AU3210495A - Molded parts used for photographic sensitive materials and resin compositions used to make thereof - Google Patents

Molded parts used for photographic sensitive materials and resin compositions used to make thereof

Info

Publication number
AU3210495A
AU3210495A AU32104/95A AU3210495A AU3210495A AU 3210495 A AU3210495 A AU 3210495A AU 32104/95 A AU32104/95 A AU 32104/95A AU 3210495 A AU3210495 A AU 3210495A AU 3210495 A AU3210495 A AU 3210495A
Authority
AU
Australia
Prior art keywords
make
resin compositions
molded parts
sensitive materials
photographic sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU32104/95A
Inventor
Robert J Kassal
Ken-Ichi Shinohara
Osamu Suzuki
Takashi Yoneyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of AU3210495A publication Critical patent/AU3210495A/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03CPHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C3/00Packages of films for inserting into cameras, e.g. roll-films, film-packs; Wrapping materials for light-sensitive plates, films or papers, e.g. materials characterised by the use of special dyes, printing inks, adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU32104/95A 1994-08-01 1995-08-01 Molded parts used for photographic sensitive materials and resin compositions used to make thereof Abandoned AU3210495A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP17990894A JP3310467B2 (en) 1994-08-01 1994-08-01 Molded product for photographic photosensitive material and resin composition used for the same
JP6-179908 1994-08-01
PCT/US1995/009798 WO1996004591A1 (en) 1994-08-01 1995-08-01 Molded parts used for photographic sensitive materials and resin compositions used to make thereof

Publications (1)

Publication Number Publication Date
AU3210495A true AU3210495A (en) 1996-03-04

Family

ID=16074020

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32104/95A Abandoned AU3210495A (en) 1994-08-01 1995-08-01 Molded parts used for photographic sensitive materials and resin compositions used to make thereof

Country Status (3)

Country Link
JP (1) JP3310467B2 (en)
AU (1) AU3210495A (en)
WO (1) WO1996004591A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100502597B1 (en) * 1996-12-27 2005-07-22 폴리플라스틱스 가부시키가이샤 Polyacetal Resin Composition and Moldings
JP2002541288A (en) * 1999-04-07 2002-12-03 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Polyacetal resin with reduced formaldehyde odor
JP2001192530A (en) * 2000-01-07 2001-07-17 Du Pont Kk Polyacetal resin material for molding, molded article such as slide fastener emitting aroma, and method for producing molded article emitting aroma
US7086529B2 (en) 2002-02-26 2006-08-08 Fuji Photo Film Co., Ltd. Packaging material for photographic light-sensitive material and photographic light-sensitive material package using same
US7816433B2 (en) 2003-10-24 2010-10-19 Asahi Kasei Chemicals Corporation Polyacetal resin composition and article thereof
JP2007051205A (en) * 2005-08-17 2007-03-01 Polyplastics Co Polyacetal resin composition and resin-molded article
US20080234413A1 (en) * 2007-03-20 2008-09-25 Kenichi Shinohara Polyacetal resin composition
JP2010265438A (en) * 2009-04-15 2010-11-25 Polyplastics Co Cellulose fiber-reinforced polyacetal resin composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1194140B (en) * 1962-07-31 1965-06-03 Asahi Chemical Ind Stabilizing polyoxymethylene
US3333520A (en) * 1962-10-23 1967-08-01 Celanese Corp Polymer product
GB1320452A (en) * 1971-02-26 1973-06-13 Kodak Ltd Formaldehyde contamination reducing varnish
US4751272A (en) * 1986-05-01 1988-06-14 Toray Industries, Inc. Process for producing oxymethylene copolymer and resinous composition
JP3085330B2 (en) * 1992-08-17 2000-09-04 富士写真フイルム株式会社 Packaging materials and packages for photographic photosensitive materials
EP0658809B1 (en) * 1993-12-17 1999-06-16 Agfa-Gevaert N.V. A sealed package for imaging elements for making lithographic printing plates according to the silver salt diffusion transfer process

Also Published As

Publication number Publication date
JP3310467B2 (en) 2002-08-05
JPH0841288A (en) 1996-02-13
WO1996004591A1 (en) 1996-02-15

Similar Documents

Publication Publication Date Title
AU6860391A (en) Thermosettable resin composition containing resin particles
AU8354491A (en) Polyamide resin composition and film therefrom
AU653373B2 (en) Photosensitive resin composition and photosensitive element structure
EP0738927A3 (en) Photosensitive resin composition and photosensitive element using the same
AU1217092A (en) Photosensitive resin composition
EP0488335A3 (en) Thermoplastic resin composition and use thereof
DE69510637D1 (en) THERMOPLASTIC RESIN COMPOSITION
DE69528601T2 (en) THERMOPLASTIC RESIN COMPOSITION
AU8277091A (en) Resin compositions
AU8685591A (en) Thermoplastic resin composition
IL98646A0 (en) Photosensitive resin containing a quinonediazide derivative and compositions containing the same
AU638089B2 (en) Rubber modified epoxy resin compositions
AU2166692A (en) Polypropylene resin and its composition
AU7575491A (en) Curable resin composition
AU639608B2 (en) Curable resin and composition containing the same
EP0479560A3 (en) Stabilized thermoplastic resin composition
DE69516623T2 (en) Thermoplastic resin composition
EP0462785A3 (en) Resin composition for toners
AU3210495A (en) Molded parts used for photographic sensitive materials and resin compositions used to make thereof
DE69508129D1 (en) Epoxy resin composition and molding compounds therefrom
AU5836696A (en) Resin composition and molded product thereof
AU639805B2 (en) Thermoplastic resin composition
DE69330025D1 (en) Thermoplastic resin compositions
AU3881695A (en) Curable resin and composition
DE69630934D1 (en) Resin powder composition