758

Family Applications (1)

Application Number Title Priority Date Filing Date
AU58795/99A Abandoned AU5879599A (en) 1998-10-08 1999-10-06 Electronic measuring and/or control instruments for refrigeration, heating and air conditioning comprising semi-conductor components achieved with high integration technologies

Country Status (3)

Country Link
AU (1) AU5879599A (en)
IT (1) IT1302781B1 (en)
WO (1) WO2000021136A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012221499A1 (en) * 2012-11-23 2014-05-28 BSH Bosch und Siemens Hausgeräte GmbH Domestic refrigerating appliance with a display means for a container lid
CN108182906B (en) * 2018-01-11 2020-03-03 青岛海信日立空调系统有限公司 Control method and device for segment code display screen on household appliance

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4000437A (en) * 1975-12-17 1976-12-28 Integrated Display Systems Incorporated Electric display device
JPS61229374A (en) * 1985-04-03 1986-10-13 Toshiba Corp Semiconductor light emitting display device
DE3941679A1 (en) * 1989-12-18 1991-06-27 Telefunken Electronic Gmbh PHOTO MODULE
US5007190A (en) * 1990-05-11 1991-04-16 Shyu Chih Yes Solar house-number indicating device
DE19625756A1 (en) * 1996-06-27 1998-01-02 Bosch Gmbh Robert Module for an electrical device
US5673850A (en) * 1996-07-22 1997-10-07 Lux Products Corporation Programmable thermostat with rotary dial program setting

Also Published As

Publication number Publication date
ITUD980173A1 (en) 2000-04-08
WO2000021136A1 (en) 2000-04-13
IT1302781B1 (en) 2000-09-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase