AU2508200A - Carbon/carbon cooling system - Google Patents
Carbon/carbon cooling systemInfo
- Publication number
- AU2508200A AU2508200A AU25082/00A AU2508200A AU2508200A AU 2508200 A AU2508200 A AU 2508200A AU 25082/00 A AU25082/00 A AU 25082/00A AU 2508200 A AU2508200 A AU 2508200A AU 2508200 A AU2508200 A AU 2508200A
- Authority
- AU
- Australia
- Prior art keywords
- carbon
- cooling system
- carbon cooling
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/71—Ceramic products containing macroscopic reinforcing agents
- C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
- C04B35/80—Fibres, filaments, whiskers, platelets, or the like
- C04B35/83—Carbon fibres in a carbon matrix
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23339299A | 1999-01-19 | 1999-01-19 | |
US09233392 | 1999-01-19 | ||
PCT/US2000/001058 WO2000044212A1 (en) | 1999-01-19 | 2000-01-18 | Carbon/carbon cooling system |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2508200A true AU2508200A (en) | 2000-08-07 |
Family
ID=22877058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU25082/00A Abandoned AU2508200A (en) | 1999-01-19 | 2000-01-18 | Carbon/carbon cooling system |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2508200A (en) |
WO (1) | WO2000044212A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6469381B1 (en) | 2000-09-29 | 2002-10-22 | Intel Corporation | Carbon-carbon and/or metal-carbon fiber composite heat spreader |
US8945749B2 (en) * | 2011-12-15 | 2015-02-03 | GM Global Technology Operations LLC | Carbon fiber thermal interface for cooling module assembly |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5418063A (en) * | 1989-01-18 | 1995-05-23 | Loral Vought Systems Corporation | Carbon-carbon composite and method of making |
US5077637A (en) * | 1989-09-25 | 1991-12-31 | The Charles Stark Draper Lab., Inc. | Solid state directional thermal cable |
US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
US5566752A (en) * | 1994-10-20 | 1996-10-22 | Lockheed Fort Worth Company | High heat density transfer device |
EP0891530B1 (en) * | 1996-04-12 | 2001-11-21 | Honeywell International Inc. | Manufacturing method for a carbon/carbon heat exchanger |
-
2000
- 2000-01-18 WO PCT/US2000/001058 patent/WO2000044212A1/en active Application Filing
- 2000-01-18 AU AU25082/00A patent/AU2508200A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2000044212A1 (en) | 2000-07-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |