AU3210495A - Molded parts used for photographic sensitive materials and resin compositions used to make thereof - Google Patents
Molded parts used for photographic sensitive materials and resin compositions used to make thereofInfo
- Publication number
- AU3210495A AU3210495A AU32104/95A AU3210495A AU3210495A AU 3210495 A AU3210495 A AU 3210495A AU 32104/95 A AU32104/95 A AU 32104/95A AU 3210495 A AU3210495 A AU 3210495A AU 3210495 A AU3210495 A AU 3210495A
- Authority
- AU
- Australia
- Prior art keywords
- make
- resin compositions
- molded parts
- sensitive materials
- photographic sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C3/00—Packages of films for inserting into cameras, e.g. roll-films, film-packs; Wrapping materials for light-sensitive plates, films or papers, e.g. materials characterised by the use of special dyes, printing inks, adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17990894A JP3310467B2 (en) | 1994-08-01 | 1994-08-01 | Molded product for photographic photosensitive material and resin composition used for the same |
JP6-179908 | 1994-08-01 | ||
PCT/US1995/009798 WO1996004591A1 (en) | 1994-08-01 | 1995-08-01 | Molded parts used for photographic sensitive materials and resin compositions used to make thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
AU3210495A true AU3210495A (en) | 1996-03-04 |
Family
ID=16074020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU32104/95A Abandoned AU3210495A (en) | 1994-08-01 | 1995-08-01 | Molded parts used for photographic sensitive materials and resin compositions used to make thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3310467B2 (en) |
AU (1) | AU3210495A (en) |
WO (1) | WO1996004591A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100502597B1 (en) * | 1996-12-27 | 2005-07-22 | 폴리플라스틱스 가부시키가이샤 | Polyacetal Resin Composition and Moldings |
JP2002541288A (en) * | 1999-04-07 | 2002-12-03 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Polyacetal resin with reduced formaldehyde odor |
JP2001192530A (en) * | 2000-01-07 | 2001-07-17 | Du Pont Kk | Polyacetal resin material for molding, molded article such as slide fastener emitting aroma, and method for producing molded article emitting aroma |
US7086529B2 (en) | 2002-02-26 | 2006-08-08 | Fuji Photo Film Co., Ltd. | Packaging material for photographic light-sensitive material and photographic light-sensitive material package using same |
US7816433B2 (en) | 2003-10-24 | 2010-10-19 | Asahi Kasei Chemicals Corporation | Polyacetal resin composition and article thereof |
JP2007051205A (en) * | 2005-08-17 | 2007-03-01 | Polyplastics Co | Polyacetal resin composition and resin-molded article |
US20080234413A1 (en) * | 2007-03-20 | 2008-09-25 | Kenichi Shinohara | Polyacetal resin composition |
JP2010265438A (en) * | 2009-04-15 | 2010-11-25 | Polyplastics Co | Cellulose fiber-reinforced polyacetal resin composition |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1194140B (en) * | 1962-07-31 | 1965-06-03 | Asahi Chemical Ind | Stabilizing polyoxymethylene |
US3333520A (en) * | 1962-10-23 | 1967-08-01 | Celanese Corp | Polymer product |
GB1320452A (en) * | 1971-02-26 | 1973-06-13 | Kodak Ltd | Formaldehyde contamination reducing varnish |
US4751272A (en) * | 1986-05-01 | 1988-06-14 | Toray Industries, Inc. | Process for producing oxymethylene copolymer and resinous composition |
JP3085330B2 (en) * | 1992-08-17 | 2000-09-04 | 富士写真フイルム株式会社 | Packaging materials and packages for photographic photosensitive materials |
EP0658809B1 (en) * | 1993-12-17 | 1999-06-16 | Agfa-Gevaert N.V. | A sealed package for imaging elements for making lithographic printing plates according to the silver salt diffusion transfer process |
-
1994
- 1994-08-01 JP JP17990894A patent/JP3310467B2/en not_active Expired - Fee Related
-
1995
- 1995-08-01 AU AU32104/95A patent/AU3210495A/en not_active Abandoned
- 1995-08-01 WO PCT/US1995/009798 patent/WO1996004591A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP3310467B2 (en) | 2002-08-05 |
JPH0841288A (en) | 1996-02-13 |
WO1996004591A1 (en) | 1996-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU6860391A (en) | Thermosettable resin composition containing resin particles | |
AU8354491A (en) | Polyamide resin composition and film therefrom | |
AU653373B2 (en) | Photosensitive resin composition and photosensitive element structure | |
EP0738927A3 (en) | Photosensitive resin composition and photosensitive element using the same | |
AU1217092A (en) | Photosensitive resin composition | |
EP0488335A3 (en) | Thermoplastic resin composition and use thereof | |
DE69510637D1 (en) | THERMOPLASTIC RESIN COMPOSITION | |
DE69528601T2 (en) | THERMOPLASTIC RESIN COMPOSITION | |
AU8277091A (en) | Resin compositions | |
AU8685591A (en) | Thermoplastic resin composition | |
IL98646A0 (en) | Photosensitive resin containing a quinonediazide derivative and compositions containing the same | |
AU638089B2 (en) | Rubber modified epoxy resin compositions | |
AU2166692A (en) | Polypropylene resin and its composition | |
AU7575491A (en) | Curable resin composition | |
AU639608B2 (en) | Curable resin and composition containing the same | |
EP0479560A3 (en) | Stabilized thermoplastic resin composition | |
DE69516623T2 (en) | Thermoplastic resin composition | |
EP0462785A3 (en) | Resin composition for toners | |
AU3210495A (en) | Molded parts used for photographic sensitive materials and resin compositions used to make thereof | |
DE69508129D1 (en) | Epoxy resin composition and molding compounds therefrom | |
AU5836696A (en) | Resin composition and molded product thereof | |
AU639805B2 (en) | Thermoplastic resin composition | |
DE69330025D1 (en) | Thermoplastic resin compositions | |
AU3881695A (en) | Curable resin and composition | |
DE69630934D1 (en) | Resin powder composition |