AU2501501A - Method for producing a support element for an integrated circuit (ic) component - Google Patents

Method for producing a support element for an integrated circuit (ic) component

Info

Publication number
AU2501501A
AU2501501A AU25015/01A AU2501501A AU2501501A AU 2501501 A AU2501501 A AU 2501501A AU 25015/01 A AU25015/01 A AU 25015/01A AU 2501501 A AU2501501 A AU 2501501A AU 2501501 A AU2501501 A AU 2501501A
Authority
AU
Australia
Prior art keywords
electrically conductive
support element
conductive layer
coated
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU25015/01A
Inventor
Rudiger Mentzer
Carsten Senge
Mathias Staudt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia Germany GmbH
Original Assignee
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme GmbH filed Critical Orga Kartensysteme GmbH
Publication of AU2501501A publication Critical patent/AU2501501A/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

The invention relates to a method for producing a support element for an integrated circuit component which is to be included in a data carrier card. According to said method, conductor strips which have contact surfaces on both respective flat sides of the support element are etched out of a conductive layer. One side of said contact surface is connected to a respective connecting contact of the IC component and the other side serves as an external contact. The external contact surfaces and their corresponding conductor strips are coated with an additional electrically conductive protective layer. During a first step of the method, the electrically conductive layer (1) is coated with a liquid or pasty curable coating material (2) on one flat side on the contact surface points (2b) which have been provided in order to make the connecting contact. The remaining uncoated surface regions (3a, 3b, 3c) of said flat side are then coated with a liquid or pasty curable non-conductive material (3). In subsequent steps of the method, the conductor strips (7) and contact surfaces are etched out of electrically conductive layer (1) and are coated with the additional electrically conductive protective layer (5). In the final step of the method, the coating material (2) which has been applied only to one side is removed. The inventive method produces a support element which lacks the conventional support film usually used for the electrically conductive layer. This leads to a reduction in the height of the unit formed by the IC component and support element, despite a slightly thicker electrically conductive layer achieved by a corresponding material composition of the copper foil which is preferably used.
AU25015/01A 1999-11-18 2000-11-10 Method for producing a support element for an integrated circuit (ic) component Abandoned AU2501501A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19955537 1999-11-18
DE19955537A DE19955537B4 (en) 1999-11-18 1999-11-18 Method for producing a carrier element for an IC module
PCT/DE2000/003930 WO2001037621A2 (en) 1999-11-18 2000-11-10 Method for producing a support element for an integrated circuit (ic) component

Publications (1)

Publication Number Publication Date
AU2501501A true AU2501501A (en) 2001-05-30

Family

ID=7929508

Family Applications (1)

Application Number Title Priority Date Filing Date
AU25015/01A Abandoned AU2501501A (en) 1999-11-18 2000-11-10 Method for producing a support element for an integrated circuit (ic) component

Country Status (5)

Country Link
EP (1) EP1230679B1 (en)
AT (1) ATE300099T1 (en)
AU (1) AU2501501A (en)
DE (2) DE19955537B4 (en)
WO (1) WO2001037621A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008024823A1 (en) * 2008-05-23 2009-12-10 Smartrac Ip B.V. Chip card with a plurality of components

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139348A (en) * 1985-12-12 1987-06-23 Furukawa Electric Co Ltd:The Lead frame for electronic part
US5200362A (en) * 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
KR100229637B1 (en) * 1991-03-12 1999-11-15 엔다 나오또 Method of manufacturing two-layer tab tape
KR0152901B1 (en) * 1993-06-23 1998-10-01 문정환 Plastic package and method for manufacture thereof
DE19502157B4 (en) * 1995-01-25 2011-07-21 Sagem Orga GmbH, 33106 Carrier element for an IC module for installation in smart cards
DE19532755C1 (en) * 1995-09-05 1997-02-20 Siemens Ag Chip module for chip card used as telephone or identification card
DE19536278A1 (en) * 1995-09-28 1997-04-03 Ods Gmbh & Co Kg Carrier element for integrated circuit element of e.g. chip card
DE19632113C1 (en) * 1996-08-08 1998-02-19 Siemens Ag Chip card, method for producing a chip card and semiconductor chip for use in a chip card
US5877042A (en) * 1996-08-28 1999-03-02 Motorola, Inc. Glass/Metal package and method for producing the same
DE19708617C2 (en) * 1997-03-03 1999-02-04 Siemens Ag Chip card module and method for its production as well as this comprehensive chip card
DE19745648A1 (en) * 1997-10-15 1998-11-26 Siemens Ag Carrier element for contactless semiconductor chip-card

Also Published As

Publication number Publication date
EP1230679A2 (en) 2002-08-14
DE19955537A1 (en) 2001-05-31
WO2001037621A2 (en) 2001-05-25
DE50010777D1 (en) 2005-08-25
DE19955537B4 (en) 2006-04-13
ATE300099T1 (en) 2005-08-15
EP1230679B1 (en) 2005-07-20
WO2001037621A3 (en) 2002-02-07

Similar Documents

Publication Publication Date Title
EP1335422A3 (en) Chip sized semiconductor device and a process for making it
AU2001266944A1 (en) Electronic package having embedded capacitors and method of fabrication therefor
EP1014399A3 (en) Flexible thin film capacitor and method for producing the same
WO1999057342A8 (en) Method and device for plating substrate
EP1377141A3 (en) Printed circuit board, method for producing same and semiconductor device
EP0895447A3 (en) A circuit board, a method for manufacturing same, and a method of electroless plating
WO2000004584A3 (en) Semiconductor component in a chip format and method for the production thereof
NZ334001A (en) Making a transponder coil utilising a superficial film covering during stamping
WO2004077548A3 (en) Connection technology for power semiconductors
US20070029204A1 (en) Manufacturing process of emboss type flexible or rigid printed circuit board
WO1999060189A3 (en) Method for metal coating of substrates
MY110786A (en) Method for producing a printed circuit board and a printed circuit board
WO2003058677A3 (en) System for the production of electric and integrated circuits
US20040172820A1 (en) Multi-Milling Method for the Production of Printed Circuits and the Printed Circuits Thus Obtained
US4512854A (en) Method of electroplating printed circuits
EP1102523A4 (en) Printed-circuit board and method of manufacture thereof
CA2364448A1 (en) Electronic tag assembly and method therefor
AU2966399A (en) Electric conductor with a surface structure in the form of flanges and etched grooves
WO2001017011A3 (en) Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card
AU2501501A (en) Method for producing a support element for an integrated circuit (ic) component
TW352450B (en) Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound and process of assemblage thereof
EP0891127A3 (en) TAB circuit protective coating
KR970073240A (en) Insulating coating material, a printed circuit board having a coating film of the same coating material, and a method of prevention a fall of the insulation and a method of recovery a insulation using of the same coating material)
WO2001016876A3 (en) Chip card and a method for producing a chip card
EP1425949A2 (en) Printed circuit board

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase