AU3172400A - Method for making an electronic device such as a contactless card - Google Patents

Method for making an electronic device such as a contactless card

Info

Publication number
AU3172400A
AU3172400A AU31724/00A AU3172400A AU3172400A AU 3172400 A AU3172400 A AU 3172400A AU 31724/00 A AU31724/00 A AU 31724/00A AU 3172400 A AU3172400 A AU 3172400A AU 3172400 A AU3172400 A AU 3172400A
Authority
AU
Australia
Prior art keywords
chip
antenna
electronic device
making
contactless card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU31724/00A
Inventor
Philippe Patrice
Michael Zafrany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Publication of AU3172400A publication Critical patent/AU3172400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A method for making an electronic device having an integrated circuit chip connected to an antenna. A chip is transferred into an impression provided in a substrate made of insulating material. The chip is connected to an antenna by hot lamination of an insulating support-sheet bearing the antenna. The method ensures a high quality electrical connection between the chip and the antenna, and enables the connection of a chip matrix with a plurality of antennae in a large-size circuit to be produced in one single step.
AU31724/00A 1999-03-12 2000-03-06 Method for making an electronic device such as a contactless card Abandoned AU3172400A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9903102 1999-03-12
FR9903102A FR2790849B1 (en) 1999-03-12 1999-03-12 MANUFACTURING METHOD FOR CONTACTLESS CARD TYPE ELECTRONIC DEVICE
PCT/FR2000/000555 WO2000055808A1 (en) 1999-03-12 2000-03-06 Method for making an electronic device such as a contactless card

Publications (1)

Publication Number Publication Date
AU3172400A true AU3172400A (en) 2000-10-04

Family

ID=9543140

Family Applications (1)

Application Number Title Priority Date Filing Date
AU31724/00A Abandoned AU3172400A (en) 1999-03-12 2000-03-06 Method for making an electronic device such as a contactless card

Country Status (8)

