AU3714701A - Thermal expansion compensation for modular printhead assemblies - Google Patents
Thermal expansion compensation for modular printhead assembliesInfo
- Publication number
- AU3714701A AU3714701A AU3714701A AU3714701A AU3714701A AU 3714701 A AU3714701 A AU 3714701A AU 3714701 A AU3714701 A AU 3714701A AU 3714701 A AU3714701 A AU 3714701A AU 3714701 A AU3714701 A AU 3714701A
- Authority
- AU
- Australia
- Prior art keywords
- thermal expansion
- expansion compensation
- printhead assemblies
- modular printhead
- modular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU3714701A AU3714701A (en) | 2000-03-06 | 2001-03-06 | Thermal expansion compensation for modular printhead assemblies |
AU2001237147A AU2001237147B2 (en) | 2000-03-06 | 2001-03-06 | Thermal expansion compensation for modular printhead assemblies |
AU2005201832A AU2005201832B2 (en) | 2000-03-06 | 2005-05-02 | Laminated support structure for silicon printhead modules |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPQ6059A AUPQ605900A0 (en) | 2000-03-06 | 2000-03-06 | Thermal expansion compensation for printhead assemblies |
AU3714701A AU3714701A (en) | 2000-03-06 | 2001-03-06 | Thermal expansion compensation for modular printhead assemblies |
PCT/AU2001/000238 WO2001066354A1 (en) | 2000-03-06 | 2001-03-06 | Thermal expansion compensation for modular printhead assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
AU3714701A true AU3714701A (en) | 2001-09-17 |
Family
ID=25623912
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001237147A Ceased AU2001237147B2 (en) | 2000-03-06 | 2001-03-06 | Thermal expansion compensation for modular printhead assemblies |
AU3714701A Pending AU3714701A (en) | 2000-03-06 | 2001-03-06 | Thermal expansion compensation for modular printhead assemblies |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001237147A Ceased AU2001237147B2 (en) | 2000-03-06 | 2001-03-06 | Thermal expansion compensation for modular printhead assemblies |
Country Status (1)
Country | Link |
---|---|
AU (2) | AU2001237147B2 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3520728B2 (en) * | 1996-10-28 | 2004-04-19 | セイコーエプソン株式会社 | Ink jet recording head and method of manufacturing the same |
JPH10128974A (en) * | 1996-10-29 | 1998-05-19 | Tec Corp | Ink jet printer head |
US6039439A (en) * | 1998-06-19 | 2000-03-21 | Lexmark International, Inc. | Ink jet heater chip module |
-
2001
- 2001-03-06 AU AU2001237147A patent/AU2001237147B2/en not_active Ceased
- 2001-03-06 AU AU3714701A patent/AU3714701A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
AU2001237147B2 (en) | 2005-02-03 |
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