AU454608B2 - Method of making thermo compression bonded semiconductor device - Google Patents

Method of making thermo compression bonded semiconductor device

Info

Publication number
AU454608B2
AU454608B2 AU34973/71A AU3497371A AU454608B2 AU 454608 B2 AU454608 B2 AU 454608B2 AU 34973/71 A AU34973/71 A AU 34973/71A AU 3497371 A AU3497371 A AU 3497371A AU 454608 B2 AU454608 B2 AU 454608B2
Authority
AU
Australia
Prior art keywords
semiconductor device
bonded semiconductor
compression bonded
thermo compression
making thermo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU34973/71A
Other languages
English (en)
Other versions
AU3497371A (en
Inventor
Fujiwara Shohei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Publication of AU3497371A publication Critical patent/AU3497371A/en
Application granted granted Critical
Publication of AU454608B2 publication Critical patent/AU454608B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
AU34973/71A 1970-10-30 1971-10-25 Method of making thermo compression bonded semiconductor device Expired AU454608B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP45-96128 1970-10-30
JP9612870A JPS4939223B1 (enrdf_load_stackoverflow) 1970-10-30 1970-10-30
JPJP45-97672 1970-11-05
JPJP9860598 1970-11-07

Publications (2)

Publication Number Publication Date
AU3497371A AU3497371A (en) 1973-05-03
AU454608B2 true AU454608B2 (en) 1974-10-31

Family

ID=14156730

Family Applications (1)

Application Number Title Priority Date Filing Date
AU34973/71A Expired AU454608B2 (en) 1970-10-30 1971-10-25 Method of making thermo compression bonded semiconductor device

Country Status (2)

Country Link
JP (1) JPS4939223B1 (enrdf_load_stackoverflow)
AU (1) AU454608B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135138A (en) * 1975-05-19 1976-11-24 Yoshinori Hiraoka Splicing and fastening apparatus for continuous corrugated roofing
JPS5564334U (enrdf_load_stackoverflow) * 1979-11-01 1980-05-02

Also Published As

Publication number Publication date
JPS4939223B1 (enrdf_load_stackoverflow) 1974-10-24
AU3497371A (en) 1973-05-03

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