AU5448294A - Composite substrates for preparation of printed circuits - Google Patents

Composite substrates for preparation of printed circuits

Info

Publication number
AU5448294A
AU5448294A AU54482/94A AU5448294A AU5448294A AU 5448294 A AU5448294 A AU 5448294A AU 54482/94 A AU54482/94 A AU 54482/94A AU 5448294 A AU5448294 A AU 5448294A AU 5448294 A AU5448294 A AU 5448294A
Authority
AU
Australia
Prior art keywords
preparation
printed circuits
composite substrates
substrates
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU54482/94A
Other languages
English (en)
Inventor
Miguel Albert Capote
Michael George Todd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toranaga Technologies Inc
Original Assignee
Toranaga Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toranaga Technologies Inc filed Critical Toranaga Technologies Inc
Publication of AU5448294A publication Critical patent/AU5448294A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU54482/94A 1993-10-22 1993-10-22 Composite substrates for preparation of printed circuits Abandoned AU5448294A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/US1993/010148 WO1995011129A1 (fr) 1993-10-22 1993-10-22 Substrats composites destines a la production de circuits imprimes
CN93112824.2A CN1104014A (zh) 1993-10-22 1993-12-14 用于制备印制电路的复合衬底

Publications (1)

Publication Number Publication Date
AU5448294A true AU5448294A (en) 1995-05-08

Family

ID=36940015

Family Applications (1)

Application Number Title Priority Date Filing Date
AU54482/94A Abandoned AU5448294A (en) 1993-10-22 1993-10-22 Composite substrates for preparation of printed circuits

Country Status (3)

Country Link
CN (1) CN1104014A (fr)
AU (1) AU5448294A (fr)
WO (1) WO1995011129A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19952246A1 (de) 1998-11-04 2000-05-31 Thomson Brandt Gmbh Elektromechanisches Bauteil
WO2002080637A1 (fr) * 2001-04-02 2002-10-10 Nashua Corporation Elements de circuit possedant une trace conductrice enfouie et procedes de fabrication associes
GB0616934D0 (en) 2006-08-26 2006-10-04 Hexcel Composites Ltd Composite material
DE102007038217A1 (de) * 2007-08-13 2009-02-19 Behr Gmbh & Co. Kg Verfahren zum Beloten eines Werkstückes, Vorrichtung zur Durchführung des Verfahrens und Werkstück, belotet nach dem Verfahren
US10293956B2 (en) * 2016-09-16 2019-05-21 The Boeing Company Method for placing electrical conductors interior to a composite structure prior to curing
US10052847B2 (en) 2016-09-16 2018-08-21 The Boeing Company Method for promoting electrical conduction between metallic components and composite materials
US20190060583A1 (en) 2017-08-22 2019-02-28 Jabil Circuit, Inc. Apparatus, system and method of providing a conformable heater system
WO2019109088A1 (fr) * 2017-12-01 2019-06-06 Jabil Inc. Appareil, système et procédé de fourniture d'un système chauffant adaptable
EP3582233B1 (fr) * 2018-06-13 2021-07-28 Airbus Operations, S.L.U. Procédé d'installation de câble imprimé dans des systèmes de harnais pour aéronefs et élément composite avec un système de harnais intégré
CN111548194A (zh) * 2020-05-29 2020-08-18 南京凯泰化学科技有限公司 一种印制电路板的制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive

Also Published As

Publication number Publication date
CN1104014A (zh) 1995-06-21
WO1995011129A1 (fr) 1995-04-27

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