AU5296996A - Heat-sinking structures and electrical sockets for use therewith - Google Patents

Heat-sinking structures and electrical sockets for use therewith

Info

Publication number
AU5296996A
AU5296996A AU52969/96A AU5296996A AU5296996A AU 5296996 A AU5296996 A AU 5296996A AU 52969/96 A AU52969/96 A AU 52969/96A AU 5296996 A AU5296996 A AU 5296996A AU 5296996 A AU5296996 A AU 5296996A
Authority
AU
Australia
Prior art keywords
heat
use therewith
electrical sockets
sinking structures
sinking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU52969/96A
Other versions
AU717240B2 (en
Inventor
Alan F. Beane
Glenn L. Beane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materials Innovation Inc
Original Assignee
Mat Innovation Inc
Materials Innovation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/392,131 external-priority patent/US6003586A/en
Application filed by Mat Innovation Inc, Materials Innovation Inc filed Critical Mat Innovation Inc
Publication of AU5296996A publication Critical patent/AU5296996A/en
Application granted granted Critical
Publication of AU717240B2 publication Critical patent/AU717240B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D25/00—Special casting characterised by the nature of the product
    • B22D25/02—Special casting characterised by the nature of the product by its peculiarity of shape; of works of art
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
    • B22D27/15—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting by using vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU52969/96A 1995-02-22 1996-02-21 Heat-sinking structures and electrical sockets for use therewith Ceased AU717240B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/392131 1995-02-22
US08/392,131 US6003586A (en) 1990-11-05 1995-02-22 Heat-sinking structures and electrical sockets for use therewith
PCT/US1996/002306 WO1996026030A1 (en) 1995-02-22 1996-02-21 Heat-sinking structures and electrical sockets for use therewith

Related Child Applications (1)

Application Number Title Priority Date Filing Date
AU52604/99A Division AU5260499A (en) 1995-02-22 1999-09-30 A combination electromagnetic interference filter and electrical socket assembly.

Publications (2)

Publication Number Publication Date
AU5296996A true AU5296996A (en) 1996-09-11
AU717240B2 AU717240B2 (en) 2000-03-23

Family

ID=23549366

Family Applications (1)

Application Number Title Priority Date Filing Date
AU52969/96A Ceased AU717240B2 (en) 1995-02-22 1996-02-21 Heat-sinking structures and electrical sockets for use therewith

Country Status (5)

Country Link
EP (1) EP0810910A4 (en)
JP (1) JPH11500666A (en)
AU (1) AU717240B2 (en)
CA (1) CA2213515A1 (en)
WO (1) WO1996026030A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0948248A1 (en) * 1998-03-24 1999-10-06 Lucent Technologies Inc. Electronic apparatus having an environmentally sealed enclosure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4407552A (en) * 1978-05-18 1983-10-04 Matsushita Electric Industrial Co., Ltd. Connector unit
JPS58205668A (en) * 1982-05-24 1983-11-30 Sintokogio Ltd Casting method
JPS6380957A (en) * 1986-09-25 1988-04-11 Naigai Mariaburu Kk Casting method
US5215140A (en) * 1990-11-05 1993-06-01 Mi Propruetart Method of making a heat sink
GB9212674D0 (en) * 1992-06-15 1992-07-29 Rank Brimar Ltd Multipin structures
US5413751A (en) * 1993-04-14 1995-05-09 Frank J. Polese Method for making heat-dissipating elements for micro-electronic devices

Also Published As

Publication number Publication date
EP0810910A4 (en) 1999-06-02
WO1996026030A1 (en) 1996-08-29
CA2213515A1 (en) 1996-08-29
AU717240B2 (en) 2000-03-23
EP0810910A1 (en) 1997-12-10
JPH11500666A (en) 1999-01-19

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Legal Events

Date Code Title Description
FGA Letters patent sealed or granted (standard patent)
MK14 Patent ceased section 143(a) (annual fees not paid) or expired