AU3974295A - Direct and selective process for applying protective layers - Google Patents

Direct and selective process for applying protective layers

Info

Publication number
AU3974295A
AU3974295A AU39742/95A AU3974295A AU3974295A AU 3974295 A AU3974295 A AU 3974295A AU 39742/95 A AU39742/95 A AU 39742/95A AU 3974295 A AU3974295 A AU 3974295A AU 3974295 A AU3974295 A AU 3974295A
Authority
AU
Australia
Prior art keywords
direct
protective layers
selective process
applying protective
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU39742/95A
Inventor
Theophil-Johannes Melicher
Wolfgang Stubenvoll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THEOPHIL JOHANNES MELICHER
Original Assignee
THEOPHIL JOHANNES MELICHER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THEOPHIL JOHANNES MELICHER filed Critical THEOPHIL JOHANNES MELICHER
Publication of AU3974295A publication Critical patent/AU3974295A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
  • Chemically Coating (AREA)
AU39742/95A 1994-12-09 1995-12-04 Direct and selective process for applying protective layers Abandoned AU3974295A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AT229694 1994-12-09
AT2296/94 1994-12-09
PCT/AT1995/000240 WO1996018285A1 (en) 1994-12-09 1995-12-04 Direct and selective process for applying protective layers

Publications (1)

Publication Number Publication Date
AU3974295A true AU3974295A (en) 1996-06-26

Family

ID=3531729

Family Applications (1)

Application Number Title Priority Date Filing Date
AU39742/95A Abandoned AU3974295A (en) 1994-12-09 1995-12-04 Direct and selective process for applying protective layers

Country Status (2)

Country Link
AU (1) AU3974295A (en)
WO (1) WO1996018285A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3047884A1 (en) * 1980-12-18 1982-07-15 Siemens AG, 1000 Berlin und 8000 München Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate
DE3728337A1 (en) * 1987-08-25 1989-03-16 Goerlitz Computerbau Gmbh Method for producing etched printed circuit boards
DE3740149A1 (en) * 1987-11-26 1989-06-08 Herbert Dr Strohwald Method for producing a conductor pattern on a substrate
DE3842159A1 (en) * 1988-12-15 1990-06-21 Walter Kopisch Method for fabricating printed circuits
GB9403682D0 (en) * 1994-02-25 1994-04-13 Univ Edinburgh Direct printing of etch masks under computer control

Also Published As

Publication number Publication date
WO1996018285A1 (en) 1996-06-13

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