Country Link
US (1) US6677186B1 (en)
EP (1) EP1163637B1 (en)
CN (1) CN1343340A (en)
AT (1) ATE242518T1 (en)
AU (1) AU3172400A (en)
DE (1) DE60003167T2 (en)
FR (1) FR2790849B1 (en)
WO (1) WO2000055808A1 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2775810B1 (en) 1998-03-09 2000-04-28 Gemplus Card Int NON-CONTACT CARD MANUFACTURING PROCESS
IL127569A0 (en) 1998-09-16 1999-10-28 Comsense Technologies Ltd Interactive toys
US6607136B1 (en) 1998-09-16 2003-08-19 Beepcard Inc. Physical presence digital authentication system
US7334735B1 (en) 1998-10-02 2008-02-26 Beepcard Ltd. Card for interaction with a computer
US8019609B2 (en) 1999-10-04 2011-09-13 Dialware Inc. Sonic/ultrasonic authentication method
DE10114355A1 (en) * 2001-03-22 2002-10-17 Intec Holding Gmbh Process for the production of a contactless multifunctional chip card as well as the chip card produced accordingly
US9219708B2 (en) 2001-03-22 2015-12-22 DialwareInc. Method and system for remotely authenticating identification devices
AU2002249532A1 (en) * 2001-03-22 2002-10-08 Beepcard Inc. Manufacture of self-powered identification devices
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
KR100910769B1 (en) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 IC card and manufacturing method thereof
FR2847365B1 (en) * 2002-11-15 2005-03-11 Gemplus Card Int SIMULTANEOUS CONNECTION / CONNECTION BY INHIBITING ADHESIVE DRILLING
JP2004185208A (en) * 2002-12-02 2004-07-02 Sony Corp Ic card
DE10257111B4 (en) * 2002-12-05 2005-12-22 Mühlbauer Ag Chip card and method for producing a chip card
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
JP4479209B2 (en) * 2003-10-10 2010-06-09 パナソニック株式会社 Electronic circuit device, method for manufacturing the same, and apparatus for manufacturing electronic circuit device
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7452748B1 (en) 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
AU2006265765B2 (en) * 2005-07-04 2009-08-27 Griffith University Fabrication of electronic components in plastic
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
EP2001077A1 (en) * 2007-05-21 2008-12-10 Gemplus Method of manufacturing a device comprising a transponder antenna connected to connecting pads and device obtained
EP2034429A1 (en) * 2007-09-05 2009-03-11 Assa Abloy AB Manufacturing method for a card and card obtained by said method
DE102007050102A1 (en) * 2007-10-16 2009-04-23 Smartrac Ip B.V. Method for producing a transmission module and transmission module
US20120256004A1 (en) * 2011-04-07 2012-10-11 Redbud Systems, LLC Selectively enabled rfid tag
DE102011115315A1 (en) * 2011-09-29 2013-04-04 Infineon Technologies Ag Chip card module for a chip card
US9516749B2 (en) * 2012-07-04 2016-12-06 Panasonic Intellectual Property Management Co., Ltd. Electronic component-mounted structure, IC card and COF package
US10622700B2 (en) * 2016-05-18 2020-04-14 X-Celeprint Limited Antenna with micro-transfer-printed circuit element
FR3058545B1 (en) * 2016-11-04 2018-10-26 Smart Packaging Solutions METHOD FOR MANUFACTURING AN ELECTRONIC MODULE FOR A CHIP CARD
CN109409486B (en) * 2018-10-31 2020-01-31 江苏恒宝智能系统技术有限公司 smart cards and processing method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH074995B2 (en) * 1986-05-20 1995-01-25 株式会社東芝 IC card and method of manufacturing the same
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
FR2716281B1 (en) * 1994-02-14 1996-05-03 Gemplus Card Int Method of manufacturing a contactless card.
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US5826328A (en) * 1996-03-25 1998-10-27 International Business Machines Method of making a thin radio frequency transponder
AU3944597A (en) * 1996-08-02 1998-02-25 Solaic Integrated circuit card with two connection modes
FR2756955B1 (en) * 1996-12-11 1999-01-08 Schlumberger Ind Sa METHOD FOR PRODUCING AN ELECTRONIC CIRCUIT FOR A CONTACTLESS MEMORY CARD
FR2769441A1 (en) * 1997-10-07 1999-04-09 Philips Electronics Nv CONTACTLESS ELECTRONIC CARD AND MANUFACTURING METHOD THEREOF
FR2769389B1 (en) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De MICROCIRCUIT CARD COMBINING EXTERIOR CONTACT RANGES AND AN ANTENNA, AND METHOD FOR MANUFACTURING SUCH A CARD
FR2778308B1 (en) * 1998-04-30 2006-05-26 Schlumberger Systems & Service METHOD FOR PRODUCING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
FR2780551B1 (en) * 1998-06-29 2001-09-07 Inside Technologies INTEGRATED ELECTRONIC MICROMODULE AND METHOD FOR MANUFACTURING SUCH A MICROMODULE
FR2781298B1 (en) * 1998-07-20 2003-01-31 St Microelectronics Sa METHOD FOR MANUFACTURING AN ELECTRONIC CHIP CARD AND ELECTRONIC CHIP CARD
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2801707B1 (en) * 1999-11-29 2002-02-15 A S K METHOD FOR MANUFACTURING A CONTACT-FREE CONTACT HYBRID CHIP CARD WITH AN ANTENNA SUPPORT OF FIBROUS MATERIAL

Also Published As

Publication number Publication date
FR2790849A1 (en) 2000-09-15
DE60003167D1 (en) 2003-07-10
EP1163637B1 (en) 2003-06-04
FR2790849B1 (en) 2001-04-27
US6677186B1 (en) 2004-01-13
CN1343340A (en) 2002-04-03
WO2000055808A1 (en) 2000-09-21
DE60003167T2 (en) 2004-05-06
EP1163637A1 (en) 2001-12-19
ATE242518T1 (en) 2003-06-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase