AU3603900A - Board with nickel-plated thru-holes and/or blind vias - Google Patents

Board with nickel-plated thru-holes and/or blind vias

Info

Publication number
AU3603900A
AU3603900A AU36039/00A AU3603900A AU3603900A AU 3603900 A AU3603900 A AU 3603900A AU 36039/00 A AU36039/00 A AU 36039/00A AU 3603900 A AU3603900 A AU 3603900A AU 3603900 A AU3603900 A AU 3603900A
Authority
AU
Australia
Prior art keywords
nickel
board
holes
blind vias
plated thru
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU36039/00A
Inventor
Chris A. Hunrath
Henry E. Lajoie Jr.
Mark G. Rodgers
Michael K. Walsh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
OMG Fidelity Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMG Fidelity Inc filed Critical OMG Fidelity Inc
Publication of AU3603900A publication Critical patent/AU3603900A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
AU36039/00A 1999-02-24 2000-02-24 Board with nickel-plated thru-holes and/or blind vias Abandoned AU3603900A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25638299A 1999-02-24 1999-02-24
US09256382 1999-02-24
PCT/US2000/004685 WO2000050230A1 (en) 1999-02-24 2000-02-24 Board with nickel-plated thru-holes and/or blind vias

Publications (1)

Publication Number Publication Date
AU3603900A true AU3603900A (en) 2000-09-14

Family

ID=22972048

Family Applications (1)

Application Number Title Priority Date Filing Date
AU36039/00A Abandoned AU3603900A (en) 1999-02-24 2000-02-24 Board with nickel-plated thru-holes and/or blind vias

Country Status (3)

Country Link
JP (1) JP2000252630A (en)
AU (1) AU3603900A (en)
WO (1) WO2000050230A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015638B1 (en) * 2008-09-05 2011-02-22 트리포드 테크놀로지 코포레이션 Capping method for pcb
JP6816486B2 (en) 2016-12-07 2021-01-20 凸版印刷株式会社 Manufacturing method of core substrate, multilayer wiring board, semiconductor package, semiconductor module, copper-clad substrate, and core substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915717A (en) * 1973-11-12 1975-10-28 Rca Corp Stabilized autocatalytic metal deposition baths
WO1988000988A1 (en) * 1986-08-06 1988-02-11 Macdermid, Incorporated Method for manufacture of printed circuit boards
EP0645074B1 (en) * 1992-06-11 1998-01-28 Macdermid Incorporated Method of making a printed circuit board

Also Published As

Publication number Publication date
WO2000050230A1 (en) 2000-08-31
JP2000252630A (en) 2000-09-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase