AU458999B2 - Process for forming plastic parts having surfaces receptive to adhesive coatings - Google Patents

Process for forming plastic parts having surfaces receptive to adhesive coatings

Info

Publication number
AU458999B2
AU458999B2 AU31540/71A AU3154071A AU458999B2 AU 458999 B2 AU458999 B2 AU 458999B2 AU 31540/71 A AU31540/71 A AU 31540/71A AU 3154071 A AU3154071 A AU 3154071A AU 458999 B2 AU458999 B2 AU 458999B2
Authority
AU
Australia
Prior art keywords
plastic parts
adhesive coatings
forming plastic
surfaces receptive
receptive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU31540/71A
Other versions
AU3154071A (en
Inventor
EUGENE H. DOTTAVIO HAROLD L. RODENIZER MICHAELS. LOMBAR and WILLIAM P. INNES JOHNJ. GRUNWALD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Priority to AU31540/71A priority Critical patent/AU458999B2/en
Publication of AU3154071A publication Critical patent/AU3154071A/en
Application granted granted Critical
Publication of AU458999B2 publication Critical patent/AU458999B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
AU31540/71A 1971-07-22 1971-07-22 Process for forming plastic parts having surfaces receptive to adhesive coatings Expired AU458999B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU31540/71A AU458999B2 (en) 1971-07-22 1971-07-22 Process for forming plastic parts having surfaces receptive to adhesive coatings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU31540/71A AU458999B2 (en) 1971-07-22 1971-07-22 Process for forming plastic parts having surfaces receptive to adhesive coatings

Publications (2)

Publication Number Publication Date
AU3154071A AU3154071A (en) 1973-01-25
AU458999B2 true AU458999B2 (en) 1975-03-13

Family

ID=3719233

Family Applications (1)

Application Number Title Priority Date Filing Date
AU31540/71A Expired AU458999B2 (en) 1971-07-22 1971-07-22 Process for forming plastic parts having surfaces receptive to adhesive coatings

Country Status (1)

Country Link
AU (1) AU458999B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU611222B2 (en) * 1987-11-10 1991-06-06 Hoechst Aktiengesellschaft Dispersion polymers based on ethylenically unsaturated monomers and containing urethane groups, process for their preparation, and their use

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU611222B2 (en) * 1987-11-10 1991-06-06 Hoechst Aktiengesellschaft Dispersion polymers based on ethylenically unsaturated monomers and containing urethane groups, process for their preparation, and their use

Also Published As

Publication number Publication date
AU3154071A (en) 1973-01-25

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