AU3003501A - Soldering unit and use of a solder conveyor pump comprising conveyor worm in asoldering unit - Google Patents

Soldering unit and use of a solder conveyor pump comprising conveyor worm in asoldering unit

Info

Publication number
AU3003501A
AU3003501A AU30035/01A AU3003501A AU3003501A AU 3003501 A AU3003501 A AU 3003501A AU 30035/01 A AU30035/01 A AU 30035/01A AU 3003501 A AU3003501 A AU 3003501A AU 3003501 A AU3003501 A AU 3003501A
Authority
AU
Australia
Prior art keywords
unit
conveyor
asoldering
solder
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU30035/01A
Inventor
Siegfried Ott
Stefan Schubert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LTC LASERDIENSTLEISTUNGEN GmbH
Original Assignee
LTC SALES EUROP GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LTC SALES EUROP GmbH filed Critical LTC SALES EUROP GmbH
Publication of AU3003501A publication Critical patent/AU3003501A/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
AU30035/01A 1999-11-05 2000-11-06 Soldering unit and use of a solder conveyor pump comprising conveyor worm in asoldering unit Abandoned AU3003501A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19953316 1999-11-05
DE19953316A DE19953316A1 (en) 1999-11-05 1999-11-05 Soldering system and use of a solder feed pump with screw conveyor in a soldering system
PCT/EP2000/010944 WO2001033923A2 (en) 1999-11-05 2000-11-06 Soldering unit and use of a solder conveyor pump comprising a conveyor worm in a soldering unit

Publications (1)

Publication Number Publication Date
AU3003501A true AU3003501A (en) 2001-05-14

Family

ID=7928044

Family Applications (1)

Application Number Title Priority Date Filing Date
AU30035/01A Abandoned AU3003501A (en) 1999-11-05 2000-11-06 Soldering unit and use of a solder conveyor pump comprising conveyor worm in asoldering unit

Country Status (3)

Country Link
AU (1) AU3003501A (en)
DE (2) DE19953316A1 (en)
WO (1) WO2001033923A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE468194T1 (en) 2003-10-10 2010-06-15 Senju Metal Industry Co BEAM SOLDER CONTAINER
US7631796B2 (en) * 2007-12-04 2009-12-15 Sony Corporation Selective soldering system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0159425B1 (en) * 1984-04-17 1988-06-15 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
DE3441687C2 (en) * 1984-11-15 1986-10-02 Kirsten Kabeltechnik AG, Welschenrohr Wave soldering device
EP0212911B1 (en) * 1985-08-09 1991-07-31 Dolphin Machinery Limited Soldering apparatus
DE9317139U1 (en) * 1993-04-30 1994-03-10 Hohnerlein, Andreas, 97892 Kreuzwertheim Soldering device

Also Published As

Publication number Publication date
WO2001033923A3 (en) 2001-09-20
WO2001033923A2 (en) 2001-05-10
DE10083462D2 (en) 2002-10-24
DE19953316A1 (en) 2001-05-10

Similar Documents

Publication Publication Date Title
GB2346380B (en) Lead-free solder and soldered article
AU2622201A (en) Compact reflow and cleaning apparatus
AU1504699A (en) Pb-free solder-connected structure and electronic device
AU2996800A (en) Compact reflow and cleaning apparatus
GB2353749B (en) Reflow soldering apparatus and reflow soldering method
GB2383552B (en) Process for soldering and connecting structure
EP1196015A4 (en) Method for soldering and soldered joint
EP1332831A4 (en) Alloy for solder and solder joint
AU2112201A (en) Quote/order processing in electronic market system
AU2121200A (en) Improvements in or relating to sphygmomanometers and other devices
EP1495830A4 (en) Solder alloy and soldered joint
SG68047A1 (en) Solder material and electronic part using the same
IL133451A0 (en) Programmable convolver
EP1557235A4 (en) Lead-free solder and soldered article
GB2340674A8 (en) Simultaneous crimping and ultrasonic soldering
AU3003501A (en) Soldering unit and use of a solder conveyor pump comprising conveyor worm in asoldering unit
IL131863A0 (en) Intravascular device and method using it
EP1226836A4 (en) Suction connector and suction catheter using the connector
EP1212604A4 (en) Displacing volume in field of view
GB2328097B (en) Chip-type piezoelectric filter and filter circuit using such piezoelectric filter
GB2345453B (en) Laminated reflow soldering
TW536003U (en) Electronic apparatus and connector used therein
GB2346383B (en) Lead-free solder and soldered article
GB2383551B (en) Process for soldering and connecting structure
EP1169550A4 (en) Pump assembly and related components

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase